N/A

-

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

XCZU11

活跃

488

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

N/A

-

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

XCZU11

活跃

512

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

N/A

-

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

活跃

MICROSEMI CORP

1.26 V

5.84

161

Tray

M2S005

活跃

-

166 MHz

6060 LE

SMD/SMT

-

64 kB

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

无

M2S005-VF256I

LFBGA

SQUARE

Microsemi Corporation

-40°C ~ 100°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

161

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

161

1.56 mm

现场可编程门阵列

FPGA - 5K Logic Modules

6060

1 Core

128KB

14 mm

14 mm

N/A

-

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

574

Tray

M2S150

活跃

FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-55 °C

1.2 V

30

1.14 V

125 °C

无

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

NC16

Cully-Minerallac

-55°C ~ 125°C (TJ)

SmartFusion®2

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B1152

574

不合格

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

FPGA - 150K Logic Modules

146124

512KB

35 mm

35 mm

N/A

-

-

-

Intel

活跃

480

Tray

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

N/A

-

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

XCZU9

活跃

328

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

N/A

-

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

XCZU2

活跃

82

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

N/A

-

-

-

Intel

活跃

480

Tray

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

N/A

-

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

有

表面贴装

622

Tray

活跃

Industrial grade

RISC

1.8/2.5/3.3 V

FCBGA

6

CAN/Serial I2C/SPI/UART/USB

-40 to 100 °C

Zynq® UltraScale+™ RFSoC

0.85 V

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256 KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

64 Bit

Industrial

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

ARM Cortex-A53/Arm Cortex-R5

N/A

-

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.77

273

Tray

M2S150

活跃

-

166 MHz

146124 LE

-

64 kB

VFBGA-484

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

BGA484,22X22,32

1.2 V

40

1.14 V

85 °C

有

M2S150-1FCVG484

FBGA

0°C ~ 85°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B484

273

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

273

3.15 mm

现场可编程门阵列

FPGA - 150K Logic Modules

146124

1 Core

512KB

19 mm

19 mm

N/A

-

1152-BBGA, FCBGA

1152-FBGA (35x35)

5.68

492

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

+ 100 C

- 40 C

24

SMD/SMT

60000 LAB

965036

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

有

10AS048H1F34I1HG

活跃

INTEL CORP

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

24 Transceiver

FPGA - 480K Logic Elements

2 Core

--

SoC FPGA

N/A

-

325-TFBGA, FCBGA

325-FCBGA (11x11)

Polystyrene

微芯片技术

56520 LE

-

64 kB

US

EAR99

200

Tray

M2S060

活跃

-

166 MHz

-40°C ~ 100°C (TJ)

SmartFusion®2

Facility Identification

166MHz

64KB

ARM® Cortex®-M3

不发光

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

English

N/A

-

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

M2S010-1FGG484

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.77

233

Tray

M2S010

活跃

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

85 °C

有

0°C ~ 85°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

23 mm

23 mm

N/A

-

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

活跃

366

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

活跃

561

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

活跃

622

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

活跃

366

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

活跃

MCU - 136, FPGA - 372

Tray

0°C ~ 100°C

PolarFire™

-

2.2MB

RISC-V

DMA, PCI, PWM

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

128kB

N/A

-

FBGA-1760

ARM Cortex A53, ARM Cortex R5F

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

+ 100 C

0 C

SMD/SMT

674 I/O

53160 LAB

930300 LE

256 kB

13 Mb

1

850 mV

16 Transceiver

6 Core

N/A

-

FBGA-1517

ARM Cortex A53, ARM Cortex R5F

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

+ 100 C

- 40 C

SMD/SMT

597 I/O

53160 LAB

930300 LE

256 kB

13 Mb

1

720 mV

16 Transceiver

6 Core

N/A

-

BGA-400

ARM Cortex A9

32 kB

866 MHz

+ 100 C

0 C

SMD/SMT

130 I/O

6650 LAB

85000 LE

256 kB

1

32 kB

2 Core

N/A

-

FBGA-784

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

+ 100 C

0 C

SMD/SMT

252 I/O

10980 LAB

192150 LE

256 kB

2.6 Mb

1

850 mV

16 Transceiver

7 Core

N/A

-

FBGA-625

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

+ 100 C

- 40 C

SMD/SMT

180 I/O

5904 LAB

103320 LE

256 kB

1.2 Mb

1

720 mV

7 Core

N/A

-

FBGA-1156

ARM Cortex A53, ARM Cortex R5F

+ 100 C

- 40 C

394 I/O

930300 LE

256 kB

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

SMD/SMT

1

53160 LAB

13 Mb

850 mV

16 Transceiver

6 Core

N/A

-

BGA-485

ARM Cortex A9

32 kB

256 kB

74000 LE

130 I/O

- 40 C

+ 100 C

5775 LAB

1

SMD/SMT

766 MHz

32 kB

2 Core