category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	安装类型	包装/外壳	表面安装	越来越多的功能	引脚数	外壳材料	供应商器件包装	材料	插入材料	终端数量	后壳材料，电镀						Core												厂商																																								操作温度	包装	系列	JESD-609代码	无铅代码	终端	ECCN 代码	连接器类型	类型	定位的数量	端子表面处理	最高工作温度	最小工作温度	颜色	应用	附加功能	HTS代码	紧固类型	子类别	额定电流	技术	端子位置	方向	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	入口保护	端子间距	Reach合规守则	外壳完成	引脚数量	外壳尺寸-插入	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	速度	内存大小	外壳尺寸，MIL	uPs/uCs/外围ICs类型	核心处理器	周边设备	程序内存大小	连接方式	电缆开口
M2S025T-FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	1.14 V	1.26 V	267	Tray	微芯片技术	M2S025	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S025T-FG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87									This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	60	1.2000 V	0 to 85 °C	Tray	SmartFusion2	e0							Tin/Lead (Sn/Pb)						8542.39.00.01				CMOS	BOTTOM		BALL		240		1 mm	not_compliant				S-PBGA-B484	267	不合格		1.2 V	OTHER	166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA	267		2.44 mm	现场可编程门阵列			STD		FPGA - 25K Logic Modules		23988	1 Core		256KB			23 mm	23 mm
M2S150TS-FCS536	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	ARM Cortex M3	微芯片技术	30	1.14 V	85 °C	无	M2S150TS-FCS536	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84									This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	90	293	Tray	M2S150	活跃	FBGA-536	网格排列	PLASTIC/EPOXY	1.2 V	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	无						Tin/Lead (Sn/Pb)						8542.39.00.01					BOTTOM		BALL		240			not_compliant				S-PBGA-B536					OTHER	166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA				现场可编程门阵列			STD		FPGA - 150K Logic Modules			1 Core		512KB
M2S005S-VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	3	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	40	1.14 V	85 °C	有	M2S005S-VFG400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.82									This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	90	169	Tray	M2S005	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1							Tin/Silver/Copper (Sn/Ag/Cu)						8542.39.00.01				CMOS	BOTTOM		BALL		250		0.8 mm	compliant				S-PBGA-B400	171	不合格		1.2 V	OTHER	166MHz	64KB			ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA	171		1.51 mm	现场可编程门阵列					FPGA - 5K Logic Modules		6060	1 Core		128KB			17 mm	17 mm
M2S010TS-1FGG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	FBGA-484	微芯片技术	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	-55 °C	1.2 V	40	1.14 V	125 °C	有	M2S010TS-1FGG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.82								This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	60	233	Tray	M2S010	活跃	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e1			3A001.A.2.C				Tin/Silver/Copper (Sn/Ag/Cu)						8542.39.00.01				CMOS	BOTTOM		BALL		250		1 mm	compliant				S-PBGA-B484	233	不合格		1.2 V	MILITARY	166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA	233		2.44 mm	现场可编程门阵列					FPGA - 10K Logic Modules		12084	1 Core		256KB			23 mm	23 mm
M2S090TS-1FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	微芯片技术	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	有	M2S090TS-1FCSG325I	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.81									This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	180	Tray	M2S090	活跃	FBGA-325	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1							Tin/Silver/Copper (Sn/Ag/Cu)					LG-MIN, WD-MIN	8542.39.00.01				CMOS	BOTTOM		BALL		250		0.5 mm	compliant				R-PBGA-B325	180	不合格		1.2 V		166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA	180		1.16 mm	现场可编程门阵列					FPGA - 90K Logic Modules		86316	1 Core		512KB			13.5 mm	11 mm
M2S005S-1VFG400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	-	64 kB	6060 LE	有	505 LAB	90	169	Tray	M2S005	活跃											This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																																				166MHz	64KB			ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA									FPGA - 5K Logic Modules			1 Core		128KB
M2S060-FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	M2S060	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	无	M2S060-FCS325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84							This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	176	SmartFusion2	1.2000 V	1.14 V	1.26 V	200	Tray	-40 to 100 °C	Tray	SmartFusion2	e0							Tin/Lead (Sn/Pb)	100 °C	-40 °C			LG-MIN, WD-MIN	8542.39.00.01				CMOS	BOTTOM		BALL		240		0.5 mm	not_compliant				S-PBGA-B325	200	不合格	1.2 V	1.2 V		166MHz	164.3 kB			ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA	200		1.01 mm	现场可编程门阵列			STD		FPGA - 60K Logic Modules		56520	1 Core		256KB			11 mm	11 mm
M2S050-FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	325-FCBGA (11x11)	ARM Cortex M3	微芯片技术	56340 LE	有	4695 LAB	176	200	Tray	M2S050	活跃										This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																																				166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA									FPGA - 50K Logic Modules			1 Core		256KB
M2S025TS-VF256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LFBGA	YES	256-FPBGA (14x14)	256	ARM Cortex M3	微芯片技术	无	M2S025TS-VF256I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87								This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	1.2 V	30	1.14 V	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	无						Tin/Lead (Sn/Pb)					LG-MIN, WD-MIN	8542.39.00.01					BOTTOM		BALL		240		0.8 mm	not_compliant				S-PBGA-B256						166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA			1.56 mm	现场可编程门阵列					FPGA - 25K Logic Modules			1 Core		256KB			14 mm	14 mm
M2S150T-FC1152	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FCBGA (35x35)	ARM Cortex M3	微芯片技术	有	12177 LAB	24	574	Tray	M2S150	活跃											This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	0°C ~ 85°C (TJ)	Tray	SmartFusion2																																				166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA							STD		FPGA - 150K Logic Modules			1 Core		512KB
M2S150T-FC1152I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1152	1152-FCBGA (35x35)	ARM Cortex M3	微芯片技术	-	64 kB	146124 LE	有	12177 LAB	24	574	Tray	M2S150	活跃											This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																																				166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA									FPGA - 150K Logic Modules			1 Core		512KB
M2S010TS-1FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	-	64 kB	12084 LE	有	1007 LAB	60	233	Tray	M2S010	活跃											This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																																				166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA									FPGA - 10K Logic Modules			1 Core		256KB
M2S060-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	有	4710 LAB	60	SmartFusion2	267	Tray	M2S060	活跃										This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	0°C ~ 85°C (TJ)	Tray	SmartFusion2																																				166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA									FPGA - 60K Logic Modules			1 Core		256KB
M2S090TS-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	活跃	微芯片技术	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	无	M2S090TS-1FG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.78									This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	60	1.2000 V	267	Tray	M2S090	-40 to 100 °C	Tray	SmartFusion2	e0							Tin/Lead (Sn/Pb)						8542.39.00.01				CMOS	BOTTOM		BALL		240		1 mm	not_compliant				S-PBGA-B484	267	不合格		1.2 V		166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA	267		2.44 mm	现场可编程门阵列			1		FPGA - 90K Logic Modules		86316	1 Core		512KB			23 mm	23 mm
M2S025-FG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	Panel Mount, Through Hole	484-BGA	Flange	Aluminum	484-FPBGA (23x23)	-	-	Amphenol Aerospace Operations	-	Bulk	Metal	TVP00DT	活跃		Copper Alloy	Gold	Non-Compliant	267					-65°C ~ 175°C		MIL-DTL-38999 Series III, Tri-Start™ HD			Solder		Receptacle, Male Pins		55				-	Military			Threaded		-			A		Shielded		抗环境干扰			Durmalon™		15-55							166MHz	64KB	-		ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	-		MCU, FPGA									FPGA - 25K Logic Modules					256KB	校准盘				50.0µin (1.27µm)	-
M2S050-1VF400	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	Polystyrene	400	微芯片技术	5.84	1.26 V	MICROSEMI CORP	活跃	SQUARE	LFBGA	无	85 °C	1.14 V	30	1.2 V	BGA400,20X20,32	PLASTIC/EPOXY								119817	Brady	1.2000 V	1.14 V	1.26 V		207	Tray	M2S050	活跃	-	166 MHz	56340 LE	SMD/SMT	-	64 kB	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	0 to 85 °C		SmartFusion®2	e0					Fire/Emergency Signs		Tin/Lead (Sn/Pb)						8542.39.00.01		现场可编程门阵列		CMOS	BOTTOM		BALL		240		0.8 mm	not_compliant				S-PBGA-B400	160	不合格		1.2 V	OTHER	166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA	160		1.51 mm	现场可编程门阵列			1	Emergency Fire Alarm	FPGA - 50K Logic Modules		48672	1 Core		256KB			17 mm	17 mm
BCM33843EUKFSBGB0T	Broadcom	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Broadcom Limited									ACH580-BCR-017A-2+E213+K451+L501	ABB	Obsolete	Tray	-				-		-																																				2.4GHz, 5GHz	-			-	-		-			-									-					-
MSCMMX6XYCM08AA	NXP	数据表	N/A	-	最小起订量: 1 最小包装量: 1		,	MSCMMX6XYCM08AA	恩智浦半导体	Obsolete	NXP SEMICONDUCTORS	5.77	Industrial grade														BGA	Microprocessor	无	有	表面贴装																	8542.31.00.01												unknown		265											MICROPROCESSOR, RISC						MSCMMX6XYCM08							Industrial
A2F060M3E-FG256	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	256		LBGA,	GRID ARRAY, LOW PROFILE	3	PLASTIC/EPOXY	1.5 V		20	1.425 V	85 °C	无	A2F060M3E-FG256	LBGA	SQUARE	Microsemi Corporation	Obsolete	MICROSEMI CORP	1.575 V		5.88													e0							Tin/Lead (Sn/Pb)						8542.39.00.01				CMOS	BOTTOM		BALL		225		1 mm	compliant				S-PBGA-B256					OTHER													1536 CLBS, 60000 GATES	1.7 mm	现场可编程门阵列						1536			60000				17 mm	17 mm
A2F060M3E-FG256I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	256				1 MM PITCH, FBGA-256	GRID ARRAY, LOW PROFILE	3	PLASTIC/EPOXY	BGA256,16X16,40		1.5 V	20	1.425 V	无	A2F060M3E-FG256I	80 MHz	LBGA	SQUARE	Microsemi Corporation	Obsolete	MICROSEMI CORP		1.575 V	8.76											e0							Tin/Lead (Sn/Pb)						8542.39.00.01		现场可编程门阵列		CMOS	BOTTOM		BALL		225		1 mm	unknown				S-PBGA-B256	66	不合格		1.5,1.8,2.5,3.3 V													66	1536 CLBS, 60000 GATES	1.7 mm	现场可编程门阵列						1536	1536		60000				17 mm	17 mm
M2S025-VFG256I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LBGA	256-FPBGA (17x17)	微芯片技术	活跃										1.2000 V	1.14 V	1.26 V	8542390000	Non-Compliant		有	-	166 MHz	27696 LE	138 I/O	+ 100 C	0.241494 oz	- 40 C	119	SMD/SMT	2308 LAB	Microchip	Microchip Technology / Atmel	-	64 kB	Tray	M2S025	-40 to 100 °C	Tray	SmartFusion2																SOC - Systems on a Chip																	1.2 V			166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA					SoC FPGA		STD		FPGA - 25K Logic Modules			1 Core		256KB		SoC FPGA
A2F200M3F-1CSG288I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	288-TFBGA, CSPBGA	288-CSP (11x11)	微芯片技术		1.5000 V	1.425 V	200000	1.575 V	MCU - 31, FPGA - 78		Tray	A2F200	活跃										-40 to 100 °C		SmartFusion®																																				100MHz	64KB			ARM® Cortex®-M3	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, SPI, UART/USART			MCU, FPGA							1		ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops					256KB
M2S025-FCSG325I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	325-FCBGA (11x11)	微芯片技术	SMD/SMT	-	64 kB											180	Tray	M2S025	活跃	-		166 MHz	27696 LE	+ 100 C	- 40 C	-40°C ~ 100°C (TJ)		SmartFusion®2																																	1.2 V			166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA									FPGA - 25K Logic Modules			1 Core		256KB
M2S060TS-1FGG484T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	微芯片技术					267	Tray	M2S060	活跃								-40°C ~ 125°C (TJ)		Automotive, AEC-Q100, SmartFusion®2																																				166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA							1		FPGA - 60K Logic Modules					256KB
M2S025TS-1FGG484T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	微芯片技术									1.2000 V	267	Tray	M2S025	活跃				0 to 85 °C		Automotive, AEC-Q100, SmartFusion®2																																				166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA							1		FPGA - 25K Logic Modules					256KB