category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

所有品牌

产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量		Core											厂商																															操作温度	包装	系列	JESD-609代码	ECCN 代码	端子表面处理	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	座位高度-最大	可编程逻辑类型
M2S060-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	有	4710 LAB	60	SmartFusion2	267	Tray	M2S060	活跃			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	0°C ~ 85°C (TJ)	Tray	SmartFusion2																			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 60K Logic Modules		1 Core	256KB
M2S090TS-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	有	7193 LAB	60	微芯片技术	1.2000 V	267	Tray	M2S090	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	无	M2S090TS-1FG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.78		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	-40 to 100 °C	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B484	267	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列	1	FPGA - 90K Logic Modules	86316	1 Core	512KB	23 mm	23 mm
M2S090TS-1FG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	64 kB	86316 LE	有	7193 LAB	60	微芯片技术	0.892167 oz	267	Tray	M2S090	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	-55 °C	1.2 V	30	1.14 V	125 °C	无	M2S090TS-1FG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e0	3A001.A.2.C	Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B484	267	不合格		1.2 V	MILITARY	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列		FPGA - 90K Logic Modules	86316	1 Core	512KB	23 mm	23 mm
M2S060-VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	207	Tray	M2S060	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S060-VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	90	SmartFusion2	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant		S-PBGA-B400	207	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列		FPGA - 60K Logic Modules	56520	1 Core	256KB	17 mm	17 mm
M2S005-TQG144I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-144	144-TQFP (20x20)	ARM Cortex M3	微芯片技术	1.26 V	Tray	M2S005	活跃				Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	84 I/O	- 40 C	+ 100 C	191 kbit	有	505 LAB	60	0.046530 oz	1.2000 V	1.14 V	-40 to 100 °C	Tray	SmartFusion2																1.2 V			166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				STD	FPGA - 5K Logic Modules		1 Core	128KB
M2S025TS-VFG256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LBGA	256-FPBGA (17x17)	ARM Cortex M3	微芯片技术	119	138	Tray	M2S025	活跃			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 25K Logic Modules		1 Core	256KB
M2S010T-1VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	64 kB	12084 LE	有	1007 LAB	90	微芯片技术	2.5, 3.3 V	1.14 V	1.26 V	195	Tray	M2S010	活跃	LFBGA	M2S010T-1VFG400	有	85 °C	1.14 V	1.2 V	BGA400,20X20,32	PLASTIC/EPOXY	3	GRID ARRAY, LOW PROFILE, FINE PITCH	VFBGA-400	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	0 to 85 °C	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	40	S-PBGA-B400	195	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	195	1.51 mm	现场可编程门阵列	1	FPGA - 10K Logic Modules	12084	1 Core	256KB	17 mm	17 mm
M2S060T-FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	YES	484-FPBGA (23x23)	484	ARM Cortex M3	有	4710 LAB	60	SmartFusion2	微芯片技术	1.2000 V	1.14 V	1.26 V	267	Tray	M2S060	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	有	M2S060T-FGG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.8	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	-40 to 100 °C	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant		S-PBGA-B484	267	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列	STD	FPGA - 60K Logic Modules	56520	1 Core	256KB	23 mm	23 mm
M2S005S-VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	有	505 LAB	90	169	Tray	M2S005	活跃				This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	6060 LE	0°C ~ 85°C (TJ)	Tray	SmartFusion2																			166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 5K Logic Modules		1 Core	128KB
M2S090TS-FGG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BGA	YES	676-FBGA (27x27)	676	ARM Cortex M3	40	425	微芯片技术	Tray	M2S090	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	40	1.14 V	85 °C	有	M2S090TS-FGG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant		S-PBGA-B676	425	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425	2.44 mm	现场可编程门阵列		FPGA - 90K Logic Modules	86316	1 Core	512KB	27 mm	27 mm
M2S025TS-1VFG256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LBGA	256-FPBGA (17x17)	ARM Cortex M3	微芯片技术	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 25K Logic Modules		1 Core	256KB
M2S060TS-FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	64 kB	56520 LE	有	4710 LAB	60	SmartFusion2	267	Tray	M2S060	活跃				This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 60K Logic Modules		1 Core	256KB
M2S010-1FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	有	1007 LAB	60	微芯片技术	1.2000 V	233	Tray	M2S010	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	有	M2S010-1FGG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.27		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	-40 to 100 °C	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant		S-PBGA-B484	233	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	233	2.44 mm	现场可编程门阵列	1	FPGA - 10K Logic Modules	12084	1 Core	256KB	23 mm	23 mm
M2S150-1FCV484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	484-FBGA (19x19)	ARM Cortex M3	微芯片技术	64 kB	146124 LE	有	12177 LAB	84	1.2000 V	273	Tray	M2S150	活跃				This product may require additional documentation to export from the United States.	N	166 MHz	-	-	-40 to 100 °C	Tray	SmartFusion2																			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				1	FPGA - 150K Logic Modules		1 Core	512KB
M2S150-1FCV484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	484-FBGA (19x19)	ARM Cortex M3	微芯片技术	有	12177 LAB	84	273	Tray	M2S150	活跃				This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	0°C ~ 85°C (TJ)	Tray	SmartFusion2																			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 150K Logic Modules		1 Core	512KB
M2S005-1VF256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-256	YES	256-FPBGA (14x14)	256	ARM Cortex M3	119	微芯片技术	161	Tray	M2S005	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	30	1.14 V	无	M2S005-1VF256I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant		S-PBGA-B256	161	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	161	1.56 mm	现场可编程门阵列		FPGA - 5K Logic Modules	6060	1 Core	128KB	14 mm	14 mm
M2S005-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	60	1.2000 V	1.14 V	1.26 V	209	Tray	M2S005	活跃			0 to 85 °C	Tray	SmartFusion2																			166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				1	FPGA - 5K Logic Modules		1 Core	128KB
M2S025-1VFG256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LBGA	256-FPBGA (17x17)	ARM Cortex M3	微芯片技术	119	138	Tray	M2S025	活跃			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 25K Logic Modules		1 Core	256KB
M2S005S-1VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-256	256-FPBGA (14x14)	ARM Cortex M3	微芯片技术	-	64 kB	6060 LE	有	505 LAB	119	161	Tray	M2S005	活跃				This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2																			166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 5K Logic Modules		1 Core	128KB
M2S025TS-FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	325-FCBGA (11x11)	ARM Cortex M3	微芯片技术	176	180	活跃	M2S025	Tray			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	0°C ~ 85°C (TJ)	Tray	SmartFusion2																			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 25K Logic Modules		1 Core	256KB
M2S010T-FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	12084 LE	有	1007 LAB	60	微芯片技术	1.2000 V	233	Tray	M2S010	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S010T-FG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	0 to 85 °C	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B484	233	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	233	2.44 mm	现场可编程门阵列	STD	FPGA - 10K Logic Modules	9744	1 Core	256KB	23 mm	23 mm
M2S060T-1VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	207	Tray	M2S060	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S060T-1VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	90	SmartFusion2	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant		S-PBGA-B400	207	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列		FPGA - 60K Logic Modules	56520	1 Core	256KB	17 mm	17 mm
M2S090T-1FGG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	86316 LE	有	7193 LAB	60	微芯片技术	267	Tray	M2S090	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	-55 °C	1.2 V	40	1.14 V	125 °C	有	M2S090T-1FGG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.78		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e1	3A001.A.2.C	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant		S-PBGA-B484	267	不合格		1.2 V	MILITARY	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列		FPGA - 90K Logic Modules	86316	1 Core	512KB	23 mm	23 mm
M2S010TS-VF256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	VFPBGA-256	YES	256-FPBGA (14x14)	256	ARM Cortex M3	微芯片技术	138	Tray	M2S010	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	30	1.14 V	无	M2S010TS-VF256I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	119	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant		S-PBGA-B256	138	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	现场可编程门阵列		FPGA - 10K Logic Modules	12084	1 Core	256KB	14 mm	14 mm
M2S025TS-FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	176	微芯片技术	180	Tray	M2S025	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	有	M2S025TS-FCSG325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81	This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant		S-PBGA-B325	180	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.01 mm	现场可编程门阵列		FPGA - 25K Logic Modules	27696	1 Core	256KB	11 mm	11 mm