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产品型号	品牌	数据表	库存	价格(含增值税)	数量	底架	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量														厂商																												Temperature-Test			操作温度	包装	系列	尺寸/尺寸	容差	JESD-609代码	零件状态	湿度敏感性等级(MSL)	终止次数	温度系数	类型	电阻	端子表面处理	最高工作温度	最小工作温度	组成	颜色	功率(瓦特)	HTS代码	电容量	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	基本部件号	JESD-30代码	输出的数量	资历状况	工作电源电压	失败率	电源	温度等级	配置	界面	内存大小	速度	内存大小	电压 - 正向 (Vf) (类型)	核心处理器	视角	周边设备	程序内存大小	连接方式	测试电流	建筑学	流明/瓦特@电流 - 测试	显色指数	输入数量	组织结构	座位高度-最大	可编程逻辑类型	最大电流	逻辑元件/单元数	镜头类型	产品类别	评估套件	通量@电流/温度测试	核心架构	最高频率	发光面(LES)	波长	逻辑块数(LABs)	速度等级	收发器数量	主要属性	逻辑块数量	逻辑单元数
XCVM1302-1LSIVFVC1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD	532	Tray	活跃						-40°C ~ 100°C (TJ)		Versal™ Prime																																				400MHz, 1GHz	-		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA																				Versal™ Prime FPGA, 70k Logic Cells				-
XCVM1402-2MLIVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	748	Tray	活跃						-40°C ~ 100°C (TJ)		Versal™ Prime																																				600MHz, 1.4GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA																				Versal™ Prime FPGA, 1.2M Logic Cells				-
XCVM1802-1MSIVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	770	Tray	活跃						-40°C ~ 100°C (TJ)		Versal™ Prime																																				600MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA																				Versal™ Prime FPGA, 1.9M Logic Cells				-
XCVM1402-2HSIVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	726	Tray	活跃						-40°C ~ 100°C (TJ)		Versal™ Prime																																				800MHz, 1.65GHz	-		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA																				Versal™ Prime FPGA, 1.2M Logic Cells				-
XCVM1302-1MSENBVB1024	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD	316	Tray	活跃						0°C ~ 100°C (TJ)		Versal™ Prime																																				600MHz, 1.3GHz	-		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA																				Versal™ Prime FPGA, 70k Logic Cells				-
XCVM1302-2LSENBVB1024	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD	316	Tray	活跃						0°C ~ 100°C (TJ)		Versal™ Prime																																				450MHz, 1.08GHz	-		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA																				Versal™ Prime FPGA, 70k Logic Cells				-
XCZU43DR-1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	366	Tray	活跃						-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																																				500MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA																				Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCVC1802-1LSEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思	770	Tray	活跃						0°C ~ 100°C (TJ)		Versal™ AI Core																																				400MHz, 1GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA																				Versal™ AI Core FPGA, 1.5M Logic Cells				-
XCZU48DR-L2FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	Tray	活跃						Non-Compliant	366	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																																				533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA																				Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU48DR-1FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思	561	Tray	活跃						-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																																				500MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA																				Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU47DR-1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	Tray	活跃						Non-Compliant	366	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																																				500MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											有									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-								无
XCZU48DR-1FFVG1517E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思	561	Tray	活跃						0°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																																				500MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA																				Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
10AS027H1F34I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FBGA (35x35)	1152	Non-Compliant	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	有	10AS027H1F34I1SG	BGA	SQUARE		Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.64				384	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX				Discontinued at Digi-Key												8542.39.00.01				BOTTOM	BALL		1 mm	compliant			S-PBGA-B1152						INDUSTRIAL			1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					3.65 mm	现场可编程门阵列														FPGA - 270K Logic Elements				--					35 mm	35 mm
10AS057K3F40E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FCBGA (40x40)	1517	1.2 GHz	570000 LE	21	SMD/SMT	71250 LAB	965094	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	0.9 V	未说明	0.87 V	100 °C	有	10AS057K3F40E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45			--	5700K 4-Step MacAdam Ellipse	696	有	85°C	This product may require additional documentation to export from the United States.	2 x 32 kB	0°C ~ 100°C (TJ)	Tray	Gen 7 Vero® 10 Array	20.00mm Diameter			活跃	--			Chip On Board (COB)						White, Cool		8542.39.00.01		SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant			S-PBGA-B1517	696	不合格			0.9 V	OTHER	Starboard		1.5GHz	256KB	36.7V	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	--	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	270mA	MCU, FPGA	150 lm/W	80	696		3.5 mm	现场可编程门阵列	540mA		Flat	SoC FPGA		1378 lm (Typ)			9.90mm Diameter	--				FPGA - 570K Logic Elements		570000	2 Core	--	带连接器	SoC FPGA	1.90mm		40 mm	40 mm
10AS032E3F29I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-780	YES	780	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	320000 LE	1	SMD/SMT	40000 LAB	964975	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS032E3F29I2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45				--	3000K 3-Step MacAdam Ellipse	85°C	360	有	-40°C ~ 100°C (TJ)	Tray	Gen 7 V10 Array	13.50mm L x 13.50mm W			活跃	--			Chip On Board (COB)						White, Warm		8542.39.00.01		SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant			S-PBGA-B780	360	不合格			0.9 V	INDUSTRIAL	Square		1.5GHz	256KB	33.8V	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	120°	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	360mA	MCU, FPGA	108 lm/W	90	360		3.35 mm	现场可编程门阵列	720mA		Flat	SoC FPGA		1316 lm (Typ)			10.20mm Dia	--				FPGA - 320K Logic Elements		320000	2 Core	--	--	SoC FPGA	1.70mm		29 mm	29 mm
10AS057H1F34I1HG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Axial	Axial	Arria 10 SoC	Details	2 x 32 kB	-	有	10AS057H1F34I1HG	活跃	INTEL CORP	5.66					492	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	570000 LE	+ 100 C	- 40 C	24	SMD/SMT	71250 LAB	965092	Intel			Intel / Altera	-55°C ~ 175°C	Tape & Reel (TR)	CMF	0.090 Dia x 0.240 L (2.29mm x 6.10mm)	±0.1%		活跃		2	±50ppm/°C		4.99 kOhms				Metal Film		0.5W, 1/2W			SOC - Systems on a Chip						unknown						950 mV	--					1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA										SoC FPGA									24 Transceiver	FPGA - 570K Logic Elements			2 Core	--	Flame Retardant Coating, Moisture Resistant, Safety	SoC FPGA		--
5CSEBA2U19I7SN	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-FBGA	YES	484	484-UBGA (19x19)	484	Molex	INTEL CORP	1.13 V	2		活跃	121050	Bulk	MCU - 151, FPGA - 66	8542390000	Compliant	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32	1.1 V	未说明	1.07 V	有	5CSEBA2U19I7SN	FBGA	SQUARE		Intel Corporation	活跃	-40°C ~ 100°C (TJ)	Tray	Brad 121050 mPm				活跃							100 °C	-40 °C				8542.39.00.01		现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant	800 MHz	5CSEBA2	S-PBGA-B484	66	不合格	1.1 V		1.1,1.2/3.3,2.5 V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.5 MB	800MHz	64KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA			66		1.9 mm	现场可编程门阵列		25000					ARM							FPGA - 25K Logic Elements		25000		--					19 mm	19 mm
10AS027H2F34I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-1152	YES	1152	1	SMD/SMT	33750 LAB	964971	Intel	Intel / Altera	Arria 10 SoC		Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS027H2F34I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.43				384	有	This product may require additional documentation to export from the United States.	2 x 32 kB		1.2 GHz	270000 LE	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX				活跃												8542.39.00.01		SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant			S-PBGA-B1152	384	不合格			0.9 V	INDUSTRIAL			1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA			384		3.65 mm	现场可编程门阵列				SoC FPGA										FPGA - 270K Logic Elements		270000	2 Core	--		SoC FPGA			35 mm	35 mm
5ASXMB3E4F31C5N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BBGA, FCBGA	YES	896-FBGA (31x31)	896		Compliant	MCU - 208, FPGA - 250	BGA, BGA896,30X30,40	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	1.1 V	未说明	1.07 V	85 °C	有	5ASXMB3E4F31C5N	BGA		SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.13 V		5.28		0°C ~ 85°C (TJ)	Tray	Arria V SX			e1	活跃						Tin/Silver/Copper (Sn/Ag/Cu)						8542.39.00.01				BOTTOM	BALL	未说明	1 mm	compliant		5ASXMB3	S-PBGA-B896	540					商业扩展			800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA			540	13207 CLBS	2.7 mm	现场可编程门阵列														FPGA - 350K Logic Elements	13207	350000		--					31 mm	31 mm
5ASXMB5E4F31C4N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BBGA, FCBGA	YES	896-FBGA (31x31)	896	BGA, BGA896,30X30,40	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	1.1 V	未说明	1.07 V	85 °C	有	5ASXMB5E4F31C4N	BGA	SQUARE		Intel Corporation	生命周期结束	INTEL CORP	1.13 V	5.28				MCU - 208, FPGA - 250	0°C ~ 85°C (TJ)	Tray	Arria V SX			e1	活跃						Tin/Silver/Copper (Sn/Ag/Cu)										BOTTOM	BALL	未说明	1 mm	compliant		5ASXMB5	S-PBGA-B896	540					商业扩展			925MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA			540	17434 CLBS	2.7 mm	现场可编程门阵列														FPGA - 462K Logic Elements	17434	462000		--					31 mm	31 mm
5CSEMA5U23I7N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	672-FBGA	YES	672-UBGA (23x23)	672	Compliant	MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32	1.1 V	未说明	1.07 V	有	5CSEMA5U23I7N	FBGA		SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	5.2			200 V	-40°C ~ 100°C (TJ)	Tape & Reel (TR)	Cyclone® V SE		1 %		活跃							125 °C	-55 °C				8542.39.00.01	10 pF	现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant		5CSEMA5	S-PBGA-B672	145	不合格			1.1,1.2/3.3,2.5 V				800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA			145		1.85 mm	现场可编程门阵列														FPGA - 85K Logic Elements		85000		--					1.016 mm	508 µm	609.6 µm
5CSEBA5U19A7N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-FBGA	YES	484	484-UBGA (19x19)	484		MCU - 151, FPGA - 66	Compliant	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32	-40 °C	1.1 V	未说明	1.07 V	125 °C	有	5CSEBA5U19A7N		FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP		1.13 V	2.03	-40°C ~ 125°C (TJ)	Tray	Automotive, AEC-Q100, Cyclone® V SE				活跃							125 °C	-40 °C				8542.39.00.01		现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant		5CSEBA5	S-PBGA-B484	66	不合格	1.13 V		1.1,1.2/3.3,2.5 V	AUTOMOTIVE			556.3 kB	700MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA			66		1.9 mm	现场可编程门阵列		85000						800 MHz			32075	7		FPGA - 85K Logic Elements		85000		--					19 mm	19 mm
10AS048E1F29I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2010 (5025 Metric)	YES	2010	780	Kamaya Inc.	Tape & Reel (TR)	活跃	360	29 X 29 MM, ROHS COMPLIANT, FBGA-780	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	有	10AS048E1F29I1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.68				-55°C ~ 155°C	Tray	RMC	0.197 L x 0.098 W (5.00mm x 2.50mm)	±1%		Discontinued at Digi-Key		2	±100ppm/°C		2.32 kOhms				厚膜		0.75W, 3/4W	8542.39.00.01				BOTTOM	BALL		1 mm	compliant			S-PBGA-B780				-		INDUSTRIAL			1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					3.35 mm	现场可编程门阵列														FPGA - 480K Logic Elements				--	-			0.028 (0.70mm)	29 mm	29 mm			-
10AS048H2F34I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0402 (1005 Metric)	YES	0402	1152	KOA Speer Electronics, Inc.			Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;	RN73R1E	活跃	492	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	有	10AS048H2F34I1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP		0.93 V	5.68	-55°C ~ 155°C	Tray	RN73R	0.039 L x 0.020 W (1.00mm x 0.50mm)	±0.25%		Discontinued at Digi-Key		2	±10ppm/°C		3.28 kOhms				Thin Film		0.063W, 1/16W	8542.39.00.01				BOTTOM	BALL		1 mm	compliant			S-PBGA-B1152				-		INDUSTRIAL			1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					3.65 mm	现场可编程门阵列														FPGA - 480K Logic Elements				--	Automotive AEC-Q200, Moisture Resistant			0.016 (0.40mm)	35 mm	35 mm			AEC-Q200
10AS032E2F27I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-BBGA, FCBGA	YES	672-FBGA (27x27)	672	PEI-Genesis			Bulk	活跃	240	Non-Compliant	27 X 27 MM, ROHS COMPLIANT, FBGA-672	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	有	10AS032E2F27I1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP		0.93 V	5.66	-40°C ~ 100°C (TJ)	Tray	*				Discontinued at Digi-Key												8542.39.00.01				BOTTOM	BALL		1 mm	compliant			S-PBGA-B672						INDUSTRIAL			1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					3.25 mm	现场可编程门阵列														FPGA - 320K Logic Elements				--					27 mm	27 mm