类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 触点镀层 | 安装类型 | 包装/外壳 | 表面安装 | 越来越多的功能 | 外壳材料 | 供应商器件包装 | 材料 | 介电材料 | 插入材料 | 本体材质 | 终端数量 | 外壳材料,完成 | 表面贴装的焊盘尺寸 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 终止次数 | 终端 | 温度系数 | 连接器类型 | 类型 | 电阻 | 定位的数量 | 组成 | 颜色 | 应用 | 行数 | 功率(瓦特) | HTS代码 | 电容量 | 紧固类型 | 子类别 | 触点类型 | 额定电流 | 技术 | 端子位置 | 方向 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度(摄氏度) | 入口保护 | 端子间距 | Reach合规守则 | 频率 | 频率稳定性 | 外壳完成 | 外壳尺寸-插入 | 触点表面处理 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | ESR(等效串联电阻) | 失败率 | 引线间距 | 电源 | 触点样式 | 线规 | 温度等级 | 法兰特性 | 密封 | 极化 | 负载电容 | 阻抗 | 连接器样式 | 速度 | 内存大小 | 纹波电流@低频 | 操作模式 | 核心处理器 | 纹波电流@高频 | 频率容差 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 触点形式 | 外壳尺寸,连接器布局 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 速度等级 | 后退间距 | 收发器数量 | 主要属性 | 外壳电镀 | 逻辑单元数 | 核数量 | 闪光大小 | 特征 | 产品类别 | 收缩率 | 座位高度(最大) | 长度 | 宽度 | 触点表面处理厚度 | 材料可燃性等级 | 评级结果 | |||||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | AGIB027R31B2E3VR0 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 720 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-1FG256IX94 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 50 microinches Gold Plate | Wall - Front Mount - Thru Holes | 不锈钢 | Hard Dielectric | 53#20 | I | H53 | Copper Alloy | 有 | Socket | Meets IP67 | 化学镍 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS016C4U19E3LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | YES | 484-UBGA (19x19) | 484 | 1 | SMD/SMT | 20000 LAB | 964677 | Intel | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | FBGA, BGA484,22X22,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA484,22X22,32 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS016C4U19E3LG | FBGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.47 | 192 | Non-Compliant | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 160000 LE | 0.423288 oz | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | S-PBGA-B484 | 192 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | 3.25 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | SoC FPGA | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA008R16A2E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Polyolefin | Intel | 0.41 | 0.64 | 1.98 | 384 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | TUBING | Clear | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | 3:1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6EG-3FFVB1156E | AMD | 数据表 | 244 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Metal | AMD | 328 | Tray | XCZU6 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA019R25A2I2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 480 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA019R25A3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 480 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-L1SFVA625I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 活跃 | 180 | Tray | XCZU3 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z012S-1CLG485I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | Radial, Can - SMD | 485-CSPBGA (19x19) | 0.260 L x 0.260 W (6.60mm x 6.60mm) | United Chemi-Con | 2000 Hrs @ 105°C | 150 | XC7Z012 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 6.3 V | -55°C ~ 105°C | Alchip™- MZA | 0.248 Dia (6.30mm) | ±20% | 汽车 | 100 µF | - | - | Polar | 360 mOhms | 667MHz | 256KB | 96 mA @ 120 Hz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 240 mA @ 100 kHz | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Artix™-7 FPGA, 55K Logic Cells | - | 0.240 (6.10mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048K1F35E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1206 (3216 Metric) | 1206 | KOA Speer Electronics, Inc. | 396 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | RN73H2B | 活跃 | -55°C ~ 155°C | Tray | RN73H | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.1% | Discontinued at Digi-Key | 2 | ±10ppm/°C | 94.2 Ohms | Metal Film | 0.25W, 1/4W | - | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 480K Logic Elements | -- | Automotive AEC-Q200, Moisture Resistant | 0.028 (0.70mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K2F35E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Panel Mount, Through Hole | 1152-BBGA, FCBGA | YES | Flange | Aluminum | 1152-FBGA (35x35) | 1152 | Glenair | 0.93 V | 5.66 | 零售包装 | Metal | 活跃 | Copper Alloy | Gold | 396 | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS066K2F35E1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | -65°C ~ 175°C | Tray | 806 | Discontinued at Digi-Key | Solder | Receptacle, Female Sockets | Silver | 8542.39.00.01 | Threaded | 现场可编程门阵列 | CMOS | BOTTOM | D | BALL | 未说明 | 1 mm | compliant | 化学镍 | S-PBGA-B1152 | 396 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | FPGA - 660K Logic Elements | 660000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX280LH3F55E2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-2912 | PEI-Genesis | 4 x 32 kB | - | Bulk | 活跃 | 1160 | 有 | This product may require additional documentation to export from the United States. | 4 x 32 kB | 1 GHz | 2800000 LE | + 100 C | 0 C | 10 | SMD/SMT | 350000 LAB | 956209 | Intel | Intel / Altera | Stratix | Details | 0°C ~ 100°C (TJ) | Tray | * | 活跃 | SOC - Systems on a Chip | 0.85 V | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 2800K Logic Elements | 4 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX280LN3F43I1VG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Axial | Axial | Stackpole Electronics Inc | Bulk | 活跃 | 688 | -55°C ~ 155°C | Tray | RNF | 0.108 Dia x 0.344 L (2.75mm x 8.75mm) | ±1% | 活跃 | 2 | ±100ppm/°C | 825 kOhms | Metal Film | 0.5W, 1/2W | - | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | -- | Flame Retardant Coating, Safety | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K2F40E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FBGA (40x40) | ITT Cannon, LLC | 696 | Bulk | KJB6T | 活跃 | 0°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 660K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX280LN3F43I3VG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | KYOCERA AVX | Bulk | 活跃 | 688 | -40°C ~ 100°C (TJ) | Tray | * | 活跃 | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K2F35E1HG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Panel Mount, Through Hole | 1152-BBGA, FCBGA | Flange | 不锈钢 | 1152-FBGA (35x35) | SMD/SMT | 24 | 0 C | + 100 C | Glenair | 660000 LE | 1.2 GHz | 2 x 32 kB | This product may require additional documentation to export from the United States. | 有 | 有 | 10AS066K2F35E1HG | 活跃 | INTEL CORP | 5.66 | 零售包装 | Metal | 活跃 | Copper Alloy | Gold | 396 | - | 2 x 32 kB | Details | Arria 10 SoC | Intel / Altera | Intel | 967066 | 82500 LAB | -65°C ~ 175°C | Tray | 806 | 活跃 | Solder | Plug, Male Pins | Silver | Threaded | SOC - Systems on a Chip | A | unknown | Passivated | 25-5 | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | Ground | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057H3F34I2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Panel Mount, Through Hole | 1152-BBGA, FCBGA | YES | Flange | Aluminum | 1152-FCBGA (35x35) | 1152 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 570000 LE | 24 | SMD/SMT | 71250 LAB | 964914 | Intel | Intel / Altera | Arria 10 SoC | Glenair | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057H3F34I2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | 零售包装 | Metal | 活跃 | Copper Alloy | Gold | 492 | -65°C ~ 175°C | Tray | 806 | 活跃 | Solder | Receptacle, Female Sockets | 橄榄色 | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | CMOS | BOTTOM | E | BALL | 未说明 | 1 mm | compliant | 橄榄色镉 | 40-5 | S-PBGA-B1152 | 492 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | Ground | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057K4F40I3LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 面板安装 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | Liquid Crystal Polymer (LCP) | 1517 | Aluminum, Yellow Chromate Plated Cadmium | 2 x 32 kB | 1.2 GHz | 570000 LE | 21 | SMD/SMT | 71250 LAB | 978972 | Intel | Intel / Altera | Arria 10 SoC | ITT Cannon, LLC | Details | 2 x 32 kB | - | BGA, | 网格排列 | PLASTIC/EPOXY | -40 °C | 0.9 V | 0.87 V | 100 °C | 有 | 10AS057K4F40I3LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | - | Bulk | MDM-5 | 活跃 | Copper Alloy | 696 | 有 | This product may require additional documentation to export from the United States. | -55°C ~ 125°C | Tray | 83513-Style Micro D Metal Shell (MDM) | 活跃 | 焊杯 | Plug, Male Pins | 51 | - | 3 | 8542.39.00.01 | SOC - Systems on a Chip | Signal | 3A | BOTTOM | BALL | - | 1 mm | compliant | Gold | S-PBGA-B1517 | - | INDUSTRIAL | Cable Side, Male Jackscrew (2-56) | D-Type, Micro-D | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 0.050 Pitch x 0.043 Row to Row | 3.5 mm | 现场可编程门阵列 | SoC FPGA | - | FPGA - 570K Logic Elements | 2 Core | -- | Shielded | SoC FPGA | 40 mm | 40 mm | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057H3F34E2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 570000 LE | 24 | SMD/SMT | 71250 LAB | 964913 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | PEI-Genesis | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 5.45 | 0.93 V | INTEL CORP | 活跃 | SQUARE | BGA | 10AS057H3F34E2SG | 有 | 100 °C | Bulk | 活跃 | 492 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 0°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 492 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032H3F34E2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | 1.2 GHz | 320000 LE | 1 | SMD/SMT | 40000 LAB | 964899 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | PEI-Genesis | 5.45 | 0.93 V | INTEL CORP | 活跃 | SQUARE | BGA | 10AS032H3F34E2LG | 有 | 100 °C | 0.87 V | 未说明 | 0.9 V | BGA1152,34X34,40 | PLASTIC/EPOXY | 网格排列 | BGA, BGA1152,34X34,40 | Bulk | 活跃 | 384 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 0°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K2F35I2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 0603 (1608 Metric) | YES | 0603 | 1152 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | 24 | SMD/SMT | 82500 LAB | 973537 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | KOA Speer Electronics, Inc. | - | 0.93 V | 5.46 | INTEL CORP | 活跃 | SQUARE | BGA | 10AS066K2F35I2SG | 有 | 100 °C | 0.87 V | 未说明 | 0.9 V | -40 °C | BGA1152,34X34,40 | PLASTIC/EPOXY | 网格排列 | BGA, BGA1152,34X34,40 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | RN73R1J | 活跃 | 396 | 有 | -55°C ~ 155°C | Tray | RN73R | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.25% | 活跃 | 2 | ±50ppm/°C | 560 Ohms | Thin Film | 0.1W, 1/10W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | - | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | Automotive AEC-Q200, Moisture Resistant | SoC FPGA | 0.022 (0.55mm) | 35 mm | 35 mm | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057K4F40E3SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | YES | 1517-FCBGA (40x40) | 1517 | Intel | 965070 | 71250 LAB | SMD/SMT | 1 | 570000 LE | 1.2 GHz | 2 x 32 kB | This product may require additional documentation to export from the United States. | 有 | Suntsu Electronics, Inc. | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057K4F40E3SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Bulk | 活跃 | 696 | - | 2 x 32 kB | Details | Arria 10 SoC | Intel / Altera | -20°C ~ 70°C | Tray | SXT224 | 0.098 L x 0.079 W (2.50mm x 2.00mm) | 活跃 | 兆赫晶体 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | 19.2 MHz | ±30ppm | S-PBGA-B1517 | 696 | 不合格 | 100 Ohms | 0.9 V | OTHER | 18pF | 1.5GHz | 256KB | Fundamental | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | ±15ppm | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 696 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 0.026 (0.65mm) | 40 mm | 40 mm | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032H1F34E1HG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Arria 10 SoC | Details | 2 x 32 kB | Reliance North America | - | 有 | 10AS032H1F34E1HG | 活跃 | INTEL CORP | 5.66 | Tape & Box (TB) | 活跃 | 384 | 有 | 2 x 32 kB | 1.2 GHz | 320000 LE | + 100 C | 0 C | 24 | SMD/SMT | 40000 LAB | 965058 | Intel | Intel / Altera | 0°C ~ 100°C (TJ) | Tray | * | 活跃 | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 320K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057H2F34E2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 570000 LE | 24 | SMD/SMT | 71250 LAB | 965358 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | KEMET | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057H2F34E2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Tape & Box (TB) | 活跃 | 492 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 0°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 492 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032H4F34E3LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Panel Mount, Through Hole | FBGA-1152 | YES | Flange | Aluminum | 1152 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 320000 LE | 1 | SMD/SMT | 40000 LAB | 964935 | Intel | Intel / Altera | Arria 10 SoC | Glenair | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032H4F34E3LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | 零售包装 | Metal | 活跃 | Copper Alloy | Gold | 384 | -65°C ~ 175°C | Tray | 806 | 活跃 | Solder | Plug, Male Pins | Silver | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | CMOS | BOTTOM | B | BALL | 未说明 | 1 mm | compliant | 化学镍 | 20-4 | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | Ground | SoC FPGA | 35 mm | 35 mm |
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