类别是'category.片上系统(SoC)' (7695)

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XCVC1502-2LLEVSVA1596
XCVC1502-2LLEVSVA1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

500

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 800k Logic Cells

-

XCVM1302-2MSENBVB1024
XCVM1302-2MSENBVB1024
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

AMD

316

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVC1802-2MLEVIVA1596
XCVC1802-2MLEVIVA1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD

500

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XC7Z020-3CLG484E
XC7Z020-3CLG484E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

484-LFBGA, CSPBGA

484-CSPBGA (19x19)

AMD

Honeywell

130

Tray

XC7Z020

活跃

VH3G7LEF2/M

CE

0°C ~ 100°C (TJ)

Zynq®-7000

866MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 85K Logic Cells

-

Lug

AGFB008R16A3E3E
AGFB008R16A3E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

镀镍黄铜

Intel

CSA, UL

Round

Pepperl Fuchs

Bushing Grip

384

Tray

活跃

11.94 mm

4.06 mm

Straight

291378

0°C ~ 100°C (TJ)

Agilex F

Metallic

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

IP66, IP68

XCZU4CG-2SFVC784I
XCZU4CG-2SFVC784I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Tray

XCZU4

活跃

Miscellaneous

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

1SX065HH3F35I2LG
1SX065HH3F35I2LG
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FBGA (35x35)

Intel

Hubbell

392

Tray

活跃

IN430FS1

-40°C ~ 100°C (TJ)

Stratix® 10 SX

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 650K Logic Elements

-

XCVC1502-2MSENSVG1369
XCVC1502-2MSENSVG1369
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

AMD

PDG23F0150P3YK

CE, CSA, UL

Cutler Hammer, Div of Eaton Corp

Panel

478

Tray

活跃

Versal™ AI Core

150 A

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 800k Logic Cells

-

XCZU4EV-1FBVB900E
XCZU4EV-1FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

Dynapar

204

Tray

XCZU4

活跃

HS35R05009141

CE

Hollowshaft

Hollow

-40 to 85 Degrees C

Zynq® UltraScale+™ MPSoC EV

7 Pin Connector

5~26 VDC

Differential

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

5~26 VDC

IP67

XCZU9CG-2FFVC900E
XCZU9CG-2FFVC900E
AMD 数据表

897 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.892 V

204

Tray

XCZU9

活跃

0.8500 V

0.808 V

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU9CG-2FFVB1156E
XCZU9CG-2FFVB1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.892 V

328

Tray

XCZU9

活跃

0.8500 V

0.808 V

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU3CG-1SFVA625I
XCZU3CG-1SFVA625I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

FCBGA

0.8500 V

0.808 V

180

0.892 V

180

Bulk

XCZU3

活跃

Industrial grade

154,350

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

625

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

1

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

141,120

-

XCZU9EG-3FFVC900E
XCZU9EG-3FFVC900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

XCZU9

活跃

599,550

FCBGA

1.0000 V

0.97 V

1.03 V

204

Tray

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

900

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

3

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

548,160

-

XCZU15EG-L2FFVB1156E
XCZU15EG-L2FFVB1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.742, 0.892 V

328

Tray

XCZU15

活跃

0.72, 0.85 V

0.698, 0.808 V

0 to 110 °C

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2L

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

M2S090-1FGG484I
M2S090-1FGG484I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

微芯片技术

1.26 V

267

Tray

M2S090

活跃

1.2000 V

1.14 V

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 90K Logic Modules

512KB

R9A06G037GNP#AA0
R9A06G037GNP#AA0
Renesas 数据表

166 In Stock

-

最小起订量: 1

最小包装量: 1

64-VFQFN Exposed Pad

Renesas Electronics America Inc

25

SMD/SMT

Renesas Electronics

Renesas Electronics

Details

128 kB

Tray

活跃

This product may require additional documentation to export from the United States.

128 kB

138 MHz, 276 MHz

+ 85 C

- 40 C

-40°C ~ 85°C (TA)

Tray

-

Microprocessors - MPU

1.1 V

128KB

ARM® Cortex®-M3

PWM

32 bit

Microprocessors - MPU

-

2 Core

-

Microprocessors - MPU

XCZU6EG-1FFVC900E
XCZU6EG-1FFVC900E
AMD 数据表

537 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU6

活跃

Acme Electric

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

10AS027H1F34E1SG
10AS027H1F34E1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

8-SMD, No Lead

YES

1152-FBGA (35x35)

1152

CTS-Frequency Controls

Non-Compliant

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

0.9 V

0.87 V

100 °C

5.64

0.93 V

INTEL CORP

Obsolete

Intel Corporation

SQUARE

BGA

10AS027H1F34E1SG

Tape & Reel (TR)

580

活跃

384

-40°C ~ 85°C

Tray

580

0.197 L x 0.126 W (5.00mm x 3.20mm)

Discontinued at Digi-Key

TCXO

8542.39.00.01

2.5V

BOTTOM

BALL

1 mm

compliant

16 MHz

±280ppb

削波正弦波

S-PBGA-B1152

Standby (Power Down)

Crystal

6mA

OTHER

10µA

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.65 mm

现场可编程门阵列

-

FPGA - 270K Logic Elements

--

0.079 (2.00mm)

35 mm

35 mm

-

XCZU9EG-L1FFVC900I
XCZU9EG-L1FFVC900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU9

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU2EG-1SFVA625E
XCZU2EG-1SFVA625E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

180

0.892 V

180

Tray

XCZU2

活跃

103,320

FCBGA

0.8500 V

0.808 V

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

625

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

1

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

94,464

-

XCZU6CG-1FFVC900I
XCZU6CG-1FFVC900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.892 V

204

Tray

XCZU6

活跃

0.85 V

0.808 V

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XCZU6CG-2FFVB1156I
XCZU6CG-2FFVB1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.808 V

0.892 V

328

Bulk

XCZU6

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XCZU15EG-1FFVC900E
XCZU15EG-1FFVC900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.892 V

204

Tray

XCZU15

活跃

0.8500 V

0.808 V

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

XCZU6CG-2FFVC900I
XCZU6CG-2FFVC900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.892 V

204

Tray

XCZU6

活跃

0.8500 V

0.808 V

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

A2F500M3G-FG256I
A2F500M3G-FG256I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

256-LBGA

256-FPBGA (17x17)

微芯片技术

265 Inches

MCU - 25, FPGA - 66

Tray

A2F500

活跃

11/5V2650

Continental Belt

-40°C ~ 100°C (TJ)

SmartFusion®

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11

512KB