类别是'category.片上系统(SoC)' (7695)

  • 所有品牌

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

底架

安装类型

包装/外壳

表面安装

供应商器件包装

质量

终端数量

厂商

操作温度

包装

系列

尺寸/尺寸

JESD-609代码

零件状态

终端

类型

端子表面处理

性别

HTS代码

子类别

技术

电压 - 供电

端子位置

方向

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

频率稳定性

输出量

JESD-30代码

功能

基本谐振器

最大电流源

输出的数量

资历状况

接头数量

工作电源电压

电源

温度等级

电流 - 电源(禁用)(最大值)

速度

内存大小

核心处理器

周边设备

程序内存大小

连接方式

重置

建筑学

电压 - 阈值

监测的电压数量

重置超时

输入数量

座位高度-最大

可编程逻辑类型

输入

产品类别

温度范围

消耗功率

速度等级

绝对牵引范围 (APR)

主要属性

逻辑单元数

核数量

闪光大小

连接类型

产品类别

电气连接

座位高度(最大)

长度

宽度

辐射硬化

评级结果

M2S005-VFG256I
M2S005-VFG256I
Microchip 数据表

108 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

256-FPBGA (14x14)

微芯片技术

-

191 kbit

166 MHz

6060 LE

161 I/O

+ 100 C

- 40 C

119

SMD/SMT

505 LAB

Microchip

Microchip Technology / Atmel

Details

-

64 kB

Tray

M2S005

活跃

-40°C ~ 85°C

Tape & Reel (TR)

SiT8209

0.276 L x 0.197 W (7.00mm x 5.00mm)

活跃

XO (Standard)

SOC - Systems on a Chip

3.3V

133.3333MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

36mA

1.2 V

31mA

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

SoC FPGA

STD

--

FPGA - 5K Logic Modules

1 Core

128KB

SoC FPGA

0.039 (1.00mm)

--

10AS016C3U19I2SG
10AS016C3U19I2SG
ALTERA 数据表

892 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-UBGA (19x19)

192

Non-Compliant

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

160000 LE

0.423288 oz

1

SMD/SMT

20000 LAB

964673

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

FPGA - 160K Logic Elements

2 Core

--

SoC FPGA

XCZU9CG-1FFVB1156E
XCZU9CG-1FFVB1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

SC-74A, SOT-753

SOT-25-5

Torex Semiconductor Ltd

活跃

328

Tape & Reel (TR)

XC6124

-40°C ~ 85°C (TA)

-

看门狗电路

开路漏极或开路集电极

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

低电平有效

MCU, FPGA

1.8V

1

400ms Typical

1

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU3EG-2SFVA625E
XCZU3EG-2SFVA625E
AMD 数据表

517 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

ITT Cannon, LLC

Bulk

MIK0

活跃

180

0°C ~ 100°C (TJ)

*

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCZU4EV-2FBVB900E
XCZU4EV-2FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

900-FCBGA (31x31)

AMD

XCZU4

活跃

204

Tray

-40°C ~ 85°C

Tape & Reel (TR)

SiT8209

0.126 L x 0.098 W (3.20mm x 2.50mm)

活跃

XO (Standard)

1.8V

133.3333MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

30mA

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU19EG-3FFVD1760E
XCZU19EG-3FFVD1760E
AMD 数据表

911 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

1760-FCBGA (42.5x42.5)

AMD

XCZU19

活跃

308

Tray

-40°C ~ 85°C

Tape & Reel (TR)

SiT8209

0.126 L x 0.098 W (3.20mm x 2.50mm)

活跃

XO (Standard)

1.8V

125MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

30mA

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU7EG-L1FBVB900I
XCZU7EG-L1FBVB900I
AMD 数据表

896 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

900-FCBGA (31x31)

AMD

XCZU7

活跃

204

Tray

-40°C ~ 85°C

Tape & Reel (TR)

SiT8209

0.126 L x 0.098 W (3.20mm x 2.50mm)

活跃

XO (Standard)

1.8V

98.304MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

30mA

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU5CG-L2SFVC784E
XCZU5CG-L2SFVC784E
AMD 数据表

875 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

784-FCBGA (23x23)

AMD

XCZU5

活跃

252

Tray

-40°C ~ 85°C

Tape & Reel (TR)

SiT8208

0.276 L x 0.197 W (7.00mm x 5.00mm)

活跃

XO (Standard)

1.8V

33.3MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

31mA

30mA

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

0.039 (1.00mm)

--

M2S025TS-1VFG400I
M2S025TS-1VFG400I
Microchip 数据表

2256 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

YES

400-VFBGA (17x17)

400

166 MHz

27696 LE

90

SMD/SMT

2308 LAB

Microchip

微芯片技术

Microchip Technology / Atmel

Details

-

64 kB

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

M2S025TS-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

207

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

-

-40°C ~ 85°C

Tape & Reel (TR)

SiT8208

0.276 L x 0.197 W (7.00mm x 5.00mm)

e1

活跃

XO (Standard)

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

SOC - Systems on a Chip

CMOS

2.5V

BOTTOM

BALL

250

0.8 mm

compliant

38MHz

±10ppm

LVCMOS, LVTTL

S-PBGA-B400

Standby (Power Down)

MEMS

33mA

207

不合格

1.2 V

70µA

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

SoC FPGA

1

--

FPGA - 25K Logic Modules

27696

1 Core

256KB

SoC FPGA

0.039 (1.00mm)

17 mm

17 mm

--

XCZU7CG-L2FBVB900E
XCZU7CG-L2FBVB900E
AMD 数据表

957 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

900-FCBGA (31x31)

AMD

XCZU7

活跃

204

Tray

-40°C ~ 85°C

Tape & Reel (TR)

SiT8209

0.197 L x 0.126 W (5.00mm x 3.20mm)

活跃

XO (Standard)

3.3V

133.333333MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

36mA

31mA

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU7EV-2FFVF1517I
XCZU7EV-2FFVF1517I
AMD 数据表

675 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

6-SMD, No Lead

1517-FCBGA (40x40)

AMD

XCZU7

活跃

464

Tray

-20°C ~ 70°C

Tape & Reel (TR)

SiT9120

0.126 L x 0.098 W (3.20mm x 2.50mm)

活跃

XO (Standard)

2.25 V ~ 3.63 V

156.25MHz

±10ppm

LVDS

Standby (Power Down)

MEMS

55mA

35mA

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

--

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU4EG-1FBVB900E
XCZU4EG-1FBVB900E
AMD 数据表

885 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

900-FCBGA (31x31)

AMD

XCZU4

活跃

204

Tray

-20°C ~ 70°C

Tape & Reel (TR)

SiT8208

0.126 L x 0.098 W (3.20mm x 2.50mm)

活跃

XO (Standard)

2.8V

26MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

31mA

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

--

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU25DR-L2FSVG1517I
XCZU25DR-L2FSVG1517I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Flanges

Compliant

Bulk

*

活跃

Crimp

Female

Straight

18

XCZU48DR-2FFVG1517E
XCZU48DR-2FFVG1517E
Xilinx 数据表

105 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

17.3 kg

AMD 赛灵思

Tray

活跃

Compliant

561

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1.6 kW

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU48DR-2FFVE1156E
XCZU48DR-2FFVE1156E
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD 赛灵思

Non-Compliant

366

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XC7Z035-2FFG900E
XC7Z035-2FFG900E
AMD 数据表

659 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

130

Tray

XC7Z035

活跃

0°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 275K Logic Cells

-

10AS057K3F35I2SG
10AS057K3F35I2SG
ALTERA 数据表

823 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

VFD-050HB-442E

Johnson Controls

396

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

FPGA - 570K Logic Elements

570000

--

Flanged

35 mm

35 mm

10AS016E3F27I2LG
10AS016E3F27I2LG
ALTERA 数据表

777 In Stock

-

最小起订量: 1

最小包装量: 1

672-BBGA, FCBGA

YES

672-FBGA (27x27)

672

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

160000 LE

1

SMD/SMT

20000 LAB

964696

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

TPS20-G1FP2-00

CE

Autonics

240

Non-Compliant

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

Gauge

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

4-20 mA

S-PBGA-B672

240

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

15-35 VDC

SoC FPGA

14-158 °F

FPGA - 160K Logic Elements

160000

2 Core

--

SoC FPGA

Head Type

27 mm

27 mm

10AS057H4F34I3LG
10AS057H4F34I3LG
ALTERA 数据表

732 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

1.2 GHz

570000 LE

24

SMD/SMT

71250 LAB

964915

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

BGA

SQUARE

活跃

INTEL CORP

BGA, BGA1152,34X34,40

0.93 V

5.45

HVX005A1-2A1B1B5CAD3

Cutler Hammer, Div of Eaton Co

492

This product may require additional documentation to export from the United States.

2 x 32 kB

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

SoC FPGA

FPGA - 570K Logic Elements

570000

2 Core

--

SoC FPGA

35 mm

35 mm

XCVM1302-2LSEVSVD1760
XCVM1302-2LSEVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

活跃

402

Tray

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVC1902-1MSIVIVA1596
XCVC1902-1MSIVIVA1596
AMD 数据表

914 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD

活跃

500

Tray

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU1EG-2SBVA484I
XCZU1EG-2SBVA484I
AMD 数据表

2655 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

活跃

-

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

-

-

XCVM1802-2LSEVFVC1760
XCVM1802-2LSEVFVC1760
AMD 数据表

879 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

活跃

500

Tray

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVM1302-1MSINSVF1369
XCVM1302-1MSINSVF1369
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

AMD

活跃

316

Tray

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVM1402-1LLINBVB1024
XCVM1402-1LLINBVB1024
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

AMD

活跃

424

Tray

-40°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-