Xilinx XCZU19EG-2FFVC1760I5245

包装/外壳

FBGA-1760

Core

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

Data RAM Size

256 kB

Distributed RAM

9.8 Mb

Factory Pack QuantityFactory Pack Quantity

1

L1 Cache Data Memory

2 x 32 kB, 4 x 32 kB

L1 Cache Instruction Memory

2 x 32 kB, 4 x 32 kB

Maximum Operating Temperature

+ 100 C

Minimum Operating Temperature

- 40 C

Mounting Styles

SMD/SMT

Number of I/Os

560 I/O

Number of Logic Array Blocks - LABs

65340 LAB

Number of Logic Elements

1143450 LE

工作电源电压

850 mV

收发器数量

72 Transceiver

核数量

7 Core