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产品型号	品牌	数据表	库存	价格(含增值税)	数量	触点镀层	底架	包装/外壳	表面安装	引脚数	供应商器件包装	房屋材料	质量	终端数量											厂商																										操作温度	包装	系列	容差	JESD-609代码	零件状态	终止次数	终端	温度系数	连接器类型	电阻	定位的数量	端子表面处理	最高工作温度	最小工作温度	组成	性别	功率(瓦特)	HTS代码	紧固类型	子类别	额定功率	技术	端子位置	方向	终端形式	峰值回流焊温度（摄氏度）	端子间距	深度	Reach合规守则	基本部件号	JESD-30代码	输出的数量	资历状况	接头数量	效率	输出电压	失败率	电源	温度等级	镀层	速度	内存大小	输出电流	核心处理器	周边设备	程序内存大小	连接方式	输出功率	电压 - 输出 2	建筑学	输入数量	组织结构	座位高度-最大	电流-输出1	产品类别	电压 - 输出 3	主要属性	逻辑块数量	逻辑单元数	闪光大小	电流-输出3	特征
XCZU43DR-1FSVG1517E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1206 (3216 Metric)	1206	TT Electronics/IRC							Cut Tape (CT)	PFC-W1206	Discontinued at Digi-Key	561		-65°C ~ 150°C		PFC - Precision	0.126 L x 0.063 W (3.20mm x 1.60mm)	±0.1%			2		±25ppm/°C		2.49 kOhms					Thin Film		0.333W, 1/3W																-				500MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells					-		Anti-Sulfur, Moisture Resistant			0.028 (0.71mm)
XCZU3CG-1SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	Tray	XCZU3	活跃								Non-Compliant	252	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																																				500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA								Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					-
AGFB006R24C3E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Gold	Bulkhead, Front Side Nut, Jam Nut, Panel	-	-	Intel	Tray	活跃						Compliant	576	0°C ~ 100°C (TJ)	Bulk	Agilex F						Crimp		Crimp, Receptacle		66		175 °C	-65 °C		Female			Threaded					Straight			46.02 mm				66					Cadmium	1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA								FPGA - 573K Logic Elements					-						31.57 mm		无	抗环境干扰
AGFA027R25A3E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel							Non-Compliant	624	Tray	活跃		0°C ~ 100°C (TJ)		Agilex F																																				1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA								FPGA - 2.7M Logic Elements					-
XCVC1802-1LSEVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD			770	Tray	活跃						0°C ~ 100°C (TJ)		Versal™ AI Core																																				400MHz, 1GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA								Versal™ AI Core FPGA, 1.5M Logic Cells					-
LH79525N0Q100A0，55	NXP	数据表	N/A	-	最小起订量: 1 最小包装量: 1
XCZU3EG-1SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD							252	Tray	XCZU3	活跃		0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA								Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					-
AGFB006R24C2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			576	Tray	活跃						-40°C ~ 100°C (TJ)		Agilex F																																				1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA								FPGA - 573K Logic Elements					-
AGFA012R24C3E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel							Non-Compliant	744	Tray	活跃		0°C ~ 100°C (TJ)		Agilex F																																				1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA								FPGA - 1.2M Logic Elements					-
10AS016E4F27E3LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-BBGA, FCBGA	YES	672-FBGA (27x27)	672	240	有	2 x 32 kB	1.2 GHz	160000 LE	1	SMD/SMT	20000 LAB	964735		Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	0.9 V	未说明	0.87 V	100 °C	有	10AS016E4F27E3LG	BGA	SQUARE	活跃	FPGA - Field Programmable Gate Array Arria 10 SX 160 SoC FPGA	INTEL CORP	0.93 V	1.96					Non-Compliant	0°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃												8542.39.00.01		SOC - Systems on a Chip		CMOS	BOTTOM		BALL	未说明	1 mm		compliant		S-PBGA-B672	240	不合格					0.9 V	OTHER		1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA	240		3.25 mm	现场可编程门阵列		SoC FPGA		FPGA - 160K Logic Elements		160000	2 Core	--		SoC FPGA		27 mm	27 mm
XCZU2CG-2SFVA625I	AMD	数据表	625 In Stock	-	最小起订量: 1 最小包装量: 1	Gold	Flanges, Panel, Through Hole	625-BFBGA, FCBGA	23	625-FCBGA (21x21)	AMD	Tray	XCZU2	活跃					Compliant	180	-40°C ~ 100°C (TJ)	Bulk	Zynq® UltraScale+™ MPSoC CG						Solder		Receptacle		19		175 °C	-65 °C					Threaded																		533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA								Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					-		Shielded							抗环境干扰
AGIB027R29A1E2VR3	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Metal	Intel		Non-Compliant	720	Tray	活跃	1	Intel	Intel						0°C ~ 100°C (TJ)	Tray	Agilex I																						Straight														1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA							FPGA - 2.7M Logic Elements					-			Intel
XCZU3EG-1SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Panel	625-BFBGA, FCBGA	625-FCBGA (21x21)	230 g	AMD	活跃						5 V	Compliant	180	Tray	XCZU3	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG												50 °C	0 °C							55 W						76.2 mm		3		70 %	12 V					500MHz, 600MHz, 1.2GHz	256KB	6 A	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	55 W	12 V	MCU, FPGA					6 A		-12 V	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	500 mA				-	500 mA			28.956 mm		127 mm	76.2 mm
AGID019R18A2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel							Non-Compliant	活跃	480	Tray		0°C ~ 100°C (TJ)		Agilex I																																				1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA								FPGA - 1.9M Logic Elements					-
XC7Z035-2FBG676E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BBGA, FCBGA	676-FCBGA (27x27)	AMD							130	Tray	XC7Z035	活跃		0°C ~ 100°C (TJ)		Zynq®-7000																																				800MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA								Kintex™-7 FPGA, 275K Logic Cells					-
5ASTMD3E3F31I3N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BBGA, FCBGA	YES	896-FBGA (31x31)	896	5ASTMD3E3F31I3N	BGA	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.18 V	5.29						Non-Compliant	MCU - 208, FPGA - 250	BGA, BGA896,30X30,40	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	-40 °C	1.15 V	未说明	1.12 V		100 °C	有	-40°C ~ 100°C (TJ)	Tray	Arria V ST			e1	活跃						Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01				BOTTOM		BALL	未说明	1 mm		compliant	5ASTMD3	S-PBGA-B896	540							INDUSTRIAL		1.05GHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA	540	13207 CLBS	2.7 mm	现场可编程门阵列				FPGA - 350K Logic Elements		13207	350000		--						31 mm	31 mm
5CSEBA5U23C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	Intel Corporation	活跃	FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9	INTEL CORP	1.13 V	5.55						MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32	1.1 V	未说明	1.07 V	85 °C	有		5CSEBA5U23C6N	FBGA	SQUARE	0°C ~ 85°C (TJ)	Tray	Cyclone® V SE				活跃												现场可编程门阵列	CMOS	BOTTOM		BALL	未说明	0.8 mm		compliant	5CSEBA5	S-PBGA-B672	145	不合格					1.1,1.2/3.3,2.5 V	OTHER		925MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA	145		1.85 mm	现场可编程门阵列				FPGA - 85K Logic Elements			85000		--						23 mm	23 mm
10AS016E3F29I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	780-BBGA, FCBGA	780-FBGA (29x29)	288		Non-Compliant								-40°C ~ 100°C (TJ)	Tray	Arria 10 SX				Discontinued at Digi-Key																																1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA								FPGA - 160K Logic Elements					--
M2S060TS-1VFG784I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-FBGA	784-VFBGA (23x23)	微芯片技术								Tray	活跃	-40°C ~ 100°C (TJ)		SmartFusion®2																																				166MHz			ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA								FPGA - 60K Logic Modules
AGIB019R18A2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			480	Tray	活跃						0°C ~ 100°C (TJ)		Agilex I																																				1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA								FPGA - 1.9M Logic Elements					-
10AS027H3F34I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-1152	YES		1152	384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	270000 LE	1	SMD/SMT	33750 LAB	964831		Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS027H3F34I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45					-40°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃												8542.39.00.01		SOC - Systems on a Chip		CMOS	BOTTOM		BALL	未说明	1 mm		compliant		S-PBGA-B1152	384	不合格					0.9 V	INDUSTRIAL		1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA	384		3.65 mm	现场可编程门阵列		SoC FPGA		FPGA - 270K Logic Elements		270000	2 Core	--		SoC FPGA		35 mm	35 mm
XCZU2EG-2SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	恩智浦半导体							Bulk	74AHC30	活跃	180		-40°C ~ 100°C (TJ)		*																																				533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA								Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					-
AGFB008R16A2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0805 (2012 Metric)	0805	KOA Speer Electronics, Inc.							Tape & Reel (TR)	RS73G2A	活跃	384		-55°C ~ 155°C		RS73	0.079 L x 0.049 W (2.00mm x 1.25mm)	±1%			2		±50ppm/°C		4.22 MOhms					厚膜		0.25W, 1/4W																				1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA								FPGA - 764K Logic Elements					-		Automotive AEC-Q200, Moisture Resistant			0.024 (0.60mm)				AEC-Q200
XCZU3CG-1SFVA625E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	霍尼韦尔传感与生产力解决方案							Bulk	Obsolete	180	XCZU3		0°C ~ 100°C (TJ)		-																																				500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA								Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					-
5CSEBA6U23I7LN	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1							5.79	INTEL CORP	活跃	Intel Corporation	5CSEBA6U23I7LN						Tray	*				活跃																							compliant																						现场可编程门阵列