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产品型号	品牌	数据表	库存	价格(含增值税)	数量	安装类型	包装/外壳	表面安装	越来越多的功能	外壳材料	供应商器件包装	质量	插入材料	终端数量	后壳材料，电镀															厂商																														Voltage-Input		操作温度	包装	系列	尺寸/尺寸	容差	零件状态	终止次数	终端	温度系数	连接器类型	类型	电阻	定位的数量	组成	颜色	应用	行数	功率(瓦特)	HTS代码	电容量	紧固类型	子类别	额定电流	螺距	技术	电压 - 供电	端子位置	方向	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	入口保护	端子间距	已加载定位数量	Reach合规守则	频率	频率稳定性	输出量	外壳完成	外壳尺寸-插入	触点表面处理	JESD-30代码	功能	基本谐振器	最大电流源	输出的数量	资历状况	审批机构	效率	工作电源电压	失败率	引线间距	电源	温度等级	电流 - 电源（禁用）（最大值）	振荡器类型	极化	最大输出电流	连接器样式	速度	内存大小	外壳尺寸，MIL	引线样式	电压 - 供电 (Vcc/Vdd)	核心处理器	周边设备	程序存储器类型	芯尺寸	程序内存大小	扩频带宽	连接方式	输入类型	电缆开口	电压 - 输出	建筑学	输入数量	可编程逻辑类型	EEPROM 大小	表格	使用地区	线长	输入连接器	输出连接器	收发器数量	无负载功耗	连接器用途	绝对牵引范围 (APR)	主要属性	逻辑单元数	核数量	闪光大小	特征	产品类别	座位高度(最大)	长度
AGFB012R24B2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Panel Mount, Through Hole	-	-	不锈钢	-	氟硅弹性体	-	TE Connectivity Deutsch 连接器	600VAC, 850VDC	Bulk	Metal	D38999/25HE	活跃	镍铁合金	Gold	768					-65°C ~ 200°C		MIL-DTL-38999 Series III, DTS					Solder		Receptacle, Female Sockets			23		Silver	Aviation, Communication Systems, Industrial					Threaded		-					D		Shielded		抗环境干扰							化学镍	17-99																				1.4GHz	256KB	-			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT					EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		-		MPU, FPGA															FPGA - 1.2M Logic Elements			-	密封							-	-
10AS057H2F34I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	活跃	492	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	570000 LE	24	SMD/SMT	71250 LAB	965012	Intel	Molex	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS057H2F34I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45							Bulk		121024	-40°C ~ 100°C (TJ)	Tray	*			活跃													8542.39.00.01			SOC - Systems on a Chip			CMOS		BOTTOM		BALL		未说明		1 mm		compliant							S-PBGA-B1152				492	不合格						0.9 V	INDUSTRIAL						1.5GHz	256KB				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA	492	3.65 mm	现场可编程门阵列	SoC FPGA									FPGA - 570K Logic Elements	570000	2 Core	--		SoC FPGA		35 mm	35 mm
10AS048K4F35I3LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	-	1152	Advantech Corp	Intel Corporation	活跃	INTEL CORP	0.93 V	5.47								Bulk	Obsolete	396	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS048K4F35I3LG	BGA	230VAC	SQUARE	-	Tray	-	2.39 L x 2.01 W x 1.55 H (60.7mm x 51.1mm x 39.4mm)		活跃										ITE (Commercial)		6 W	8542.39.00.01			现场可编程门阵列			CMOS		BOTTOM		BALL		未说明		1 mm		compliant							S-PBGA-B1152				396	不合格	CE, TUVgs	-				0.9 V	INDUSTRIAL			Positive Tip, Negative Sleeve	500mA		1.5GHz	256KB				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT					EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	固定刀片		12V	MCU, FPGA	396	3.5 mm	现场可编程门阵列			Wall Mount (Class II)	Europe	72 (1.83m)	CEE 7/16	Phono Plug, 2.5mm O.D. x 11.5mm		-			FPGA - 480K Logic Elements	480000		--				35 mm	35 mm
10AS048K3F35I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Axial	YES	Axial	1152	活跃	396	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	480000 LE	1	SMD/SMT	60000 LAB	965306	Intel	Vishay Dale	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS048K3F35I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.47							Tape & Reel (TR)		RNC60	-65°C ~ 175°C	Tray	Military, MIL-PRF-55182/03, RNC60	0.097 Dia x 0.280 L (2.46mm x 7.11mm)	±0.1%	活跃	2		±50ppm/°C			124 Ohms		Metal Film				0.25W, 1/4W	8542.39.00.01			SOC - Systems on a Chip			CMOS		BOTTOM		BALL		未说明		1 mm		compliant							S-PBGA-B1152				396	不合格				M (1%)		0.9 V	INDUSTRIAL						1.5GHz	256KB				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA	396	3.5 mm	现场可编程门阵列	SoC FPGA									FPGA - 480K Logic Elements	480000	2 Core	--	Military, Moisture Resistant, Weldable	SoC FPGA	-	35 mm	35 mm
10AS066K3F35E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0805 (2012 Metric)	YES	0805	1152	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	24	SMD/SMT	82500 LAB	965076	Intel	Intel / Altera	Stackpole Electronics Inc	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS066K3F35E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.46							活跃	Tape & Reel (TR)	396		有	-55°C ~ 155°C	Tray	RNCS	0.079 L x 0.049 W (2.00mm x 1.25mm)	±0.1%	活跃	2		±50ppm/°C			15.4 kOhms		Thin Film				0.1W, 1/10W	8542.39.00.01			SOC - Systems on a Chip			CMOS		BOTTOM		BALL		未说明		1 mm		compliant							S-PBGA-B1152				396	不合格				-		0.9 V	OTHER						1.5GHz	256KB				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA	396	3.5 mm	现场可编程门阵列	SoC FPGA									FPGA - 660K Logic Elements	660000	2 Core	--	Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant	SoC FPGA	0.026 (0.65mm)	35 mm	35 mm					AEC-Q200
XCVP1202-2MLEVSVA2785	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, MLCC	0805 (2012 Metric)	Vishay Vitramon	Tape & Reel (TR)	Obsolete	50V										-55°C ~ 150°C		GA	0.079 L x 0.049 W (2.00mm x 1.25mm)	±0.1pF				C0G, NP0							汽车				3.3 pF																															-	-											-																															Epoxy Mountable, High Temperature		-			0.057 (1.45mm)				AEC-Q200
AGFB008R16A2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0805 (2012 Metric)	0805	KOA Speer Electronics, Inc.					Tape & Reel (TR)	RS73G2A	活跃	384						-55°C ~ 155°C		RS73	0.079 L x 0.049 W (2.00mm x 1.25mm)	±1%		2		±50ppm/°C			4.22 MOhms		厚膜				0.25W, 1/4W																																										1.4GHz	256KB				Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT					EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MPU, FPGA															FPGA - 764K Logic Elements			-	Automotive AEC-Q200, Moisture Resistant		0.024 (0.60mm)							AEC-Q200
10AS022E3F29E1HG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	780-BBGA, FCBGA	780-FBGA (29x29)		Details	2 x 32 kB	-	有	10AS022E3F29E1HG	活跃	INTEL CORP	5.67									288	有	2 x 32 kB	1.2 GHz	220000 LE	+ 100 C	0 C	36	SMD/SMT	27500 LAB	973472	Intel	Intel / Altera		Arria 10 SoC	0°C ~ 100°C (TJ)	Tray	Arria 10 SX			活跃																SOC - Systems on a Chip													unknown															950 mV										1.5GHz	256KB				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA				SoC FPGA							12 Transceiver				FPGA - 220K Logic Elements		2 Core	--		SoC FPGA
10AS048H2F34E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0603 (1608 Metric)	YES	0603	1152	KOA Speer Electronics, Inc.	Obsolete	INTEL CORP	0.93 V	5.68							Tape & Reel (TR)	RN731J	Obsolete	492	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS048H2F34E1SG	BGA	SQUARE		Intel Corporation	-55°C ~ 155°C	Tray	RN73	0.063 L x 0.031 W (1.60mm x 0.80mm)	±1%	Discontinued at Digi-Key	2		±50ppm/°C			16.4 kOhms		Thin Film				0.063W, 1/16W	8542.39.00.01			现场可编程门阵列			CMOS		BOTTOM		BALL		未说明		1 mm		compliant							S-PBGA-B1152				492	不合格						0.9 V	OTHER						1.5GHz	256KB				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT					EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA	492	3.65 mm	现场可编程门阵列												FPGA - 480K Logic Elements	480000		--	Moisture Resistant		0.022 (0.55mm)	35 mm	35 mm
10AS066N4F40I3SGES	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	1517-BBGA, FCBGA	YES	1517-FCBGA (40x40)	1517	KYOCERA AVX					250VAC/DC	Bag	活跃	588	BGA,	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	10AS066N4F40I3SGES	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66			-55°C ~ 125°C	Tray	8071, Kyocera			Discontinued at Digi-Key		-		Receptacle, Female Sockets			55				-		8542.39.00.01				1 A	0.079 (2.00mm)			BOTTOM		BALL				1 mm	All	compliant						-	S-PBGA-B1517												INDUSTRIAL					-	1.5GHz	256KB				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT					EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA		3.5 mm	现场可编程门阵列										-		FPGA - 660K Logic Elements			--	-			40 mm	40 mm		-
10AS057K3F40E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2512 (6432 Metric)	YES	2512	1517	1.2 GHz	570000 LE	21	SMD/SMT	71250 LAB	965069	Intel	Intel / Altera	Stackpole Electronics Inc	Arria 10 SoC	Details	2 x 32 kB	-	BGA,	网格排列	PLASTIC/EPOXY	0.9 V	0.87 V	100 °C	有	10AS057K3F40E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45							Tape & Reel (TR)	活跃	696	有	This product may require additional documentation to export from the United States.		2 x 32 kB	-55°C ~ 155°C	Tray	RMCF	0.248 L x 0.126 W (6.30mm x 3.20mm)	±1%	活跃	2		±400ppm/°C			7.32 Ohms		厚膜				1W	8542.39.00.01			SOC - Systems on a Chip					BOTTOM		BALL				1 mm		compliant							S-PBGA-B1517									-			OTHER						1.5GHz	256KB				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA		3.5 mm	现场可编程门阵列	SoC FPGA										FPGA - 570K Logic Elements	2 Core	--	Automotive AEC-Q200	SoC FPGA	0.028 (0.70mm)	40 mm	40 mm					AEC-Q200
10AS066K1F35E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FBGA (35x35)	1152	Broadcom Limited							Bulk	QL3P41	Obsolete	396	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	网格排列	PLASTIC/EPOXY	0.9 V	0.87 V	100 °C	有	10AS066K1F35E1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V		5.66	0°C ~ 100°C (TJ)	Tray	-			Discontinued at Digi-Key													8542.39.00.01								BOTTOM		BALL				1 mm		compliant							S-PBGA-B1152												OTHER						1.5GHz	256KB				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT					EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA		3.5 mm	现场可编程门阵列												FPGA - 660K Logic Elements			--				35 mm	35 mm
1SX250LU2F50I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	52-TQFP	52-TQFP (10x10)	Rohm Semiconductor					34	Bulk	ML620Q156	A/D 12x10b SAR	最后一次购买					-40°C ~ 105°C (TA)	Tray	-			活跃																																																		External, Internal				8.4MHz	2K x 8			1.8V ~ 5.5V	nX-U16/100	POR, PWM, WDT	FLASH	16-Bit	64KB (32K x 16)		I²C, SSP, UART/USART				MCU, FPGA					2K x 8										FPGA - 2500K Logic Elements			--
10AS048H3F34I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0603 (1608 Metric)	YES	0603	1152	活跃	492	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	480000 LE	1	SMD/SMT	60000 LAB	965303	Intel	KOA Speer Electronics, Inc.	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS048H3F34I2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.47							Tape & Reel (TR)		SG731J	-55°C ~ 155°C	Tray	SG73	0.063 L x 0.031 W (1.60mm x 0.80mm)	±20%	活跃	2		±200ppm/°C			18 Ohms		厚膜				0.1W, 1/10W	8542.39.00.01			SOC - Systems on a Chip			CMOS		BOTTOM		BALL		未说明		1 mm		compliant							S-PBGA-B1152				492	不合格				-		0.9 V	INDUSTRIAL						1.5GHz	256KB				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA	492	3.65 mm	现场可编程门阵列	SoC FPGA									FPGA - 480K Logic Elements	480000	2 Core	--	Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding	SoC FPGA	0.022 (0.55mm)	35 mm	35 mm					AEC-Q200
XCZU7EV-1FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	KEMET					Obsolete	Bulk	204	XCZU7						-40°C ~ 100°C (TJ)		-																																																									500MHz, 600MHz, 1.2GHz	256KB				Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT					CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA															Zynq®UltraScale+™ FPGA, 504K+ Logic Cells			-
XC7Z020-2CLG484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-LFBGA, CSPBGA	484-CSPBGA (19x19)	Molex					Bulk	093338	活跃	130						-40°C ~ 100°C (TJ)		*																																																									766MHz	256KB				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA					CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA															Artix™-7 FPGA, 85K Logic Cells			-
AGFB027R31C2E1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	TE Connectivity Deutsch 连接器					Bag	DL66G12	活跃	720						0°C ~ 100°C (TJ)		*																																																									1.4GHz	256KB				Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT					EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MPU, FPGA															FPGA - 2.7M Logic Elements			-
AGFA008R16A2I2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Molex					Bulk	173114	活跃	384						-40°C ~ 100°C (TJ)		*																																																									1.4GHz	256KB				Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT					EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MPU, FPGA															FPGA - 764K Logic Elements			-
10AS066H2F34I2SGES	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	4-SMD, No Lead	YES	1152-FCBGA (35x35)	1152	Skyworks Solutions Inc.					Tape & Reel (TR)	500SAB	Obsolete	492	BGA,	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	10AS066H2F34I2SGES	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66			0°C ~ 85°C	Tray	Si500S	0.157 L x 0.126 W (4.00mm x 3.20mm)		Discontinued at Digi-Key					XO (Standard)								8542.39.00.01							3.3V	BOTTOM		BALL				1 mm		compliant	70.3125 MHz	±20ppm	CMOS				S-PBGA-B1152	Enable/Disable	Crystal	24mA									INDUSTRIAL	10.7mA					1.5GHz	256KB				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT				-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA		3.65 mm	现场可编程门阵列											-	FPGA - 660K Logic Elements			--			0.035 (0.90mm)	35 mm	35 mm				-
10AS048K4F35I3SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1152	Panduit Corp	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	5.47									Bulk	Obsolete	396	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS048K4F35I3SG		BGA	-40°C ~ 100°C (TJ)	Tray	*			活跃													8542.39.00.01			现场可编程门阵列			CMOS		BOTTOM		BALL		未说明		1 mm		compliant							S-PBGA-B1152				396	不合格						0.9 V	INDUSTRIAL						1.5GHz	256KB				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT					EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA	396	3.5 mm	现场可编程门阵列												FPGA - 480K Logic Elements	480000		--				35 mm	35 mm
10AS032H4F35E3SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, MLCC	1812 (4532 Metric)	YES	1152	384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	320000 LE	1	SMD/SMT	40000 LAB	965298	Intel	Vishay Vitramon	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS032H4F35E3SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45							Tape & Reel (TR)	活跃		100V	-55°C ~ 150°C	Tray	GA	0.177 L x 0.126 W (4.50mm x 3.20mm)	±5%	活跃			C0G, NP0							汽车			8542.39.00.01	150 pF		SOC - Systems on a Chip			CMOS		BOTTOM		BALL		未说明		1 mm		compliant							S-PBGA-B1152				384	不合格				-	-	0.9 V	OTHER						1.5GHz	256KB		-		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA	384	3.5 mm	现场可编程门阵列	SoC FPGA									FPGA - 320K Logic Elements	320000	2 Core	--	-	SoC FPGA	-	35 mm	35 mm	0.086 (2.18mm)				AEC-Q200
10AS048H2F34E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1152	Corsair	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	5.47									Bag	MS27497T14F	活跃	492	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS048H2F34E2LG		BGA	0°C ~ 100°C (TJ)	Tray	*			活跃													8542.39.00.01			现场可编程门阵列			CMOS		BOTTOM		BALL		未说明		1 mm		compliant							S-PBGA-B1152				492	不合格						0.9 V	OTHER						1.5GHz	256KB				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT					EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA	492	3.65 mm	现场可编程门阵列												FPGA - 480K Logic Elements	480000		--				35 mm	35 mm
10AS032H1F34I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, MLCC	1206 (3216 Metric)	YES	1152-FBGA (35x35)	1152	Vishay Vitramon	INTEL CORP	0.93 V	5.66						Tape & Reel (TR)	活跃	50V	384	Non-Compliant	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	有	10AS032H1F34I1SG	BGA	SQUARE	Intel Corporation		Obsolete	-55°C ~ 150°C	Tray	GA	0.126 L x 0.063 W (3.20mm x 1.60mm)	±20%	Discontinued at Digi-Key			X8R							汽车			8542.39.00.01	1200 pF							BOTTOM		BALL				1 mm		compliant							S-PBGA-B1152									-	-		INDUSTRIAL						1.5GHz	256KB		-		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT					EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA		3.65 mm	现场可编程门阵列												FPGA - 320K Logic Elements			--	-		-	35 mm	35 mm	0.067 (1.70mm)		AEC-Q200
10AS022E3F29E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Free Hanging (In-Line)	FBGA-780	YES	-	Composite	Thermoplastic	780	-	D38999/26JH	Discontinued at Digi-Key	Copper Alloy	Gold	288	Non-Compliant	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	220000 LE	TE Connectivity Deutsch 连接器	1	SMD/SMT	27500 LAB	973473	Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	0.9 V	未说明	0.87 V	100 °C	有	10AS022E3F29E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.46			-	Bulk		Composite	-65°C ~ 175°C	Tray	Military, MIL-DTL-38999 Series III, ACT			活跃		Crimp		Plug, Female Sockets			55		橄榄色	Aerospace, Military			8542.39.00.01		Threaded	SOC - Systems on a Chip	7.5A		CMOS		BOTTOM	B	BALL	Shielded	未说明	抗环境干扰	1 mm		compliant				橄榄色镉	23-55		S-PBGA-B780				288	不合格						0.9 V	OTHER						1.5GHz	256KB	H			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		-		MCU, FPGA	288	3.35 mm	现场可编程门阵列	SoC FPGA									FPGA - 220K Logic Elements	220000	2 Core	--	-	SoC FPGA		29 mm	29 mm			50.0µin (1.27µm)	-
10AS048K3F35E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-1152	YES	1152	活跃	396	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	480000 LE	1	SMD/SMT	60000 LAB	964910	Intel	TE Connectivity Deutsch 连接器	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS048K3F35E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.47								Bag		DL66R	0°C ~ 100°C (TJ)	Tray	*			活跃													8542.39.00.01			SOC - Systems on a Chip			CMOS		BOTTOM		BALL		未说明		1 mm		compliant							S-PBGA-B1152				396	不合格						0.9 V	OTHER						1.5GHz	256KB				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA	396	3.5 mm	现场可编程门阵列	SoC FPGA									FPGA - 480K Logic Elements	480000	2 Core	--		SoC FPGA		35 mm	35 mm