类别是'category.片上系统(SoC)' (7695)

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JESD-30代码

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产品类别

座位高度(最大)

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触点表面处理厚度 - 配套

材料可燃性等级

评级结果

LS1046AAN3Q1A
LS1046AAN3Q1A
Teledyne LeCroy 数据表

N/A

-

最小起订量: 1

最小包装量: 1

卷带

10AS027H2F34I2LG
10AS027H2F34I2LG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-1152

YES

1152

SMD/SMT

33750 LAB

964800

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS027H2F34I2LG

BGA

SQUARE

活跃

INTEL CORP

5.43

0.93 V

384

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

1

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

384

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.65 mm

现场可编程门阵列

SoC FPGA

FPGA - 270K Logic Elements

270000

2 Core

--

SoC FPGA

35 mm

35 mm

XCZU49DR-1FFVF1760I
XCZU49DR-1FFVF1760I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

面板安装

1760-BBGA, FCBGA

Bulkhead - Front Side Nut

Aluminum

1760-FCBGA (42.5x42.5)

Thermoplastic

-

Amphenol Aerospace Operations

Gold

622

-

Bulk

Metal

TV07RQDZ

活跃

Copper Alloy

-65°C ~ 175°C

MIL-DTL-38999 Series III, Tri-Start™ TV

Crimp

Receptacle, Male Pins

39 (38 + 1 Quadrax)

Black

Aviation, Marine, Military

Threaded

N (Normal)

Unshielded

抗环境干扰

-

黑锌镍

17-2

500MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

-

50.0µin (1.27µm)

-

XCVC1802-1LSEVSVD1760
XCVC1802-1LSEVSVD1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1210 (3225 Metric)

1210

KOA Speer Electronics, Inc.

Tape & Reel (TR)

活跃

692

-55°C ~ 155°C

SG73S-RT

0.126 L x 0.102 W (3.20mm x 2.60mm)

±2%

2

±200ppm/°C

12 kOhms

厚膜

1W

-

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding

0.028 (0.70mm)

-

XCVC1802-1MSEVSVA2197
XCVC1802-1MSEVSVA2197
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

Knowles Syfer

Tape & Reel (TR)

活跃

770

0°C ~ 100°C (TJ)

*

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

M2S090TS-FG484IX456
M2S090TS-FG484IX456
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

Suntsu Electronics, Inc.

活跃

Bulk

-20°C ~ 70°C

SXT324

0.126 L x 0.098 W (3.20mm x 2.50mm)

兆赫晶体

40 MHz

±25ppm

40 Ohms

8pF

Fundamental

±25ppm

0.031 (0.80mm)

XCZU48DR-L1FSVG1517I
XCZU48DR-L1FSVG1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Glenair

零售包装

活跃

561

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU7EG-L2FFVC1156E
XCZU7EG-L2FFVC1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Infineon Technologies

Obsolete

360

Bulk

MB9BF003

0°C ~ 100°C (TJ)

*

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

STID128-BYA
STID128-BYA
STMicroelectronics 数据表

N/A

-

最小起订量: 1

最小包装量: 1

XCZU6EG-L2FFVB1156E
XCZU6EG-L2FFVB1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

BGA Socketing Systems

328

Tray

XCZU6

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

Socket Adapter Systems

1.00mm Pitch

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

Socket Adapter Systems

XCZU1CG-1SFVC784E
XCZU1CG-1SFVC784E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

Tray

活跃

BGA Socketing Systems

-

0°C ~ 100°C (TJ)

Zynq® UltraScale+™

Socket Adapter Systems

1.27mm Pitch

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

-

Socket Adapter Systems

MPFS095T-FCSG536T2
MPFS095T-FCSG536T2
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

面板安装

536-LFBGA

536-BGA (16x16)

微芯片技术

--

MCU - 136, FPGA - 168

Tray

活跃

-40°C ~ 125°C (TJ)

UPG

Obsolete

--

--

Toggle

--

-

857.6KB

RISC-V

1

--

DMA, PCI, PWM

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

Magnetic (Hydraulic Delay)

MPU, FPGA

FPGA - 93K Logic Modules

128KB

A2F060M3E-1TQ144I
A2F060M3E-1TQ144I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

144

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

1.425 V

100 °C

A2F060M3E-1TQ144I

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.84

8542.39.00.01

CMOS

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G144

INDUSTRIAL

1536 CLBS, 60000 GATES

1.6 mm

现场可编程门阵列

1536

60000

20 mm

20 mm

5ASTFD5K3F40I3NES
5ASTFD5K3F40I3NES
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FBGA (40x40)

MCU - 208, FPGA - 540

-40°C ~ 100°C (TJ)

Tray

Arria V ST

Obsolete

5ASTFD5

1.05GHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 462K Logic Elements

--

10AS016E3F27I1HG
10AS016E3F27I1HG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Axial

Axial

-

10AS016E3F27I1HG

活跃

INTEL CORP

5.67

240

2 x 32 kB

1.2 GHz

160000 LE

+ 100 C

- 40 C

40

SMD/SMT

20000 LAB

964678

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-65°C ~ 275°C

Bulk

CP

1.890 L x 0.394 W (48.00mm x 10.00mm)

±5%

活跃

2

±400ppm/°C

200 mOhms

Wirewound

10W

SOC - Systems on a Chip

unknown

950 mV

--

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

12 Transceiver

FPGA - 160K Logic Elements

2 Core

--

Flame Proof, Safety

SoC FPGA

--

10AS027E2F27I1HG
10AS027E2F27I1HG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Axial

Axial

-

10AS027E2F27I1HG

活跃

INTEL CORP

5.64

240

2 x 32 kB

1.2 GHz

270000 LE

+ 100 C

- 40 C

40

SMD/SMT

33750 LAB

964759

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-55°C ~ 175°C

Tape & Reel (TR)

CMF

0.145 Dia x 0.344 L (3.68mm x 8.74mm)

±0.1%

活跃

2

±50ppm/°C

14.5 kOhms

Metal Film

1W

SOC - Systems on a Chip

unknown

950 mV

--

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

12 Transceiver

FPGA - 270K Logic Elements

2 Core

--

Flame Retardant Coating, Moisture Resistant, Safety

SoC FPGA

--

10AS057N1F40I1HG
10AS057N1F40I1HG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

面板安装

1517-BBGA, FCBGA

1517-FBGA (40x40)

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

10AS057N1F40I1HG

活跃

INTEL CORP

5.66

--

48V

588

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

570000 LE

+ 100 C

- 40 C

21

SMD/SMT

71250 LAB

965376

-40°C ~ 100°C (TJ)

Tray

CB187F

活跃

--

SOC - Systems on a Chip

unknown

100A

按下复位

950 mV

--

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

1

--

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Thermal

MCU, FPGA

SoC FPGA

48 Transceiver

FPGA - 570K Logic Elements

2 Core

--

SoC FPGA

10AS066K1F40E1HG
10AS066K1F40E1HG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Radial

径向引线

Details

2 x 32 kB

-

10AS066K1F40E1HG

活跃

INTEL CORP

5.66

696

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

+ 100 C

0 C

21

SMD/SMT

82500 LAB

965383

Intel

Intel / Altera

Arria 10 SoC

-65°C ~ 275°C

Bulk

CPCC

0.472 L x 0.315 W (12.00mm x 8.00mm)

±5%

活跃

2

±400ppm/°C

27 Ohms

Wirewound

3W

SOC - Systems on a Chip

unknown

950 mV

--

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

FPGA - 660K Logic Elements

2 Core

--

Flame Proof, Safety

SoC FPGA

0.984 (24.99mm)

AGFB022R25A2E4F
AGFB022R25A2E4F
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Surface Mount, MLCC

1206 (3216 Metric)

-

Vishay Vitramon

活跃

50V

624

Tape & Reel (TR)

CDR32

-55°C ~ 125°C

Military, MIL-PRF-55681, CDR32

0.126 L x 0.063 W (3.20mm x 1.60mm)

±10%

BX

高可靠性

0.022 µF

R (0.01%)

-

1.4GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

-

-

0.051 (1.30mm)

-

XC7Z010-2CLG400E
XC7Z010-2CLG400E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

400-LFBGA, CSPBGA

400-CSPBGA (17x17)

AMD

XC7Z010

活跃

130

Tray

0°C ~ 100°C (TJ)

Zynq®-7000

766MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 28K Logic Cells

-

AGFB027R24C3E4X
AGFB027R24C3E4X
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

744

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

AGFB014R24C2E3E
AGFB014R24C2E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

Non-Compliant

744

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

AGFA012R24C2I3V
AGFA012R24C2I3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

744

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

1SX065HH1F35E2LG
1SX065HH1F35E2LG
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FBGA (35x35)

Intel

活跃

Tray

392

0°C ~ 100°C (TJ)

Stratix® 10 SX

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 650K Logic Elements

-

10AS066H2F34I1HG
10AS066H2F34I1HG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Axial

Axial

Vishay Dale

Details

2 x 32 kB

-

Bulk

RN55

活跃

492

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

+ 100 C

- 40 C

24

SMD/SMT

82500 LAB

965020

Intel

Intel / Altera

Arria 10 SoC

-65°C ~ 175°C

Tray

Military, MIL-R-10509/7, RN55

0.090 Dia x 0.240 L (2.29mm x 6.10mm)

±1%

活跃

2

±50ppm/°C

69.8 Ohms

Metal Film

0.125W, 1/8W

SOC - Systems on a Chip

950 mV

-

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

FPGA - 660K Logic Elements

2 Core

--

Flame Retardant Coating, Military, Moisture Resistant, Safety

SoC FPGA

-