类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 材料 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 零件状态 | 终端 | 类型 | 组成 | HTS代码 | 子类别 | 电压 - 供电 | 端子位置 | 终端形式 | 端子间距 | Reach合规守则 | 额定电流 | 频率 | 频率稳定性 | 输出量 | 引脚数量 | JESD-30代码 | 功能 | 基本谐振器 | 最大电流源 | 输出电压 | 输出类型 | 工作电源电压 | 温度等级 | 电流 - 电源(禁用)(最大值) | 速度 | 内存大小 | 核心处理器 | 周边设备 | 扩频带宽 | 连接方式 | 建筑学 | 数据总线宽度 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 筛选水平 | 速度等级 | 绝对牵引范围 (APR) | 主要属性 | 频带数量 | 寄存器数量 | 核数量 | 闪光大小 | 连接类型 | 输入电压 | 产品类别 | 轴承 | 知识产权评级 | 座位高度(最大) | 长度 | 宽度 | 评级结果 | ||||||||||||||||||||||||||||||||||||||||||||||
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![]() | XCVC1502-2LLEVSVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-2MSENBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-2MLEVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z020-3CLG484E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | AMD | Honeywell | 130 | Tray | XC7Z020 | 活跃 | VH3G7LEF2/M | CE | 0°C ~ 100°C (TJ) | Zynq®-7000 | 866MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | Lug | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB008R16A3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | 镀镍黄铜 | Intel | CSA, UL | Round | Pepperl Fuchs | Bushing Grip | 384 | Tray | 活跃 | 11.94 mm | 4.06 mm | Straight | 291378 | 0°C ~ 100°C (TJ) | Agilex F | Metallic | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | IP66, IP68 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4CG-2SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU4 | 活跃 | Miscellaneous | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX065HH3F35I2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | Hubbell | 392 | Tray | 活跃 | IN430FS1 | -40°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1502-2MSENSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | PDG23F0150P3YK | CE, CSA, UL | Cutler Hammer, Div of Eaton Corp | Panel | 478 | Tray | 活跃 | Versal™ AI Core | 150 A | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EV-1FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | Dynapar | 有 | 204 | Tray | XCZU4 | 活跃 | HS35R05009141 | CE | Hollowshaft | Hollow | -40 to 85 Degrees C | Zynq® UltraScale+™ MPSoC EV | 7 Pin Connector | 5~26 VDC | Differential | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | 5~26 VDC | 有 | IP67 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9CG-2FFVC900E | AMD | 数据表 | 897 In Stock | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 0.892 V | 204 | Tray | XCZU9 | 活跃 | 0.8500 V | 0.808 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9CG-2FFVB1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 0.892 V | 328 | Tray | XCZU9 | 活跃 | 0.8500 V | 0.808 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3CG-1SFVA625I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | FCBGA | 0.8500 V | 0.808 V | 180 | 0.892 V | 180 | Bulk | XCZU3 | 活跃 | Industrial grade | 154,350 | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 625 | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1 | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 141,120 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9EG-3FFVC900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | XCZU9 | 活跃 | 599,550 | FCBGA | 1.0000 V | 0.97 V | 1.03 V | 204 | Tray | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 900 | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 扩展工业 | 3 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | 548,160 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU15EG-L2FFVB1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 0.742, 0.892 V | 328 | Tray | XCZU15 | 活跃 | 0.72, 0.85 V | 0.698, 0.808 V | 0 to 110 °C | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090-1FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 1.26 V | 267 | Tray | M2S090 | 活跃 | 1.2000 V | 1.14 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | R9A06G037GNP#AA0 | Renesas | 数据表 | 166 In Stock | - | 最小起订量: 1 最小包装量: 1 | 64-VFQFN Exposed Pad | Renesas Electronics America Inc | 25 | SMD/SMT | Renesas Electronics | Renesas Electronics | Details | 128 kB | Tray | 活跃 | 有 | This product may require additional documentation to export from the United States. | 128 kB | 138 MHz, 276 MHz | + 85 C | - 40 C | -40°C ~ 85°C (TA) | Tray | - | Microprocessors - MPU | 1.1 V | 128KB | ARM® Cortex®-M3 | PWM | 32 bit | Microprocessors - MPU | - | 2 Core | - | Microprocessors - MPU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6EG-1FFVC900E | AMD | 数据表 | 537 In Stock | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU6 | 活跃 | Acme Electric | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H1F34E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8-SMD, No Lead | YES | 1152-FBGA (35x35) | 1152 | CTS-Frequency Controls | Non-Compliant | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | 网格排列 | PLASTIC/EPOXY | 0.9 V | 0.87 V | 100 °C | 有 | 5.64 | 0.93 V | INTEL CORP | Obsolete | Intel Corporation | SQUARE | BGA | 10AS027H1F34E1SG | Tape & Reel (TR) | 580 | 活跃 | 384 | -40°C ~ 85°C | Tray | 580 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Discontinued at Digi-Key | TCXO | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 1 mm | compliant | 16 MHz | ±280ppb | 削波正弦波 | S-PBGA-B1152 | Standby (Power Down) | Crystal | 6mA | OTHER | 10µA | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.65 mm | 现场可编程门阵列 | - | FPGA - 270K Logic Elements | -- | 0.079 (2.00mm) | 35 mm | 35 mm | - | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9EG-L1FFVC900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU9 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2EG-1SFVA625E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 180 | 0.892 V | 180 | Tray | XCZU2 | 活跃 | 103,320 | FCBGA | 0.8500 V | 0.808 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 625 | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 扩展工业 | 1 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 94,464 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6CG-1FFVC900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 0.892 V | 204 | Tray | XCZU6 | 活跃 | 0.85 V | 0.808 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6CG-2FFVB1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 0.808 V | 0.892 V | 328 | Bulk | XCZU6 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU15EG-1FFVC900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 0.892 V | 204 | Tray | XCZU15 | 活跃 | 0.8500 V | 0.808 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6CG-2FFVC900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 0.892 V | 204 | Tray | XCZU6 | 活跃 | 0.8500 V | 0.808 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-FG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | 265 Inches | MCU - 25, FPGA - 66 | Tray | A2F500 | 活跃 | 11/5V2650 | Continental Belt | -40°C ~ 100°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11 | 512KB |
XCVC1502-2LLEVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
XCVM1302-2MSENBVB1024
AMD
分类:Embedded - System On Chip (SoC)
XCVC1802-2MLEVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
XC7Z020-3CLG484E
AMD
分类:Embedded - System On Chip (SoC)
AGFB008R16A3E3E
Intel
分类:Embedded - System On Chip (SoC)
XCZU4CG-2SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
1SX065HH3F35I2LG
Intel
分类:Embedded - System On Chip (SoC)
XCVC1502-2MSENSVG1369
AMD
分类:Embedded - System On Chip (SoC)
XCZU4EV-1FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU9CG-2FFVC900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU9CG-2FFVB1156E
AMD
分类:Embedded - System On Chip (SoC)
XCZU3CG-1SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
XCZU9EG-3FFVC900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU15EG-L2FFVB1156E
AMD
分类:Embedded - System On Chip (SoC)
M2S090-1FGG484I
Microchip
分类:Embedded - System On Chip (SoC)
R9A06G037GNP#AA0
Renesas
分类:Embedded - System On Chip (SoC)
XCZU6EG-1FFVC900E
AMD
分类:Embedded - System On Chip (SoC)
10AS027H1F34E1SG
ALTERA
分类:Embedded - System On Chip (SoC)
XCZU9EG-L1FFVC900I
AMD
分类:Embedded - System On Chip (SoC)
XCZU2EG-1SFVA625E
AMD
分类:Embedded - System On Chip (SoC)
XCZU6CG-1FFVC900I
AMD
分类:Embedded - System On Chip (SoC)
XCZU6CG-2FFVB1156I
AMD
分类:Embedded - System On Chip (SoC)
XCZU15EG-1FFVC900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU6CG-2FFVC900I
AMD
分类:Embedded - System On Chip (SoC)
A2F500M3G-FG256I
Microchip
分类:Embedded - System On Chip (SoC)
