类别是'category.微处理器' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | Date Of Intro | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 速度 | uPs/uCs/外围ICs类型 | 核心处理器 | 电源电流-最大值 | 位元大小 | 座位高度-最大 | 地址总线宽度 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 电压 - I/O | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 协处理器/DSP | 保安功能 | 显示和界面控制器 | DMA通道数 | 长度 | 宽度 | |||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | P5021PSE72QC | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1295 | 活跃 | NXP SEMICONDUCTORS | BGA, | 105 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.23 V | 1.17 V | 1.2 V | 有 | e1 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1295 | OTHER | 2200 MHz | MICROPROCESSOR, RISC | 3.53 mm | 16 | YES | YES | 64 | 固定点 | YES | 37.5 mm | 37.5 mm | |||||||||||||||||||||||||||||||||||||
![]() | SC1201UFH-266F | Rochester Electronics LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 481 | 有 | 活跃 | ROCHESTER ELECTRONICS LLC | BGA | LEAD FREE, MS-034BAU1, TEPBGA-481 | 27 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 2.1 V | 1.71 V | 1.8 V | e2 | 无 | 锡银 | BOTTOM | BALL | 未说明 | 1.27 mm | unknown | 未说明 | 481 | S-PBGA-B481 | COMMERCIAL | 商业扩展 | 266 MHz | MICROPROCESSOR | 32 | 2.59 mm | 32 | YES | YES | 32 | 浮点 | YES | 40 mm | 40 mm | |||||||||||||||||||||||||||||
![]() | SC1201UFH-266F | AMD | 数据表 | 823 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 481 | 有 | Obsolete | ADVANCED MICRO DEVICES INC | BGA | TEPBGA-481 | 27 MHz | 3 | 85 °C | PLASTIC/EPOXY | HBGA | BGA481,31X31,50 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 2.1 V | 1.71 V | 1.8 V | e2 | 3A991.A.2 | 锡银 | SEATED HGT-NOM | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 481 | S-PBGA-B481 | 不合格 | 商业扩展 | 266 MHz | MICROPROCESSOR | 1090 mA | 32 | 2.59 mm | 32 | YES | YES | 32 | 浮点 | YES | 6 | 40 mm | 40 mm | |||||||||||||||||||||||||
![]() | APM883208-SNC24X1T | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT8370IV/KZA | MediaTek | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1204-VFBGA | 1204-VFBGA (15x15) | -40°C ~ 105°C (TJ) | Tape & Reel (TR);Cut Tape (CT);Digi-Reel® | 活跃 | 2GHz, 2.2GHz | ARM® Cortex®-A55, ARM® Cortex®-A78 | 1.2V, 1.8V | MII, RGMII, RMII | 4, 2 Core, 64-Bit | 有 | LPDDR4x | USB 2.0 (2), USB 3.1 (1) | I2C, I2S, MMC/SD/SDIO, PCM, SPI, UART | ARM® Mali-G57MC2 | AES | MIPI-CSI | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT8370AV/AZA | MediaTek | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1204-VFBGA | 1204-VFBGA (15x15) | -20°C ~ 95°C (TJ) | Tape & Reel (TR);Cut Tape (CT);Digi-Reel® | 活跃 | 2GHz, 2.2GHz | ARM® Cortex®-A55, ARM® Cortex®-A78 | 1.2V, 1.8V | MII, RGMII, RMII | 4, 2 Core, 64-Bit | 有 | LPDDR4x | USB 2.0 (2), USB 3.1 (1) | I2C, I2S, MMC/SD/SDIO, PCM, SPI, UART | ARM® Mali-G57MC2 | AES | MIPI-CSI | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | STM32MP257FAL3 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 361-VFBGA | 361-VFBGA (10x10) | -40°C ~ 125°C (TJ) | Tape & Reel (TR) | STM32MP2 | 活跃 | 1.5GHz | ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33 | 1.8V, 3.3V | 10/100/1000Mbps (3) | 2, 1, 1 Core, 32-Bit | 有 | DDR3L, DDR4, LPDDR4 | USB 2.0 (1), USB 3.0 (1), USB Type-C (1) | GPIO, DMA, CANbus, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART | GPU | ARM TZ, Boot Security, TRNG | LCD, LVDS, MIPI-CSI2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | STM32MP257DAK3 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 424-VFBGA | 424-VFBGA (14x14) | -40°C ~ 125°C (TJ) | Tray | STM32MP2 | 活跃 | 1.5GHz | ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33 | 1.8V, 3.3V | 10/100/1000Mbps (3) | 2, 1, 1 Core, 32-Bit | 有 | DDR3L, DDR4, LPDDR4 | USB 2.0 (1), USB 3.0 (1), USB Type-C (1) | GPIO, DMA, CANbus, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART | GPU | ARM TZ, Boot Security, TRNG | LCD, LVDS, MIPI-CSI2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TMPR4938XBG-333 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 有 | Obsolete | TOSHIBA CORP | BGA | BGA, BGA484,26X26,50 | 133.3 MHz | 70 °C | PLASTIC/EPOXY | BGA | BGA484,26X26,50 | SQUARE | 网格排列 | 1.6 V | 1.4 V | 1.5 V | 有 | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1.27 mm | unknown | 未说明 | 484 | S-PBGA-B484 | 不合格 | COMMERCIAL | 333 MHz | MICROPROCESSOR, RISC | 64 | 2.46 mm | 20 | YES | YES | 64 | 浮点 | YES | 35 mm | 35 mm | ||||||||||||||||||||||||||||
![]() | AV8062701147401 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1284 | 100 MHz | PLASTIC/EPOXY | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 1.52 V | 0.3 V | Obsolete | INTEL CORP | HBGA, | 5A992.C | 8542.31.00.01 | BOTTOM | BALL | 1.106 mm | compliant | S-PBGA-B1284 | 1500 MHz | MICROPROCESSOR | 64 | 16 | YES | YES | 64 | 固定点 | YES | 37.5 mm | 37.5 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | EM78P142SS10J | ELAN Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 接触制造商 | ELAN MICROELECTRONICS CORP | , | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EE80C188EA25 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | INTEL CORP | QCCJ, LDCC68,1.0SQ | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | 5 V | 有 | Obsolete | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J68 | 不合格 | COMMERCIAL | 25 MHz | MICROPROCESSOR, RISC | 105 mA | 16 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | PR31500ABC | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | QFP | QFP, QFP208,1.2SQ,20 | 70 °C | PLASTIC/EPOXY | QFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK | 3.3 V | Obsolete | NXP SEMICONDUCTORS | 8542.31.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | COMMERCIAL | 40 MHz | MICROPROCESSOR, RISC | 32 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | CM8071505092202 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC68HC001FC10 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | MOTOROLA SEMICONDUCTOR PRODUCTS | BQFP, SPQFP68,.7SQ | 70 °C | PLASTIC/EPOXY | BQFP | SPQFP68,.7SQ | SQUARE | FLATPACK | 5 V | 无 | Obsolete | e0 | Tin/Lead (Sn/Pb) | QUAD | 鸥翼 | 0.635 mm | unknown | S-PQFP-G68 | 不合格 | 5 V | COMMERCIAL | 10 MHz | MICROPROCESSOR, RISC | 30 mA | 32 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | UPD70433GJ-12-3EB | NEC Electronics Group | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 120 | FLATPACK | Obsolete | NEC ELECTRONICS CORP | QFP | , | PLASTIC/EPOXY | SQUARE | 8542.31.00.01 | QUAD | 鸥翼 | unknown | 120 | S-PQFP-G120 | 不合格 | MICROPROCESSOR | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | UPD8085AC-2 | NEC Electronics Group | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | FH8065503553200 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2018-07-27 | Obsolete | INTEL CORP | 8542.31.00.01 | compliant | MICROPROCESSOR | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC68322FT16 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 160 | 4.5 V | 5.5 V | FLATPACK | SQUARE | QFP | PLASTIC/EPOXY | 70 °C | 33.334 MHz | QFP, | QFP | FREESCALE SEMICONDUCTOR INC | Obsolete | 5 V | EAR99 | 8542.31.00.01 | QUAD | 鸥翼 | 0.65 mm | unknown | 160 | S-PQFP-G160 | 不合格 | COMMERCIAL | 16.667 MHz | MICROPROCESSOR, RISC | 16 | 3.85 mm | 26 | NO | NO | 16 | 固定点 | NO | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||
![]() | MC68322FT16 | Motorola Mobility LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 160 | 无 | Obsolete | MOTOROLA INC | QFP | QFP, QFP160,1.2SQ | 33.334 MHz | 5 V | 4.5 V | 5.5 V | FLATPACK | SQUARE | QFP160,1.2SQ | QFP | PLASTIC/EPOXY | 70 °C | e0 | 3A991.A.2 | 锡铅 | 8542.31.00.01 | QUAD | 鸥翼 | 0.65 mm | unknown | 160 | S-PQFP-G160 | 不合格 | COMMERCIAL | 16.667 MHz | MICROPROCESSOR, RISC | 32 | 3.85 mm | 25 | NO | NO | 16 | 固定点 | NO | 28 mm | 28 mm | ||||||||||||||||||||||||||||||
![]() | RCPXA270C0C416 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 356 | 无 | Transferred | INTEL CORP | BGA | VFBGA, BGA356,24X24,20 | 13.002 MHz | PLASTIC/EPOXY | VFBGA | BGA356,24X24,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.705 V | 1.2825 V | 1.35 V | e0 | 锡铅 | 8542.31.00.01 | BOTTOM | BALL | 0.5 mm | compliant | 356 | S-PBGA-B356 | 不合格 | 416 MHz | MICROPROCESSOR, RISC | 32 | 1 mm | 26 | YES | YES | 32 | 固定点 | YES | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||
![]() | CM8071504555317S RL4V | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SC1100UFH-233F | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 388 | 有 | Obsolete | ADVANCED MICRO DEVICES INC | BGA | HBGA, BGA388,26X26,50 | 27 MHz | 3 | 85 °C | PLASTIC/EPOXY | HBGA | BGA388,26X26,50 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 1.89 V | 1.71 V | 1.8 V | e2 | 3A991.A.2 | 锡银 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 388 | S-PBGA-B388 | 不合格 | OTHER | 233 MHz | MICROPROCESSOR | 32 | 2.59 mm | 13 | YES | YES | 64 | 浮点 | YES | 35 mm | 35 mm | ||||||||||||||||||||||||||||
![]() | MC6800CLD | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | MOTOROLA SEMICONDUCTOR PRODUCTS | DIP, DIP40,.6 | 85 °C | -40 °C | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | 无 | Obsolete | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | INDUSTRIAL | 1 MHz | MICROPROCESSOR, RISC | 8 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | OSA248FAA5BL | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 940 | PLASTIC/EPOXY | SPGA | PGA940,31X31,50 | SQUARE | GRID ARRAY, SHRINK PITCH | Obsolete | ADVANCED MICRO DEVICES INC | PGA | SPGA, PGA940,31X31,50 | 3A991.A.2 | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 1.27 mm | unknown | 940 | S-PPGA-P940 | 不合格 | 2200 MHz | MICROPROCESSOR, RISC | 64 |
P5021PSE72QC
NXP Semiconductors
分类:Embedded - Microprocessors
SC1201UFH-266F
Rochester Electronics LLC
分类:Embedded - Microprocessors
SC1201UFH-266F
AMD
分类:Embedded - Microprocessors
APM883208-SNC24X1T
Applied Micro Circuits Corporation
分类:Embedded - Microprocessors
MT8370IV/KZA
MediaTek
分类:Embedded - Microprocessors
MT8370AV/AZA
MediaTek
分类:Embedded - Microprocessors
STM32MP257FAL3
STMicroelectronics
分类:Embedded - Microprocessors
STM32MP257DAK3
STMicroelectronics
分类:Embedded - Microprocessors
TMPR4938XBG-333
Toshiba America Electronic Components
分类:Embedded - Microprocessors
AV8062701147401
Intel Corporation
分类:Embedded - Microprocessors
EM78P142SS10J
ELAN Microelectronics Corp
分类:Embedded - Microprocessors
EE80C188EA25
Intel Corporation
分类:Embedded - Microprocessors
PR31500ABC
NXP Semiconductors
分类:Embedded - Microprocessors
CM8071505092202
Intel Corporation
分类:Embedded - Microprocessors
MC68HC001FC10
Freescale Semiconductor
分类:Embedded - Microprocessors
UPD70433GJ-12-3EB
NEC Electronics Group
分类:Embedded - Microprocessors
UPD8085AC-2
NEC Electronics Group
分类:Embedded - Microprocessors
FH8065503553200
Intel Corporation
分类:Embedded - Microprocessors
MC68322FT16
Freescale Semiconductor
分类:Embedded - Microprocessors
MC68322FT16
Motorola Mobility LLC
分类:Embedded - Microprocessors
RCPXA270C0C416
Intel Corporation
分类:Embedded - Microprocessors
CM8071504555317S RL4V
Intel Corporation
分类:Embedded - Microprocessors
SC1100UFH-233F
AMD
分类:Embedded - Microprocessors
MC6800CLD
Freescale Semiconductor
分类:Embedded - Microprocessors
OSA248FAA5BL
AMD
分类:Embedded - Microprocessors
