类别是'category.微处理器' (10000)

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库存

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数量

Rohs

工厂交货时间

生命周期状态

触点镀层

底架

包装/外壳

表面安装

引脚数

供应商器件包装

质量

操作温度

包装

已出版

系列

JESD-609代码

无铅代码

零件状态

湿度敏感性等级(MSL)

终止次数

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

电源电压

端子间距

频率

时间@峰值回流温度-最大值(s)

基本部件号

引脚数量

JESD-30代码

资历状况

工作电源电压

电源电压-最大值(Vsup)

电源

电源电压-最小值(Vsup)

电压

界面

最大电源电压

最小电源电压

内存大小

振荡器类型

速度

内存大小

uPs/uCs/外围ICs类型

比特数

核心处理器

周边设备

时钟频率

电源电流-最大值

位元大小

有ADC

DMA 通道

数据总线宽度

脉宽调制通道

数模转换器通道

定时器/计数器的数量

地址总线宽度

核心架构

处理器系列

最高频率

边界扫描

低功率模式

外部数据总线宽度

可编程I/O数

格式

集成缓存

内存(字)

电压 - I/O

UART 通道数

以太网

核数/总线宽度

图形加速

内存控制器

USB

附加接口

串行I/O数

协处理器/DSP

核数量

总线兼容性

桶式移位器

内部总线架构

保安功能

显示和界面控制器

DMA通道数

萨塔

高度

座位高度(最大)

长度

宽度

器件厚度

辐射硬化

达到SVHC

RoHS状态

无铅

P1011NSE2HFB
P1011NSE2HFB
NXP USA Inc. 数据表

594 In Stock

-

最小起订量: 1

最小包装量: 1

12 Weeks

689-BBGA Exposed Pad

YES

0°C~125°C TA

Tray

2002

QorIQ P1

e2

活跃

3 (168 Hours)

689

5A002.A.1

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1V

1mm

40

P1011

S-PBGA-B689

1.05V

0.95V

800MHz

MICROPROCESSOR, RISC

PowerPC e500v2

100MHz

32

YES

YES

浮点

YES

10/100/1000Mbps (3)

1 Core 32-Bit

DDR2, DDR3

USB 2.0 + PHY (2)

DUART, I2C, MMC/SD, SPI

Security; SEC 3.3

Cryptography, Random Number Generator

2.46mm

31mm

ROHS3 Compliant

MCIMX6D4AVT08AD
MCIMX6D4AVT08AD
NXP USA Inc. 数据表

2863 In Stock

-

最小起订量: 1

最小包装量: 1

15 Weeks

624-FBGA, FCBGA

YES

-40°C~125°C TJ

Tray

2002

i.MX6D

e1

活跃

3 (168 Hours)

624

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

1.4V

0.8mm

40

S-PBGA-B624

1.5V

1.225V

852MHz

MICROPROCESSOR

ARM® Cortex®-A9

16

YES

YES

64

固定点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

2 Core 32-Bit

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

SATA 3Gbps (1)

2.16mm

21mm

ROHS3 Compliant

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999
Microchip Technology 数据表

349 In Stock

-

最小起订量: 1

最小包装量: 1

7 Weeks

Copper, Silver, Tin

表面贴装

217-LFBGA

217

217-LFBGA (15x15)

ROM, ROMless

96

Automotive grade

-40°C~85°C TA

Tape & Reel (TR)

1997

SAM9G

活跃

3 (168 Hours)

85°C

-40°C

400MHz

AT91SAM9G20

EBI/EMI, Ethernet, I2C, IrDA, SPI, UART, USART, USB

1.1V

900mV

64kB

Internal

400MHz

32kB

ARM926EJ-S

DMA, POR, PWM, WDT

32b

7

ARM

400MHz

96

1.8V 3.3V

10/100Mbps

1 Core 32-Bit

SDRAM, SRAM

USB 2.0 (2)

EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART

ROHS3 Compliant

MPC8245TZU266D
MPC8245TZU266D
NXP USA Inc. 数据表

2875 In Stock

-

最小起订量: 1

最小包装量: 1

12 Weeks

352-LBGA

YES

-40°C~105°C TA

Tray

1998

MPC82xx

e0

Obsolete

3 (168 Hours)

352

3A991.A.2

Tin/Lead/Silver (Sn/Pb/Ag)

8542.31.00.01

BOTTOM

BALL

220

1.8V

1.27mm

30

MPC8245

S-PBGA-B352

1.9V

23.3V

1.7V

266MHz

MICROPROCESSOR, RISC

PowerPC 603e

66MHz

32

32

YES

YES

32

浮点

YES

3.3V

1 Core 32-Bit

SDRAM

I2C, I2O, PCI, UART

1.65mm

35mm

Non-RoHS Compliant

AM3351BZCE60R
AM3351BZCE60R
Texas Instruments 数据表

17 In Stock

-

最小起订量: 1

最小包装量: 1

6 Weeks

ACTIVE (Last Updated: 5 days ago)

298-LFBGA

YES

298

0°C~90°C TJ

Tape & Reel (TR)

Sitara™

e1

yes

活跃

3 (168 Hours)

298

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

260

1.1V

0.65mm

未说明

AM3351

1.144V

1.056V

600MHz

MICROPROCESSOR, RISC

ARM® Cortex®-A8

26MHz

32

YES

YES

固定点

YES

131072

1.8V 3.3V

10/100/1000Mbps (1)

1 Core 32-Bit

LPDDR, DDR2, DDR3, DDR3L

USB 2.0 + PHY (1)

Multimedia; NEON™ SIMD

Cryptography, Random Number Generator

LCD, Touchscreen

64

1.3mm

13mm

13mm

890μm

ROHS3 Compliant

R7S721021VCFP#AA1
R7S721021VCFP#AA1
Renesas Electronics America 数据表

26 In Stock

-

最小起订量: 1

最小包装量: 1

20 Weeks

208-LQFP

YES

208

ROMless

100

3145728

0

-40°C~85°C TA

Tray

RZ/A1L

yes

活跃

3 (168 Hours)

208

QUAD

鸥翼

1.18V

0.5mm

400MHz

208

不合格

1.26V

1.183.3V

1.1V

CAN, EBI/EMI, Ethernet, I2C, LIN, SCI, SPI, UART, USART, USB

External

3MB

MICROCONTROLLER

ARM® Cortex®-A9

DMA, POR, PWM, WDT

492mA

32

YES

YES

YES

26

ARM

CORTEX-A9

32

1.2V 3.3V

10/100Mbps

1 Core 32-Bit

SDRAM, SRAM

USB 2.0 (2)

CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI

Multimedia; NEON™ MPE

VDC

28mm

ROHS3 Compliant

无铅

AM3517AZERC
AM3517AZERC
Texas Instruments 数据表

880 In Stock

-

最小起订量: 1

最小包装量: 1

6 Weeks

ACTIVE (Last Updated: 1 day ago)

Copper, Silver, Tin

484-BBGA Exposed Pad

YES

484

186

0°C~90°C TJ

Tray

Sitara™

e1

yes

活跃

3 (168 Hours)

484

5A992.C

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

260

1.2V

600MHz

AM3517

484

1.2V

1.248V

I2S, USB

1.248V

1.152V

64kB

MICROPROCESSOR, RISC

ARM® Cortex®-A8

16

16b

12

ARM

YES

YES

浮点

YES

65536

1.8V 3.3V

4

10/100Mbps (1)

1 Core 32-Bit

LPDDR, DDR2

USB 2.0 (3), USB 2.0 + PHY (1)

CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

Multimedia; NEON™ SIMD

1

Cryptography

LCD

2.48mm

23mm

23mm

1.78mm

无SVHC

ROHS3 Compliant

无铅

MPC8280ZUUPEA
MPC8280ZUUPEA
NXP USA Inc. 数据表

850 In Stock

-

最小起订量: 1

最小包装量: 1

18 Weeks

480-LBGA Exposed Pad

YES

0°C~105°C TA

Tray

1994

MPC82xx

e0

活跃

4 (72 Hours)

480

3A991.A.2

Tin/Lead/Silver (Sn/Pb/Ag)

8542.31.00.01

BOTTOM

BALL

260

1.5V

1.27mm

40

MPC8280

S-PBGA-B480

1.6V

1.53.3V

1.45V

450MHz

MICROPROCESSOR, RISC

PowerPC G2_LE

32

32

YES

YES

64

浮点

YES

3.3V

10/100Mbps (3)

1 Core 32-Bit

DRAM, SDRAM

USB 2.0 (1)

I2C, SCC, SMC, SPI, UART, USART

Communications; RISC CPM

1.65mm

37.5mm

Non-RoHS Compliant

LS1043ASE7QQB
LS1043ASE7QQB
NXP USA Inc. 数据表

65 In Stock

-

最小起订量: 1

最小包装量: 1

18 Weeks

621-FBGA, FCBGA

YES

0°C~105°C

Tray

2014

QorIQ® Layerscape

活跃

3 (168 Hours)

621

ALSO OPERATES AT 1V NOMINAL SUPPLY

BOTTOM

BALL

250

0.9V

0.8mm

30

S-PBGA-B621

0.93V

0.87V

1.6GHz

MICROPROCESSOR, RISC

ARM® Cortex®-A53

64

16

YES

YES

32

固定点

YES

1GbE (7) or 10GbE (1) & 1GbE (5)

4 Core 64-Bit

DDR3L, DDR4

USB 3.0 (3) + PHY

Secure Boot, TrustZone®

SATA 6Gbps (1)

2.07mm

21mm

ROHS3 Compliant

MCIMX357DVM5B
MCIMX357DVM5B
NXP USA Inc. 数据表

100000 In Stock

-

最小起订量: 1

最小包装量: 1

15 Weeks

400-LFBGA

YES

4

-20°C~70°C TA

Tray

2008

i.MX35

e1

活跃

3 (168 Hours)

400

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

0.8mm

40

MCIMX357

S-PBGA-B400

不合格

1.47V

1.33V

532MHz

多功能外围设备

ARM1136JF-S

24MHz

YES

128000

1.8V 2.0V 2.5V 2.7V 3.0V 3.3V

10/100Mbps (1)

1 Core 32-Bit

LPDDR, DDR2

USB 2.0 + PHY (2)

1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART

2

Multimedia; GPU, IPU, VFP

CAN; ETHERNET; I2C; IRDA; SPI; UART; USB

Secure Fusebox, Secure JTAG, Tamper Detection

Keypad, KPP, LCD

1.6mm

17mm

ROHS3 Compliant

MCIMX283CVM4BR2
MCIMX283CVM4BR2
NXP USA Inc. 数据表

1208 In Stock

-

最小起订量: 1

最小包装量: 1

15 Weeks

289-LFBGA

YES

-40°C~85°C TA

Tape & Reel (TR)

2002

i.MX28

e1

活跃

3 (168 Hours)

289

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

0.8mm

40

MCIMX283

S-PBGA-B289

1.55V

1.41.8V

1.35V

454MHz

MICROPROCESSOR, RISC

ARM926EJ-S

24MHz

32

YES

YES

固定点

YES

1.8V 3.3V

10/100Mbps (1)

1 Core 32-Bit

LVDDR, LVDDR2, DDR2

USB 2.0 + PHY (2)

I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART

Data; DCP

Boot Security, Cryptography, Hardware ID

Keypad, LCD, Touchscreen

1.37mm

14mm

ROHS3 Compliant

MCIMX6X3EVN10AB
MCIMX6X3EVN10AB
NXP USA Inc. 数据表

9 In Stock

-

最小起订量: 1

最小包装量: 1

15 Weeks

400-LFBGA

YES

179

-20°C~105°C TJ

Tray

2002

i.MX6SX

e1

活跃

3 (168 Hours)

400

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

0.8mm

S-PBGA-B400

1.5V

1.35V

227MHz, 1GHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9, ARM® Cortex®-M4

1000MHz

15

YES

32

1.8V 2.5V 2.8V 3.15V

10/100/1000Mbps (2)

2 Core 32-Bit

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)

AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART

6

Multimedia; NEON™ MPE

CAN, ETHERNET, I2C, I2S, PCI, SPI, UART, USB

A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE

Keypad, LCD

1.53mm

17mm

ROHS3 Compliant

MPC8321VRADDCA
MPC8321VRADDCA
NXP USA Inc. 数据表

10086 In Stock

-

最小起订量: 1

最小包装量: 1

12 Weeks

516-BBGA

YES

0°C~105°C TA

Tray

2002

MPC83xx

e2

活跃

3 (168 Hours)

516

3A991.A.2

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1V

1mm

40

S-PBGA-B516

1.05V

0.95V

266MHz

MICROPROCESSOR, RISC

PowerPC e300c2

66.67MHz

32

YES

YES

浮点

YES

1.8V 2.5V 3.3V

10/100Mbps (3)

1 Core 32-Bit

DDR, DDR2

USB 2.0 (1)

DUART, I2C, PCI, SPI, TDM, UART

Communications; QUICC Engine

2.55mm

27mm

ROHS3 Compliant

MCIMX502CVM8B
MCIMX502CVM8B
NXP USA Inc. 数据表

23 In Stock

-

最小起订量: 1

最小包装量: 1

15 Weeks

400-LFBGA

YES

0°C~70°C TA

Tray

2008

i.MX50

e1

活跃

3 (168 Hours)

400

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

1.225V

0.8mm

40

MCIMX502

S-PBGA-B400

不合格

1.275V

1.175V

800MHz

微处理器电路

ARM® Cortex®-A8

800MHz

YES

131072

1.2V 1.875V 2.775V 3.0V

10/100Mbps (1)

1 Core 32-Bit

LPDDR, LPDDR2, DDR2

USB 2.0 + PHY (2)

1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART

Multimedia; NEON™ SIMD

Boot Security, Cryptography, Secure JTAG

LCD

1.6mm

17mm

ROHS3 Compliant

MPC852TCVR80A
MPC852TCVR80A
NXP USA Inc. 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

256-BBGA

YES

-40°C~100°C TA

Tray

1999

MPC8xx

e1

Obsolete

3 (168 Hours)

256

3A991.A.2

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

245

1.8V

1.27mm

30

MPC852

S-PBGA-B256

1.9V

1.83.3V

1.7V

80MHz

MICROPROCESSOR, RISC

66MHz

32

32

YES

YES

32

固定点

YES

3.3V

10Mbps (1)

1 Core 32-Bit

DRAM

HDLC/SDLC, PCMCIA, SPI, UART

Communications; CPM

2.54mm

23mm

ROHS3 Compliant

MCIMX6V7DVN10AB
MCIMX6V7DVN10AB
NXP USA Inc. 数据表

12000 In Stock

-

最小起订量: 1

最小包装量: 1

12 Weeks

432-TFBGA

0°C~95°C TJ

Tray

2002

i.MX6SLL

活跃

3 (168 Hours)

260

40

1GHz

ARM® Cortex®-A9

1.2V 1.8V 2.5V 3.3V

1 Core 32-Bit

LPDDR2, LPDDR3

USB 2.0 OTG + PHY (2)

Multimedia; NEON™ SIMD

A-HAB, ARM TZ, CSU, SJC, SNVS

EPDC, LCD

ROHS3 Compliant

OMAPL132EZWT2
OMAPL132EZWT2
Texas Instruments 数据表

5 In Stock

-

最小起订量: 1

最小包装量: 1

6 Weeks

ACTIVE (Last Updated: 1 week ago)

361-LFBGA

YES

361

0°C~90°C TJ

Tray

OMAP-L1x

e1

yes

活跃

3 (168 Hours)

361

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

260

1.2V

0.8mm

200MHz

OMAPL132

361

微处理器电路

ARM926EJ-S

ARM

1.8V 3.3V

3

10/100Mbps (1)

1 Core 32-Bit

LPDDR, DDR2

USB 2.0 + PHY (1)

AC97, I2C, I2S, McASP, McBSP, MMC/SD/SDIO, SPI, UART

Signal Processing; C674x, System Control; CP15

1

1.4mm

16mm

16mm

900μm

ROHS3 Compliant

无铅

MCIMX6D7CVT08AC
MCIMX6D7CVT08AC
NXP USA Inc. 数据表

3 In Stock

-

最小起订量: 1

最小包装量: 1

624-FBGA, FCBGA

YES

-40°C~105°C TA

Tray

2002

i.MX6D

e1

不用于新设计

3 (168 Hours)

624

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

0.8mm

40

MCIMX6

S-PBGA-B624

1.5V

1.275V

800MHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9

24MHz

64

16

YES

YES

64

固定点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

2 Core 32-Bit

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

SATA 3Gbps (1)

2.16mm

21mm

ROHS3 Compliant

MC68EN360AI25VL
MC68EN360AI25VL
NXP USA Inc. 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

240-BFQFP

YES

46

0°C~70°C TA

Tray

1995

M683xx

e3

不用于新设计

3 (168 Hours)

240

3A991.A.2

Matte Tin (Sn)

8542.31.00.01

QUAD

鸥翼

260

5V

0.5mm

40

MC68EN360

S-PQFP-G240

5.25V

4.75V

25MHz

MICROCONTROLLER, RISC

CPU32+

6MHz

32

NO

YES

NO

NO

32

32

3.3V

10Mbps (1)

1 Core 32-Bit

DRAM

SCC, SMC, SPI

Communications; CPM

4.15mm

31.305mm

ROHS3 Compliant

LS1021ASN7KQB
LS1021ASN7KQB
NXP USA Inc. 数据表

5000 In Stock

-

最小起订量: 1

最小包装量: 1

18 Weeks

525-FBGA, FCBGA

YES

0°C~105°C

Tray

2002

QorIQ® Layerscape

活跃

3 (168 Hours)

525

3A991.A.1

8542.31.00.01

BOTTOM

BALL

260

1V

0.8mm

40

S-PBGA-B525

1.03V

0.97V

1.0GHz

微处理器电路

ARM® Cortex®-A7

GbE (3)

2 Core 32-Bit

DDR3L, DDR4

USB 3.0 (1) + PHY

Secure Boot, TrustZone®

2D-ACE

SATA 6Gbps (1)

2.07mm

19mm

ROHS3 Compliant

MPC8343VRAGDB
MPC8343VRAGDB
NXP USA Inc. 数据表

2684 In Stock

-

最小起订量: 1

最小包装量: 1

12 Weeks

620-BBGA Exposed Pad

YES

0°C~105°C TA

Tray

2002

MPC83xx

e2

活跃

3 (168 Hours)

620

3A991.A.2

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1.2V

1mm

40

MPC8343

S-PBGA-B620

1.26V

1.22.53.3V

1.14V

400MHz

MICROPROCESSOR

PowerPC e300

66MHz

32

32

YES

YES

32

浮点

YES

1.8V 2.5V 3.3V

10/100/1000Mbps (3)

1 Core 32-Bit

DDR, DDR2

USB 2.0 + PHY (2)

DUART, I2C, PCI, SPI

2.46mm

29mm

ROHS3 Compliant

OMAPL138BZWT3
OMAPL138BZWT3
Texas Instruments 数据表

24 In Stock

-

最小起订量: 1

最小包装量: 1

Copper, Silver, Tin

表面贴装

361-LFBGA

361

0°C~90°C TJ

Tray

OMAP-L1x

e1

yes

Obsolete

3 (168 Hours)

361

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

260

1V

0.8mm

375MHz

OMAPL138

361

1.3V

1.35V

I2C, SPI, UART

1.35V

64kB

DIGITAL SIGNAL PROCESSOR, OTHER

32

ARM926EJ-S

16b

ARM

YES

YES

浮点

1.8V 3.3V

3

10/100Mbps (1)

1 Core 32-Bit

SDRAM

USB 1.1 + PHY (1), USB 2.0 + PHY (1)

HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART

Signal Processing; C674x, System Control; CP15

NO

MULTIPLE

Boot Security, Cryptography

LCD

SATA 3Gbps (1)

1.4mm

16mm

无SVHC

ROHS3 Compliant

无铅

AM1806EZWT3
AM1806EZWT3
Texas Instruments 数据表

214 In Stock

-

最小起订量: 1

最小包装量: 1

6 Weeks

ACTIVE (Last Updated: 1 week ago)

Copper, Silver, Tin

表面贴装

361-LFBGA

361

789.392471mg

L1 Cache, RAM, ROM

0°C~90°C TJ

Tray

Sitara™

e1

yes

活跃

3 (168 Hours)

361

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

260

1.2V

0.8mm

375MHz

AM1806

1.2V

Ethernet, I2C, SPI, UART, USB

64kB

128kB

MICROPROCESSOR, RISC

ARM926EJ-S

32

32b

ARM

YES

YES

固定点

YES

1.8V 3.3V

3

1 Core 32-Bit

LPDDR, DDR2

USB 2.0 + PHY (1)

I2C, McASP, McBSP, SPI, MMC/SD, UART

System Control; CP15

1

LCD

1.4mm

16mm

16mm

900μm

ROHS3 Compliant

无铅

AM5718AABCXQ1
AM5718AABCXQ1
Texas Instruments 数据表

2000 In Stock

-

最小起订量: 1

最小包装量: 1

8 Weeks

ACTIVE (Last Updated: 3 days ago)

760-BFBGA, FCBGA

YES

760

Automotive grade

-40°C~125°C TJ

Sitara™

e1

yes

活跃

3 (168 Hours)

760

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

1.15V

0.8mm

AM5718

1.2V

1.11V

1.5GHz

MICROPROCESSOR, RISC

ARM® Cortex®-A15

38.4MHz

YES

YES

固定点

NO

524288

1.8V 3.3V

10

10/100/1000Mbps (1)

1 Core 32-Bit

DDR3, SRAM

USB 2.0 (1), USB 3.0 (1)

CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART

Multimedia; GPU, IPU, VFP

HDMI, LCD

SATA 3Gbps (1)

2.96mm

23mm

23mm

2.39mm

ROHS3 Compliant

ATSAMA5D35A-CN
ATSAMA5D35A-CN
Microchip Technology 数据表

136 In Stock

-

最小起订量: 1

最小包装量: 1

10 Weeks

324-LFBGA

324

L1 Cache, ROM, SRAM

160

-40°C~105°C TA

Tray

2015

SAMA5D3

yes

活跃

3 (168 Hours)

536MHz

ATSAMA5D35

1.2V

2-Wire, CAN, EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB

1.32V

1.08V

160kB

Internal

128kB

ARM® Cortex®-A5

DMA, POR, PWM, WDT

32b

2

ARM

1.2V 1.8V 3.3V

10/100/1000Mbps (1)

1 Core 32-Bit

LPDDR, LPDDR2, DDR2

USB 2.0 (3)

CAN, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART

1

AES, SHA, TDES, TRNG

Touchscreen

ROHS3 Compliant