类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | JESD-609代码 | 零件状态 | 终端 | 类型 | 端子表面处理 | 性别 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 方向 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 频率稳定性 | 输出量 | JESD-30代码 | 功能 | 基本谐振器 | 最大电流源 | 输出的数量 | 资历状况 | 接头数量 | 工作电源电压 | 电源 | 温度等级 | 电流 - 电源(禁用)(最大值) | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 重置 | 建筑学 | 电压 - 阈值 | 监测的电压数量 | 重置超时 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 输入 | 产品类别 | 温度范围 | 消耗功率 | 速度等级 | 绝对牵引范围 (APR) | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 连接类型 | 产品类别 | 电气连接 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 评级结果 | ||||||||||||||||||||||||||||||||||||||||||
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![]() | M2S005-VFG256I | Microchip | 数据表 | 108 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 256-FPBGA (14x14) | 微芯片技术 | 有 | - | 191 kbit | 166 MHz | 6060 LE | 161 I/O | + 100 C | - 40 C | 119 | SMD/SMT | 505 LAB | Microchip | Microchip Technology / Atmel | Details | - | 64 kB | Tray | M2S005 | 活跃 | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | 活跃 | XO (Standard) | SOC - Systems on a Chip | 3.3V | 133.3333MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 36mA | 1.2 V | 31mA | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | -- | FPGA - 5K Logic Modules | 1 Core | 128KB | SoC FPGA | 0.039 (1.00mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS016C3U19I2SG | ALTERA | 数据表 | 892 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-UBGA (19x19) | 192 | Non-Compliant | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 160000 LE | 0.423288 oz | 1 | SMD/SMT | 20000 LAB | 964673 | Intel | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 160K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9CG-1FFVB1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | SC-74A, SOT-753 | SOT-25-5 | Torex Semiconductor Ltd | 活跃 | 328 | Tape & Reel (TR) | XC6124 | -40°C ~ 85°C (TA) | - | 看门狗电路 | 开路漏极或开路集电极 | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 低电平有效 | MCU, FPGA | 1.8V | 1 | 400ms Typical | 1 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-2SFVA625E | AMD | 数据表 | 517 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | ITT Cannon, LLC | Bulk | MIK0 | 活跃 | 180 | 0°C ~ 100°C (TJ) | * | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EV-2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 900-FCBGA (31x31) | AMD | XCZU4 | 活跃 | 204 | Tray | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | 活跃 | XO (Standard) | 1.8V | 133.3333MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 30mA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU19EG-3FFVD1760E | AMD | 数据表 | 911 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 1760-FCBGA (42.5x42.5) | AMD | XCZU19 | 活跃 | 308 | Tray | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | 活跃 | XO (Standard) | 1.8V | 125MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 30mA | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-L1FBVB900I | AMD | 数据表 | 896 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 900-FCBGA (31x31) | AMD | XCZU7 | 活跃 | 204 | Tray | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | 活跃 | XO (Standard) | 1.8V | 98.304MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 30mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5CG-L2SFVC784E | AMD | 数据表 | 875 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 784-FCBGA (23x23) | AMD | XCZU5 | 活跃 | 252 | Tray | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | 活跃 | XO (Standard) | 1.8V | 33.3MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 31mA | 30mA | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | 0.039 (1.00mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-1VFG400I | Microchip | 数据表 | 2256 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | YES | 400-VFBGA (17x17) | 400 | 166 MHz | 27696 LE | 90 | SMD/SMT | 2308 LAB | Microchip | 微芯片技术 | Microchip Technology / Atmel | Details | - | 64 kB | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 40 | 1.14 V | 有 | M2S025TS-1VFG400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | 207 | Tray | M2S025 | 活跃 | 有 | This product may require additional documentation to export from the United States. | - | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | e1 | 活跃 | XO (Standard) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | 2.5V | BOTTOM | BALL | 250 | 0.8 mm | compliant | 38MHz | ±10ppm | LVCMOS, LVTTL | S-PBGA-B400 | Standby (Power Down) | MEMS | 33mA | 207 | 不合格 | 1.2 V | 70µA | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | SoC FPGA | 1 | -- | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | SoC FPGA | 0.039 (1.00mm) | 17 mm | 17 mm | -- | |||||||||||||||||||||||||||||
![]() | XCZU7CG-L2FBVB900E | AMD | 数据表 | 957 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 900-FCBGA (31x31) | AMD | XCZU7 | 活跃 | 204 | Tray | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | 活跃 | XO (Standard) | 3.3V | 133.333333MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 36mA | 31mA | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EV-2FFVF1517I | AMD | 数据表 | 675 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 6-SMD, No Lead | 1517-FCBGA (40x40) | AMD | XCZU7 | 活跃 | 464 | Tray | -20°C ~ 70°C | Tape & Reel (TR) | SiT9120 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | 活跃 | XO (Standard) | 2.25 V ~ 3.63 V | 156.25MHz | ±10ppm | LVDS | Standby (Power Down) | MEMS | 55mA | 35mA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | -- | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EG-1FBVB900E | AMD | 数据表 | 885 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 900-FCBGA (31x31) | AMD | XCZU4 | 活跃 | 204 | Tray | -20°C ~ 70°C | Tape & Reel (TR) | SiT8208 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | 活跃 | XO (Standard) | 2.8V | 26MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 31mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | -- | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU25DR-L2FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Flanges | Compliant | Bulk | * | 活跃 | Crimp | Female | Straight | 18 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-2FFVG1517E | Xilinx | 数据表 | 105 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 17.3 kg | AMD 赛灵思 | Tray | 活跃 | Compliant | 561 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1.6 kW | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-2FFVE1156E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Non-Compliant | 366 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z035-2FFG900E | AMD | 数据表 | 659 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 130 | Tray | XC7Z035 | 活跃 | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 275K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057K3F35I2SG | ALTERA | 数据表 | 823 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | VFD-050HB-442E | Johnson Controls | 396 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | FPGA - 570K Logic Elements | 570000 | -- | Flanged | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS016E3F27I2LG | ALTERA | 数据表 | 777 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 160000 LE | 1 | SMD/SMT | 20000 LAB | 964696 | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | BGA, BGA672,26X26,40 | 网格排列 | PLASTIC/EPOXY | BGA672,26X26,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.47 | TPS20-G1FP2-00 | CE | Autonics | 240 | Non-Compliant | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | Gauge | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | 4-20 mA | S-PBGA-B672 | 240 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | 15-35 VDC | SoC FPGA | 14-158 °F | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | SoC FPGA | Head Type | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057H4F34I3LG | ALTERA | 数据表 | 732 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 1.2 GHz | 570000 LE | 24 | SMD/SMT | 71250 LAB | 964915 | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | BGA | SQUARE | 活跃 | INTEL CORP | BGA, BGA1152,34X34,40 | 0.93 V | 5.45 | HVX005A1-2A1B1B5CAD3 | Cutler Hammer, Div of Eaton Co | 492 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 492 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-2LSEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 活跃 | 402 | Tray | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-1MSIVIVA1596 | AMD | 数据表 | 914 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 活跃 | 500 | Tray | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1EG-2SBVA484I | AMD | 数据表 | 2655 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | 活跃 | - | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-2LSEVFVC1760 | AMD | 数据表 | 879 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 活跃 | 500 | Tray | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1MSINSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 活跃 | 316 | Tray | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1LLINBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 活跃 | 424 | Tray | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - |
M2S005-VFG256I
Microchip
分类:Embedded - System On Chip (SoC)
210.564970
10AS016C3U19I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
5,759.519079
XCZU9CG-1FFVB1156E
AMD
分类:Embedded - System On Chip (SoC)
XCZU3EG-2SFVA625E
AMD
分类:Embedded - System On Chip (SoC)
4,899.325157
XCZU4EV-2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU19EG-3FFVD1760E
AMD
分类:Embedded - System On Chip (SoC)
88,485.813609
XCZU7EG-L1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
24,629.516594
XCZU5CG-L2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
M2S025TS-1VFG400I
Microchip
分类:Embedded - System On Chip (SoC)
853.974274
XCZU7CG-L2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
26,403.263705
XCZU7EV-2FFVF1517I
AMD
分类:Embedded - System On Chip (SoC)
34,525.431451
XCZU4EG-1FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
9,489.328533
XCZU25DR-L2FSVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU48DR-2FFVG1517E
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU48DR-2FFVE1156E
Xilinx
分类:Embedded - System On Chip (SoC)
XC7Z035-2FFG900E
AMD
分类:Embedded - System On Chip (SoC)
14,942.290110
10AS057K3F35I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
36,781.537025
10AS016E3F27I2LG
ALTERA
分类:Embedded - System On Chip (SoC)
9,369.180409
10AS057H4F34I3LG
ALTERA
分类:Embedded - System On Chip (SoC)
29,290.470370
XCVM1302-2LSEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
XCVC1902-1MSIVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
174,802.992423
XCZU1EG-2SBVA484I
AMD
分类:Embedded - System On Chip (SoC)
2,784.921611
XCVM1802-2LSEVFVC1760
AMD
分类:Embedded - System On Chip (SoC)
81,372.712662
XCVM1302-1MSINSVF1369
AMD
分类:Embedded - System On Chip (SoC)
XCVM1402-1LLINBVB1024
AMD
分类:Embedded - System On Chip (SoC)
