XKB Connectivity X5701WV-02-LPSW

触点镀层

Tin

Production Status

活跃

MPQ

500 piece/bag

Mounting

Through-hole Mount

Operation

Vertical

Additional Description

Line to board/line to line connector

Jack Structure

1x02

Number of Pins/Row

2

Package specification

DIP,P=5.7mm

Reference Series

MX 5.7

Contact Materials

高导电性黄铜

With latch

有

Mating type

X5701H-02-N0,X5701T-BSN,X5701T-BSN-H,X5701T-BSN-M

Pin structure

1x2

Package form

DIP

系列

Wire to board 5.7-X5701

包装

Bag

连接器类型

内螺纹插座

颜色

Black

Number of rows

Single row

螺距

5.7mm

产品类别

Wire-to-Board Connector

Rated current

23A

行业标准

UL/CUL-E523734