category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	安装类型	包装/外壳	表面安装	供应商器件包装	终端数量		Core																		厂商																																			操作温度	包装	系列	JESD-609代码	无铅代码	类型	端子表面处理	附加功能	HTS代码	技术	电压 - 供电	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	工作频率	工作电源电压	电源	温度等级	界面	内存大小	速度	内存大小	核心处理器	程序存储器类型	程序内存大小	连接方式	输出功率	建筑学	数据总线宽度	输入数量	座位高度-最大	议定书	总 RAM 位数	筛选水平	功率 - 输出	速度等级	无线电频率系列/标准
EFR32FG23B010F512IM48-CR	Silicon Labs	数据表	N/A	-	最小起订量: 1 最小包装量: 1	QFN-48	ARM Cortex M33	有	SMD/SMT	31 I/O	3.8 V							Details	2 Mbps	1.71 V	4.2 mA	25 mA	- 40 C	+ 125 C	64 kB	RAM	I2C, SPI, UART	78 MHz						Wi-Fi																	868 MHz, 915 MHz, 920 MHz										Flash	512 kB		14 dBm		32 bit											- 96.9 dBm		1 Channel						5					12 bit, 16 bit		6 mm	6 mm	6 mm
EFR32FG23B021F512IM48-CR	Silicon Labs	数据表	N/A	-	最小起订量: 1 最小包装量: 1	QFN-48	ARM Cortex M33	有	SMD/SMT	30 I/O	3.8 V							Details	2 Mbps	1.71 V	4.2 mA	25 mA	- 40 C	+ 125 C	64 kB	RAM	I2C, SPI, UART	78 MHz						Wi-Fi																	922.3 MHz to 928.1 MHz										Flash	512 kB		20 dBm		32 bit											- 110.1 dBm		1 Channel						5					12 bit, 16 bit		6 mm	6 mm	6 mm
ESP8684H4	Espressif Systems	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	QFN-24	24-QFN (4x4)	RISC-V	Espressif Systems	72.2 Mbps	Tape & Reel (TR)	ESP8684	活跃	3.6 V				5000	SMD/SMT	有	120 MHz	GPIO, I2C, SPI, UART	SRAM	272 kB	+ 105 C	- 40 C	370 mA	62 mA	3 V	-40°C ~ 105°C		ESP8684			Bluetooth, Wi-Fi					3V ~ 3.6V						2.402GHz ~ 2.48GHz, 2.412GHz ~ 2.484GHz						2.4 GHz						576KB ROM, 272KB SRAM			Flash	4 MB		20 dBm						802.11b/g/n, Bluetooth v5.0			35dBm		Bluetooth, WiFi		- 106.5 dBm	72.2Mbps	5 Channel		ADC, GPIO, I²C, I²S, PWM, SPI, UART	65mA	300mA ~ 370mA		3	-		14		12 bit		0.85 mm	4 mm	4 mm
XCZU7EV-1FBVB900E4539	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-900	ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2	11 Mbit	28800 LAB	1	Zynq UltraScale+							This product may require additional documentation to export from the United States.	SMD/SMT	600 MHz, 667 MHz, 1.5 GHz	2 x 32 kB, 4 x 32 kB	2 x 32 kB, 4 x 32 kB	-	504000 LE	204 I/O	0 C	+ 100 C	6.2 Mbit			XCZU7EV																					0.85 V										-														16 Transceiver											7 Core
XC7Z020-DIE4812	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	ARM Cortex A9							667 MHz	2 x 32 kB	2 x 32 kB	-		85000 LE	6650 LAB	943	Zynq			XC7Z045																															-																									2 Core
XCZU6CG-1FFVB1156E4979	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-1156	ARM Cortex A53, ARM Cortex R5F	2 x 32 kB, 2 x 32 kB	256 kB	469446 LE	353 I/O	0 C	+ 100 C	6.9 Mb	26825.5 LAB	1						SMD/SMT	2 x 32 kB, 2 x 32 kB																									850 mV																								24 Transceiver											4 Core
CYW4373IUBGT	Infineon Technologies	数据表	N/A	-	最小起订量: 1 最小包装量: 1	WLBGA-128	ARM Cortex M3, ARM Cortex R4	- 20 C	+ 70 C	SMD/SMT	5000	1.26 V						Details	433.3 Mbps	1.14 V		-	-		切割胶带				Bluetooth, Wi-Fi																	2.4 GHz, 5 GHz											768 B		9.5 dBm													- 96.2 dBm
CYW54591RKUBGT	Infineon Technologies	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	WLBGA-194	194-WLBGA (5.16x7.7)	ARM Cortex M4, ARM Cortex R4	Infineon Technologies	SMD/SMT	5000	Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;	活跃	1.26 V				Details	867 Mbps	1.14 V	-	-	- 40 C	+ 85 C	-20°C ~ 70°C (TA)	MouseReel	-			Bluetooth, Wi-Fi					3V ~ 4.8V						2.4GHz, 5GHz						2.4 GHz, 5 GHz						896kB RAM, 896kB ROM				-		13 dBm						802.11a/b/g/-c, Bluetooth v5.0			21dBm		Bluetooth, WiFi		- 98.5 dBm	433.3Mbps			I²S, PCM, UART, USB	-	-			16QAM, 64QAM, 256QAM, BPSK, CCK, DSSS, GFSK, OFDM
CYW20835PB1KML1G	Infineon Technologies	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	60-VFQFN Exposed Pad	60-QFN (7x7)	ARM Cortex M4	Infineon Technologies	3.63 V				Details	6 Mbps	1.7 V	8 mA	18 mA	0 C	+ 70 C	2600	Tray	Discontinued at Digi-Key	0°C ~ 70°C	Tray	AIROC™ Bluetooth			Bluetooth					1.62V ~ 3.63V						2.4GHz						2.4 GHz						384kB RAM, 2MB ROM				2 MB		12 dBm						Bluetooth v5.2			12dBm		Bluetooth		- 94.5 dBm	2Mbps			ADC, I²C, PWM, SPI, UART	8mA	18mA			GFSK		24
M2S005S-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	209	Tray	M2S005	活跃					This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	60	1.2000 V	-40 to 100 °C	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR		128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA									1						FPGA - 5K Logic Modules							1 Core		128KB
M2S060T-1FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	30	1.14 V	85 °C	无	M2S060T-1FCS325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.86		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	176	SmartFusion2	200	Tray	M2S060	活跃	TFBGA, BGA325,21X21,20	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS		BOTTOM	BALL	240	0.5 mm	not_compliant				S-PBGA-B325	200	不合格			1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		200	1.01 mm	现场可编程门阵列											FPGA - 60K Logic Modules			56520			1 Core		256KB			11 mm	11 mm
M2S050-FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	85 °C	无	M2S050-FCS325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	200	Tray	M2S050	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS		BOTTOM	BALL	240	0.5 mm	not_compliant				S-PBGA-B325	200	不合格			1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		200	1.01 mm	现场可编程门阵列											FPGA - 50K Logic Modules			56340			1 Core		256KB			11 mm	11 mm	含铅
M2S050-VFG400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	BGA400,20X20,32	1.2 V	40	1.14 V	有	M2S050-VFG400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76			90	4695 LAB	有	56340 LE	64 kB	-	-	166 MHz	SMD/SMT	Details	This product may require additional documentation to export from the United States.	207	Tray	M2S050	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS		BOTTOM	BALL	250	0.8 mm	compliant				S-PBGA-B400	207	不合格			1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		207	1.51 mm	现场可编程门阵列											FPGA - 50K Logic Modules			56340			1 Core		256KB			17 mm	17 mm
M2S005-1VFG400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	M2S005	活跃	微芯片技术	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	40	1.14 V	有	M2S005-1VFG400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.79			6060 LE	有	505 LAB	90	64 kB	-	-	166 MHz	SMD/SMT	Details	This product may require additional documentation to export from the United States.	1.2000 V	1.14 V	1.26 V	169	Tray	-40 to 100 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS		BOTTOM	BALL	250	0.8 mm	compliant				S-PBGA-B400	171	不合格			1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR		128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		171	1.51 mm	现场可编程门阵列					1					FPGA - 5K Logic Modules				6060			1 Core	128KB				17 mm	17 mm
M2S060T-FGG676I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	676-BGA	676-FBGA (27x27)	ARM Cortex M3	微芯片技术			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	40	SmartFusion2	387	Tray	M2S060	活跃		-40°C ~ 100°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA															FPGA - 60K Logic Modules							1 Core		256KB
M2S050TS-1FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	60	267	Tray	M2S050	活跃		0°C ~ 85°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA															FPGA - 50K Logic Modules							1 Core		256KB
M2S150TS-FCG1152	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	ARM Cortex M3	微芯片技术	1.14 V	85 °C	有	M2S150TS-FCG1152	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.8			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	24	574	Tray	M2S150	活跃	BGA, BGA1152,34X34,40	网格排列	4	PLASTIC/EPOXY	BGA1152,34X34,40	1.2 V	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)			CMOS		BOTTOM	BALL	250	1 mm	compliant		40		S-PBGA-B1152	574	不合格			1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		574	2.9 mm	现场可编程门阵列					STD						FPGA - 150K Logic Modules			146124			1 Core		512KB			35 mm	35 mm
M2S050T-1FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	1.14 V	无	M2S050T-1FCS325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	200	Tray	M2S050	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS		BOTTOM	BALL	240	0.5 mm	not_compliant				S-PBGA-B325	200	不合格			1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		200	1.01 mm	现场可编程门阵列											FPGA - 50K Logic Modules			56340			1 Core		256KB			11 mm	11 mm
M2S010TS-1VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	30	1.14 V	85 °C	无	M2S010TS-1VF400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	90	195	Tray	M2S010	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS		BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B400	195	不合格			1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		195	1.51 mm	现场可编程门阵列											FPGA - 10K Logic Modules			12084			1 Core		256KB			17 mm	17 mm
M2S025T-FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	1.2 V	30	1.14 V	无	M2S025T-FCS325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	176	MSL 3 - 168 hours	180	Tray	M2S025	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS		BOTTOM	BALL	240	0.5 mm	not_compliant				S-PBGA-B325	180	不合格			1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		180	1.01 mm	现场可编程门阵列		592Kbit									FPGA - 25K Logic Modules			27696			1 Core		256KB			11 mm	11 mm
M2S050-FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	有	M2S050-FCSG325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	1.2000 V	200	Tray	M2S050	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	-40 to 100 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS		BOTTOM	BALL	250	0.5 mm	compliant				S-PBGA-B325	200	不合格			1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		200	1.01 mm	现场可编程门阵列					STD						FPGA - 50K Logic Modules			56340			1 Core		256KB			11 mm	11 mm
M2S005-1VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	活跃					This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	90	169	Tray	M2S005	0°C ~ 85°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR		128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA															FPGA - 5K Logic Modules							1 Core		128KB
M2S050TS-1VFG400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	BGA400,20X20,32	1.2 V	40	1.14 V	有	M2S050TS-1VFG400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	90	207	Tray	M2S050	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS		BOTTOM	BALL	250	0.8 mm	compliant				S-PBGA-B400	207	不合格			1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		207	1.51 mm	现场可编程门阵列					1						FPGA - 50K Logic Modules			56340			1 Core		256KB			17 mm	17 mm
M2S150TS-FCSG536I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	ARM Cortex M3	293	Tray	M2S150	活跃	微芯片技术	FBGA-536	网格排列	3	PLASTIC/EPOXY	-40 °C	1.2 V	40	1.14 V	100 °C	有	M2S150TS-FCSG536I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81	Industrial grade			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	90	RISC	1.2, 1.5, 1.8, 2.5, 3.3 V	1	有	-40 to 100 °C	Tray	SmartFusion2	e1	有		Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01			BOTTOM	BALL	250		compliant			536	S-PBGA-B536				1.2 V		INDUSTRIAL	CAN/Ethernet/Serial	166MHz	64 KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	32 Bit			现场可编程门阵列			Industrial							FPGA - 150K Logic Modules						1 Core		512KB		ARM Cortex-M3
M2S050T-1VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	有	4695 LAB	90	1.2000 V	1.14 V	1.26 V	207	Tray	M2S050	活跃					This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	0 to 85 °C	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA									1						FPGA - 50K Logic Modules							1 Core		256KB