XKB Connectivity X9635TF-BSN-U

触点镀层

Tin

Production Status

活跃

MPQ

4000 pieces/reel

Mounting

Wiring

Incremental Quantity

6000

Package specification

P=6.35mm

Soldering Temperature

260℃ Max.

Reference Series

AMP2.1

Contact Materials

Brass

With latch

有

系列

Wire to board 6.35-X9635

包装

Reel

操作温度

-55℃~ +125℃

连接器类型

母端子

螺距

6.35mm

产品类别

Wire-to-Board Connector

Rated current

15A

行业标准

UL/CUL-E523734