XKB Connectivity X2564WV-12-N0SN

触点镀层

Tin

Production Status

活跃

MPQ

1000 piece/bag

Mounting

Through-hole Mount

Operation

Vertical

Jack Structure

1x12

Number of Pins/Row

12

Package specification

DIP,P=2.5mm

Soldering Temperature

235℃ Max.

Reference Series

MX 5264

Contact Materials

Brass

With latch

无

Mating type

X2564H-12-N0,X2564T-PSN

系列

Pair board 2.5-X2564

包装

Bag

操作温度

-40℃~ +125℃

连接器类型

内螺纹插座

颜色

Ivory

Number of rows

Single row

螺距

2.5mm

产品类别

Wire-to-Board Connector

Rated current

3A

行业标准

UL/CUL-E523734