category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

所有品牌

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量		Core											厂商																															操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	ECCN 代码	端子表面处理	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	频率	时间@峰值回流温度-最大值(s)	基本部件号	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源电压-最大值(Vsup)	温度等级	电源电压-最小值(Vsup)	界面	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	程序内存大小	建筑学	数据总线宽度	输入数量	座位高度-最大	可编程逻辑类型	边界扫描	速度等级
5CSEBA2U23C8SN	Intel	数据表	175 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES				MCU - 181, FPGA - 145			0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672				8542.39.00.01		BOTTOM	BALL	未说明	1.1V	0.8mm			未说明			S-PBGA-B672	145	不合格		1.13V	1.11.2/3.32.5V		1.07V		600MHz	64KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145		现场可编程门阵列				FPGA - 25K Logic Elements	25000				1.85mm	23mm	23mm	符合RoHS标准
XC7Z030-L2FBG484I	Xilinx Inc.	数据表	2934 In Stock	1: ¥2,327.552268 10: ¥2,195.804024 100: ¥2,071.513231 500: ¥1,954.257765 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	484-BBGA, FCBGA	YES				130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	484	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01		BOTTOM	BALL	250	1V	1mm	not_compliant	800MHz	30			S-PBGA-B484				1.05V			0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					ARM	YES	256000	Kintex™-7 FPGA, 125K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	23mm	23mm	ROHS3 Compliant
XCZU7EV-1FFVC1156I	Xilinx Inc.	数据表	515 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA						360		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明												500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 504K+ Logic Cells								ROHS3 Compliant
XCZU4CG-L1SFVC784I	Xilinx Inc.	数据表	885 In Stock	1: ¥9,163.422285 10: ¥8,862.110527 25: ¥8,800.506975 50: ¥8,739.331659 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES				252			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)	8542.31.00.01		BOTTOM	BALL	未说明	0.72V				未说明			S-PBGA-B784									500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 192K+ Logic Cells								ROHS3 Compliant
XCZU9EG-2FFVC900E	Xilinx Inc.	数据表	531 In Stock	1: ¥28,142.498768 10: ¥27,217.116801 25: ¥27,027.921349 50: ¥26,840.041058 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA						204		0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明												533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 599K+ Logic Cells								ROHS3 Compliant
XCZU2CG-1SBVA484E	Xilinx Inc.	数据表	2621 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA						82		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明												500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 103K+ Logic Cells								ROHS3 Compliant
M2S150TS-1FCV484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	YES	484-FBGA (19x19)	484	ARM Cortex M3	微芯片技术	Tray	M2S150	活跃	VFBGA-484	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	1.2 V	30	1.14 V	无	M2S150TS-1FCV484I	FBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	84	273	-40°C ~ 100°C (TJ)	Tray		SmartFusion2	e0	无					Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01		BOTTOM	BALL	240		0.8 mm	not_compliant				S-PBGA-B484								166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		3.15 mm	现场可编程门阵列				FPGA - 150K Logic Modules	1 Core	512KB		19 mm	19 mm
10AS016E3F29E2LG	Intel	数据表	204 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	780-BBGA, FCBGA	YES				288			0°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)	780				8542.39.00.01		BOTTOM	BALL	未说明	0.9V	1mm			未说明			S-PBGA-B780	288	不合格		0.93V	0.9V		0.87V		1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		288		现场可编程门阵列				FPGA - 160K Logic Elements	160000				3.35mm	29mm	29mm	符合RoHS标准
5CSEMA6U23I7N	Intel	数据表	3000 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES				MCU - 181, FPGA - 145			-40°C~100°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672				8542.39.00.01		BOTTOM	BALL	未说明	1.1V	0.8mm			未说明	5CSEMA6		S-PBGA-B672	145	不合格		1.13V	1.11.2/3.32.5V		1.07V		800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145		现场可编程门阵列				FPGA - 110K Logic Elements	110000				1.85mm	23mm	23mm	符合RoHS标准
5CSEBA2U19C8SN	Intel	数据表	3000 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	484-FBGA	YES				MCU - 151, FPGA - 66			0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	484						BOTTOM	BALL	未说明	1.1V	0.8mm			未说明			S-PBGA-B484	66	不合格		1.13V	1.11.2/3.32.5V		1.07V		600MHz	64KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		66		现场可编程门阵列				FPGA - 25K Logic Elements	25000				1.9mm	19mm	19mm	符合RoHS标准
XC7Z014S-1CLG400C	Xilinx Inc.	数据表	2104 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	400-LFBGA, CSPBGA	YES				125			0°C~85°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	400		Matte Tin (Sn)		8542.31.00.01		BOTTOM	BALL	未说明	1V	0.8mm			未说明			S-PBGA-B400				1.05V			0.95V		667MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						YES	256000	Artix™-7 FPGA, 65K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	17mm	17mm	ROHS3 Compliant
M2S150TS-1FCS536	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	536-CSPBGA (16x16)	ARM Cortex M3	微芯片技术		This product may require additional documentation to export from the United States.	90	12177 LAB	有	146124 LE	64 kB	-	-	166 MHz	N	1.2000 V	1.14 V	1.26 V	293	Tray	M2S150	活跃				0 to 85 °C	Tray		SmartFusion2																				536									166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						1		FPGA - 150K Logic Modules		1 Core	512KB
XCZU3EG-1SFVA625E	Xilinx Inc.	数据表	500 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA						180		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明												500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 154K+ Logic Cells								ROHS3 Compliant
M2S060-FGG484	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	ARM Cortex M3	56520 LE	有	4710 LAB	60	SmartFusion2								This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB		Tray		SmartFusion2																																			256 kB												1 Core
XC7Z030-2FF676I	Xilinx Inc.	数据表	2489 In Stock	1: ¥2,427.020290 10: ¥2,289.641781 100: ¥2,160.039420 500: ¥2,037.773036 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks	676-BBGA, FCBGA	YES				130			-40°C~100°C TJ	Tray	2009	Zynq®-7000			活跃	4 (72 Hours)	676				8542.39.00.01		BOTTOM	BALL					800MHz		XC7Z030		S-PBGA-B676								CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b				ARM	YES	256000	Kintex™-7 FPGA, 125K Logic Cells			CAN, ETHERNET, I2C, PCI, SPI, UART, USB					Non-RoHS Compliant
XCZU7EV-2FFVC1156E	Xilinx Inc.	数据表	540 In Stock	1: ¥31,710.887662 10: ¥30,668.169887 25: ¥30,454.984993 50: ¥30,243.282014 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA						360		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		yes	活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明												533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 504K+ Logic Cells								ROHS3 Compliant
XC7Z014S-1CLG400I	Xilinx Inc.	数据表	2885 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	400-LFBGA, CSPBGA	YES				125			-40°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	400		Matte Tin (Sn)		8542.31.00.01		BOTTOM	BALL	未说明	1V	0.8mm			未说明			S-PBGA-B400				1.05V			0.95V		667MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						YES	256000	Artix™-7 FPGA, 65K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	17mm	17mm	ROHS3 Compliant
XC7Z035-L2FFG676I	Xilinx Inc.	数据表	990 In Stock	1: ¥1,163.724626 10: ¥1,097.853421 100: ¥1,035.710774 500: ¥977.085636 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	676-BBGA, FCBGA	YES				130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01		BOTTOM	BALL	未说明	1V	1mm			未说明			S-PBGA-B676				1.05V			0.95V		800MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						YES	256000	Kintex™-7 FPGA, 275K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		3.37mm	27mm	27mm	ROHS3 Compliant
5CSEBA2U23C7N	Intel	数据表	3000 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES				MCU - 181, FPGA - 145			0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672						BOTTOM	BALL	未说明	1.1V	0.8mm			未说明			S-PBGA-B672	145	不合格		1.13V	1.11.2/3.32.5V		1.07V		800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145		现场可编程门阵列				FPGA - 25K Logic Elements	25000				1.85mm	23mm	23mm	符合RoHS标准
M2S060TS-1FG484M	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-484	ARM Cortex M3			166 MHz	-	-	64 kB	56520 LE	267 I/O	- 55 C	+ 125 C	1314 kbit	有	4710 LAB		SMD/SMT	This product may require additional documentation to export from the United States.	0.326090 oz	SmartFusion2	60					Tray		SmartFusion2																								1.2 V											256 kB												1 Core
M2S050T-1FGG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	有	4695 LAB	60	微芯片技术	267	Tray	M2S050	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	-55 °C	1.2 V	1.14 V	125 °C	有	M2S050T-1FGG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	-55°C ~ 125°C (TJ)	Tray		SmartFusion2	e1					3A001.A.2.C	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant		40			S-PBGA-B484	267	不合格		1.2 V	MILITARY			166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列			FPGA - 50K Logic Modules	56340	1 Core		256KB	23 mm	23 mm
XCZU15EG-1FFVB1156I	Xilinx Inc.	数据表	1280 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA						328		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明												500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 747K+ Logic Cells								ROHS3 Compliant
5CSEBA4U23C8SN	Intel	数据表	229 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES				MCU - 181, FPGA - 145			0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672				8542.39.00.01		BOTTOM	BALL	未说明	1.1V	0.8mm			未说明			S-PBGA-B672	145	不合格		1.13V	1.11.2/3.32.5V		1.07V		600MHz	64KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145		现场可编程门阵列				FPGA - 40K Logic Elements	40000				1.85mm	23mm	23mm	符合RoHS标准
M2S090TS-1FG676I	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-676	ARM Cortex M3	7193 LAB	40	1.071118 oz							N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有		Tray		SmartFusion2																																			512 kB												1 Core
XCZU2CG-1SFVC784I	Xilinx Inc.	数据表	2275 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA						252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01				未说明					未说明												500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 103K+ Logic Cells								ROHS3 Compliant