category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	触点镀层	包装/外壳	供应商器件包装					厂商									操作温度	包装	系列	零件状态	类型	性别	速度	内存大小	电缆长度	核心处理器	周边设备	连接方式	运行时间
XCVC1502-2MSEVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0.5 Vdc	Palladium Ruthenium/Gold	60/62.5 W/VA	AMD	178 Ohm	表面贴装	Tray	活跃				Non-Latching	-40 to 85 °C		*		信号继电器									1 ms		SPST-NO	10 mm
XCVM1302-1MLINSVF1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Gold	1369-BFBGA	1369-BGA (35x35)	AMD	Crimp	26 AWG	磷青铜	316	Tray	活跃	-55 to 150 °C		Versal™ Prime			Receptacle	600MHz, 1.3GHz	-	0.45 m	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		Versal™ Prime FPGA, 70k Logic Cells		-
M2S005-1TQ144I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	144-LQFP	144-TQFP (20x20)	微芯片技术	84	Tray	Obsolete		-40°C ~ 100°C (TJ)		SmartFusion®2				166MHz	64KB		ARM® Cortex®-M3	-	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		FPGA - 5K Logic Modules		128KB
XCVM1802-2MSEVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	726	Tray	活跃		0°C ~ 100°C (TJ)		Versal™ Prime				600MHz, 1.4GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		Versal™ Prime FPGA, 1.9M Logic Cells		-
XCVC1902-1LLIVIVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	1596-FCBGA (40x40)	AMD	500	Tray	活跃		-40°C ~ 100°C (TJ)		Versal™ AI Core				400MHz, 1GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		Versal™ AI Core FPGA, 1.9M Logic Cells		-
XCZU5EV-L2FBVB900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD	XCZU5	活跃		204	Tray	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EV				533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 256K+ Logic Cells		-
XCZU1CG-L1UBVA494I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	494-WFBGA, FCBGA	494-FCBGA (14x14)	AMD	活跃	Tray	82		-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG				500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	-	MPU, FPGA		Zynq®UltraScale+™ FPGA, 81K+ Logic Cells		-
10AS057H2F34E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FCBGA (35x35)		492		0°C ~ 100°C (TJ)	Tray	Arria 10 SX	Discontinued at Digi-Key			1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		FPGA - 570K Logic Elements		--
AGFA027R31C2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	720	Tray	活跃		-40°C ~ 100°C (TJ)		Agilex F				1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 2.7M Logic Elements		-
XC7Z030-1FBG484C	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BBGA, FCBGA	484-FCBGA (23x23)	AMD	XC7Z030	活跃		130	Tray	0°C ~ 85°C (TJ)		Zynq®-7000				667MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Kintex™-7 FPGA, 125K Logic Cells		-
XCZU11EG-2FFVF1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	XCZU11	活跃		464	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG				533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 653K+ Logic Cells		-
XCVC1902-2LLEVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	692	Tray	活跃		0°C ~ 100°C (TJ)		Versal™ AI Core				450MHz, 1.08GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		Versal™ AI Core FPGA, 1.9M Logic Cells		-
AGFA012R24C2E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	744	Tray	活跃		0°C ~ 100°C (TJ)		Agilex F				1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 1.2M Logic Elements		-
XCVC1702-2MSIVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD				Tray	活跃			*
AGFA006R24C2I1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	576	Tray	活跃		-40°C ~ 100°C (TJ)		Agilex F				1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 573K Logic Elements		-
XCVM1502-1LSEVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD				Tray	活跃			*
AGFA022R24C3E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	744	Tray	活跃		0°C ~ 100°C (TJ)		Agilex F				1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 2.2M Logic Elements		-
1SX065HH3F35I3XG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FBGA (35x35)	Intel	392	Tray	活跃		-40°C ~ 100°C (TJ)		Stratix® 10 SX				1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		FPGA - 650K Logic Elements		-
AGIB022R31B3E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	720	Tray	活跃		0°C ~ 100°C (TJ)		Agilex I				1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 2.2M Logic Elements		-
XCVE1752-2MSIVSVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD				Tray	活跃			*
XCZU19EG-2FFVC1760I	AMD	数据表	1760 In Stock	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD	Tray	活跃		XCZU19	512	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG				533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells		-
AGFA014R24C2I2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃	Tray	744		-40°C ~ 100°C (TJ)		Agilex F				1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		FPGA - 1.4M Logic Elements		-
XCVM1302-2MLINSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思	316	Tray	活跃		-40°C ~ 100°C (TJ)		Versal™ Prime				600MHz, 1.4GHz	-		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		Versal™ Prime FPGA, 70k Logic Cells		-
XCVE1752-2LLENSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思	500	Tray	活跃		0°C ~ 100°C (TJ)		Versal™ AI Core				450MHz, 1.08GHz	-		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		Versal™ AI Core FPGA, 1M Logic Cells		-
XC7Z045-2FBG676CES	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BBGA, FCBGA	676-FCBGA (27x27)	AMD	XC7Z045	Obsolete		130	Tray	0°C ~ 85°C (TJ)		Zynq®-7000				800MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Kintex™-7 FPGA, 350K Logic Cells		-