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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 触点镀层 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 房屋材料 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 终端 | 温度系数 | 类型 | 端子表面处理 | 颜色 | 性别 | HTS代码 | 电容量 | 子类别 | 螺距 | 技术 | 端子位置 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度（摄氏度） | 端子间距 | 深度 | Reach合规守则 | 终端样式 | JESD-30代码 | 输出的数量 | 资历状况 | 电介质 | 电源 | 配置 | 注意 | 电压 | 端口的数量 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 工作温度范围 | 主要属性 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 闪光大小 | 产品 | 安装角 | USOC编码 | 产品类别 | 高度 | 座位高度(最大) | 长度 | 宽度 | 可燃性等级 | ||||||||||||||||||||||||||||||||||||||||||||
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 | XCZU48DR-2FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Amphenol Commercial Products | Amphenol | 125 | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Reel | Zynq® UltraScale+™ RFSoC | Modular Connectors / Ethernet Connectors | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Modular Connectors / Ethernet Connectors | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Modular Connectors / Ethernet Connectors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-1FFVG1517E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1111 (2828 metric) | 1517-FCBGA (40x40) | AMD 赛灵思 | 1111 | 500 V | 561 | Tray | 活跃 | Details | ATC / KYOCERA AVX | KYOCERA AVX | 1000 | - 55 C | + 125 C | P90 | 2828 | 0°C ~ 100°C (TJ) | Reel | 100B | 0.25 pF | 90 PPM / C | High Q, Low ESR/ESL Porcelain Superchip Capacitor | 3.9 pF | Capacitors | SMD/SMT | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Silicon RF Capacitors / Thin Film | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | RF/Microwave Multilayer Capacitors (MLC) | Silicon RF Capacitors / Thin Film | 2.59 mm | 2.79 mm | 2.79 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU46DR-2FFVH1760I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD 赛灵思 | 5 | Positronic | Amphenol Positronic | 574 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | D-Sub Connectors | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Mixed Contact D-Sub Connectors | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | D-Sub Mixed Contact Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB014R24D2I2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | - | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU5CG-1SFVC784E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | Molex | Bulk | 221050 | 活跃 | 252 | 0°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-1CS288I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 288 | SQUARE | TFBGA | 100 MHz | A2F060M3E-1CS288I | 1 | 155523-4500 | ITT Cannon | ITT Cannon | Details | TFBGA, BGA288,21X21,20 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA288,21X21,20 | 1.5 V | 20 | 1.425 V | 无 | 5.24 | 1.575 V | MICROSEMI CORP | Obsolete | e0 | 锡铅银 | 8542.39.00.01 | Circular Connectors | CMOS | BOTTOM | BALL | 235 | 0.5 mm | compliant | S-PBGA-B288 | 68 | 不合格 | 1.5,1.8,2.5,3.3 V | 68 | 1536 CLBS, 60000 GATES | 1.05 mm | 现场可编程门阵列 | 军规圆形连接器 | 1536 | 1536 | 60000 | 军规圆形连接器 | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-1FFVG1517E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | 561 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-2FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z035-L2FFG676I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 0805 (2012 metric) | 676-FCBGA (27x27) | AMD | - 55 C | 1000 | Vishay | 500 VDC | Vishay / Vitramon | N | Class 1 | 130 | Tray | XC7Z035 | 活跃 | AEC-Q200 | 0805 | 2012 | + 150 C | -40°C ~ 100°C (TJ) | Reel | VJ....32 | 0.1 pF | Standard | Lead-Bearing Finish MLCCs | 3.3 pF | Capacitors | SMD/SMT | C0G (NP0) | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 陶瓷电容器 | Kintex™-7 FPGA, 275K Logic Cells | - | 通用型MLCC | Multilayer Ceramic Capacitors MLCC - SMD/SMT | 1.45 mm | 2 mm | 1.25 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA008R24C2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 1 | Advanced Energy | Advanced Energy | 576 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | DC-DC Converter | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Non-Isolated DC-DC Converters | FPGA - 764K Logic Elements | - | Non-Isolated DC/DC Converters | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB006R16A2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Gold | - | - | Thermoplastic polyester | Intel | 0 C | + 70 C | 384 | Tray | 活跃 | Amphenol Commercial Products | Amphenol | 磷青铜 | 8P8C | 450 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 磁性千斤顶 | Black | Jack (Female) | Modular Connectors / Ethernet Connectors | Shielded | 焊针 | 1x1 | 1 Port | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Modular Connectors / Ethernet Connectors | 0 C to + 70 C | FPGA - 573K Logic Elements | - | Connectors | 直角 | RJ45 | Modular Connectors / Ethernet Connectors | UL 94V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB022R31C2I1VAA | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 720 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVP1502-2MLEVSVA3340 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3340-BFBGA | 3340-BGA (55x55) | AMD | 3 | 无 | IP65/IP67 | With screws | 3 | 无 | Fix mounted | 486 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal® Premium | 56.9 | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Premium FPGA, 3.7M Logic Cells | - | 25.4 | 44.5 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-L1FFVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Triple Quick-Connect, Ground Lug | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | BARKER MICROFARADS INC | Y | 561 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-1FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | SMD | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | ECE/EXCEL CELL ELECTRONIC CORP | Y | 561 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 101.5mm (3.996 x 14.5mm (0.571in) W | 10 Amp, 300 VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 16mm (0.630in) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-L1FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Triple Quick-Connect, w/Resistor | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | BARKER MICROFARADS INC | Y | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-L2FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | SMD | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | Y | ECE/EXCEL CELL ELECTRONIC CORP | 561 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 106.5mm (4.193 x 14.5mm (0.571in) W | 10 Amp, 300 VAC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 16mm (0.630in) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-1FSVE1156E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Triple Quick-Connect, w/Bracket | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 366 | Tray | 活跃 | 0°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU49DR-L1FFVF1760I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Triple Quick-Connect, no accessories | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 622 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-L1FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in QUAD Quick Connect, w/Resistor | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-1FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in QUAD Quick Connect, w/Stud Can | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 561 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-L1FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Combos: 2, 3 or 4, Ground Lug | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-1FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in QUAD Quick Connect, Ground Lug | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-L2FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Term: ¼in Solder Lug Quick-Connect, Ground Lug | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 366 | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | ±3% | 405uF | 370VAC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB008R16A2I1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 有 | PCB | 384 | Tray | -40°C ~ 100°C (TJ) | COMBICON MKKDS | 5 mm | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - |
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XCZU48DR-2FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
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XCZU47DR-1FFVG1517E
Xilinx
分类:Embedded - System On Chip (SoC)
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XCZU46DR-2FFVH1760I
Xilinx
分类:Embedded - System On Chip (SoC)
-
AGFB014R24D2I2V
Intel
分类:Embedded - System On Chip (SoC)
-
XCZU5CG-1SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
-
A2F060M3E-1CS288I
Microchip
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-1FFVG1517E
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU47DR-2FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XC7Z035-L2FFG676I
AMD
分类:Embedded - System On Chip (SoC)
-
AGFA008R24C2I3V
Intel
分类:Embedded - System On Chip (SoC)
-
AGFB006R16A2E3V
Intel
分类:Embedded - System On Chip (SoC)
-
AGFB022R31C2I1VAA
Intel
分类:Embedded - System On Chip (SoC)
-
XCVP1502-2MLEVSVA3340
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU47DR-L1FFVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU47DR-1FSVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU47DR-L1FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-L2FSVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-1FSVE1156E
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU49DR-L1FFVF1760I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-L1FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-1FSVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-L1FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-1FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-L2FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
AGFB008R16A2I1V
Intel
分类:Embedded - System On Chip (SoC)