category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	安装类型	包装/外壳	引脚数	供应商器件包装	第一种连接器安装类型	第二个连接器安装类型																厂商												操作温度	包装	系列	尺寸/尺寸	容差	终止次数	终端	温度系数	类型	电阻	颜色	应用	功率(瓦特)	电容量	子类别	额定功率	技术	电压 - 供电	入口保护	样式	额定电流	频率	频率稳定性	输出量	终端样式	功能	输出的数量	电压 - 输入（最大值）	输出类型	工作电源电压	电压 - 输入（最小值）	失败率	电路数量	测试频率	输出配置	内存大小	引线样式	输出电流	核心处理器	连接方式	重置	电压 - 输出（最小值/固定）	拓扑	建筑学	电压 - 阈值	监测的电压数量	重置超时	频率开关	同步整流器	输入	产品类别	等效串联电阻	比率-输入：输出	第一个连接器
AGFA023R25A2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	480	Tray	活跃					0°C ~ 100°C (TJ)		Agilex F																																1.4GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MPU, FPGA												FPGA - 2.3M Logic Elements	-
XAZU2EG-1SFVA625Q	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	128	Tray	XAZU2	活跃		AMD				0402	1005	+ 155 C	0.000023 oz	- 55 C	10000	PCB 安装	Vishay	Vishay / Dale	Details	-40°C ~ 125°C (TJ)	Reel	RCWE		1 %	2 Terminal	200 PPM / C	厚膜表面贴装片式电阻器	80.6 mOhms		电流感应			Resistors	125 mW (1/8 W)	厚膜							SMD/SMT												500MHz, 1.2GHz		1.2MB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, I²C, SPI, UART/USART, USB			MPU, FPGA					电流检测电阻器							Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	-	厚膜电阻器		Current Sense Resistors - SMD		0.35 mm		1.05 mm	0.55 mm
XCZU15EG-L1FFVB1156I	AMD	数据表	856 In Stock	1: ¥48,042.596101 10: ¥46,462.858898 25: ¥46,139.879743 50: ¥45,819.145723 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	ITT Cannon	ITT Cannon	Details	328	Tray	XCZU15	活跃					25	132041-0864	-40°C ~ 100°C (TJ)		PL												Circular Connectors																				500MHz, 600MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA					圆形推拽连接器						Zynq®UltraScale+™ FPGA, 747K+ Logic Cells	-			圆形推拽连接器
XCVM1302-2LSEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	2 Pin	1760-FCBGA (40x40)			AMD 赛灵思	0.2	+ 105 C	- 25 C	160	B43641A9187M57	EPCOS / TDK	400 VDC	EPCOS / TDK	Details	402	Tray	活跃		0°C ~ 100°C (TJ)	Bulk	B43641		20 %			长寿命电容器					180 uF	Capacitors										卡入式				700 mV			10 mm		0.99 A	100 Hz	450MHz, 1.08GHz		-			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MPU, FPGA				电解电容器	520 mOhms						Versal™ Prime FPGA, 70k Logic Cells	-	通用电解电容器		Aluminum Electrolytic Capacitors - Snap In	22 mm			30 mm
XCVM1402-2LSEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	7 mm x 5 mm	1760-FCBGA (40x40)				AMD 赛灵思		55 %	+ 85 C	2.62 V	- 40 C	1000	2.37 V	CTS	CTS电子元件	Details	726	Tray	活跃	0°C ~ 100°C (TJ)	Reel	637											Oscillators						45 mA	148.35 MHz	25 PPM		SMD/SMT				700 mV							450MHz, 1.08GHz		-			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MPU, FPGA				标准振荡器						LVDS	Versal™ Prime FPGA, 1.2M Logic Cells	-			标准时钟振荡器		1.7 mm		7 mm	5 mm
XCZU47DR-L2FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	Panduit Corp	Bulk	Obsolete	366					-40°C ~ 100°C (TJ)		*																																533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU47DR-2FSVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0805 (2012 Metric)	0805	KOA Speer Electronics, Inc.					Tape & Reel (TR)	RN732A	Obsolete	366	-55°C ~ 155°C		RN73	0.079 L x 0.049 W (2.00mm x 1.25mm)	±0.5%	2		±25ppm/°C		1.18 kOhms	Thin Film			0.1W, 1/10W																					533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-		Moisture Resistant			0.024 (0.60mm)
XCZU47DR-L2FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	Molex					Bulk	505433	活跃	561	-40°C ~ 100°C (TJ)		*																																533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	Pulse Electronics	Bulk	Obsolete	366					-40°C ~ 100°C (TJ)		-																																500MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU46DR-2FSVH1760E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	NXP USA Inc.					Tube	BLF6	活跃	574	0°C ~ 100°C (TJ)		*																																533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU47DR-L2FFVE1156I	Xilinx	数据表	5000 In Stock	-	最小起订量: 1 最小包装量: 1	表面贴装	24-VFQFN Exposed Pad	24-QFN (4x4)	Skyworks Solutions Inc.	366				Tray	SI5330	Obsolete	350 MHz	-40°C ~ 85°C		-						Fanout Buffer (Distribution), Translator									1.71V ~ 3.63V					LVPECL									1			533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA						CMOS, HSTL, LVTTL, SSTL		1:4		No/Yes		Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-L1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	Molex					Bulk	120084	活跃	366	-40°C ~ 100°C (TJ)		*																																500MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-L1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	TE Connectivity Deutsch 连接器					Bag	YDL68G	活跃	366	-40°C ~ 100°C (TJ)		*																																500MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU49DR-L1FSVF1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	Molex					Bulk	073404	活跃	622	-40°C ~ 100°C (TJ)		*																																500MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-2FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	Molex					Bulk	098853	活跃	561	-40°C ~ 100°C (TJ)		*																																533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU49DR-1FFVF1760E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, MLCC	1206 (3216 Metric)	1760-FCBGA (42.5x42.5)	Vishay Vitramon	Tape & Reel (TR)	活跃	100V	622				-55°C ~ 150°C		GA	0.126 L x 0.063 W (3.20mm x 1.60mm)	±20%			X7R					汽车		0.18 µF																-	-			500MHz, 1.2GHz		256KB	-		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-		-			-			0.067 (1.70mm)	AEC-Q200
XCZU49DR-2FSVF1760E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	SC-74A, SOT-753	SOT-23-5	Analog Devices Inc./Maxim Integrated	Tape & Reel (TR)	MAX6307	Obsolete	622				0°C ~ 70°C (TA)		-						Multi-Voltage Supervisor														开路漏极或开路集电极												533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	低电平有效			MCU, FPGA	4.1V, Adj	2	1ms Minimum									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU43DR-L2FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Axial	Axial	TT Electronics/IRC					Cut Tape (CT)	SPP2UL	Discontinued at Digi-Key	561	-55°C ~ 200°C		SPP	0.169 Dia x 0.571 L (4.30mm x 14.50mm)	±5%	2		±300ppm/°C		6.8 Ohms	Wirewound			2W																	-				533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-		Fusible, Moisture Resistant, Safety, Weldable			-
XCZU43DR-2FSVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	16-WQFN Exposed Pad	16-TQFN (5x5)	Analog Devices Inc./Maxim Integrated	Tape & Reel (TR)	MAX5097	活跃	366				-40°C ~ 125°C (TJ)		-																						Step-Down	1	40V	Adjustable (Fixed)		5V					533MHz, 1.333GHz	Positive	256KB		600mA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		1.24V (3.3V)	巴克	MCU, FPGA				330kHz	无					11V		Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-L1FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	Molex					Bulk	120066	活跃	561	-40°C ~ 100°C (TJ)		*																																500MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-L2FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	Molex					Bulk	055935	活跃	561	-40°C ~ 100°C (TJ)		*																																533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU43DR-L2FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	面板安装	Free Hanging (In-Line)	Amphenol Custom Cable	50 Ohms	Q-1S05D0	Bulkhead - Front Side Nut	活跃	Female	3 GHz	-	RG-58	561			Female	Bag	-		-								Black							-	N-Type to Fakra																533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA							N-Type Jack, Right Angle	Fakra Jack, Right Angle			Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-		Shielded					36.00 (914.40mm)
XCZU43DR-L1FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Axial	Axial	Vishay Dale					Tape & Reel (TR)	RLR20	活跃	561	-65°C ~ 150°C		Military, MIL-PRF-39017/02, RLR20	0.138 Dia x 0.375 L (3.51mm x 9.53mm)	±2%	2		±100ppm/°C		1.6 kOhms	Metal Film			0.5W, 1/2W																	M (1%)				500MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-		Military, Moisture Resistant, Weldable			-
XCZU43DR-2FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	Vishay Vitramon	Bulk	Obsolete	561					-40°C ~ 100°C (TJ)		*																																533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	Molex					Bulk	121055	活跃	366	-40°C ~ 100°C (TJ)		*																																500MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-