我的订单
会员中心 
在线咨询
0755-83328606
类别是'category.片上系统（SoC）' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 零件状态 | 端子表面处理 | 子类别 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | 基本部件号 | JESD-30代码 | 输出的数量 | 工作电源电压 | 温度等级 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 收发器数量 | 主要属性 | 逻辑块数量 | 逻辑单元数 | 核数量 | 闪光大小 | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | AGFA014R24C3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 744 | 活跃 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1702-1LSIVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 活跃 | 608 | Tray | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1702-1MLINSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | 活跃 | Tray | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1502-2LSEVFVC1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | 活跃 | Tray | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1SX280LH2F55E1VG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-2912 | Details | 4 x 32 kB | - | 1160 | 有 | This product may require additional documentation to export from the United States. | 4 x 32 kB | 1 GHz | 2800000 LE | + 100 C | 0 C | 10 | SMD/SMT | 350000 LAB | 960572 | Intel | Intel / Altera | Stratix | 0°C ~ 100°C (TJ) | Tray | Stratix® 10 SX | 活跃 | SOC - Systems on a Chip | 0.85 V | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 2800K Logic Elements | 4 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||
| AGFB012R24B2E4F | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 768 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EV-1FFVC1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | Tray | XCZU7 | 活跃 | 360 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1802-2LLEVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 活跃 | 500 | Tray | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVP1202-2LLEVSVA2785 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | 活跃 | Tray | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5CSXFC5C6U23C7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | 活跃 | 5CSXFC5 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 85K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5CSXFC2C6U23A7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | 活跃 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 25K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5ASXMB5G4F40C5N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | MCU - 208, FPGA - 540 | FBGA-1517 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5ASXMB5G4F40C5N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.28 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXMB5 | S-PBGA-B1517 | 540 | 商业扩展 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 40 mm | 40 mm | |||||||||||||||||||||||||||||
| XA7Z030-1FBG484Q | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | AMD | 130 | Obsolete | Tray | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, Zynq®-7000 XA | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EG-1FFVC1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | Tray | XCZU7 | 活跃 | 360 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGIB022R31B2E2VAA | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 720 | Tray | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-1LLIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 活跃 | 692 | Tray | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA022R31C3I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 720 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3EG-3SFVC784E | AMD | 数据表 | 281 In Stock | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | Obsolete | 252 | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1502-2LLEVFVC1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | 活跃 | Tray | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1702-1LLIVSVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 活跃 | 500 | Tray | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z015-2CLG485I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 485-LFBGA, CSPBGA | 485-CSPBGA (19x19) | AMD | Tray | XC7Z015 | 活跃 | 130 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 766MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 74K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1SX040HH3F35I1VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 活跃 | 374 | Tray | -40°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z020-L1CLG400I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | AMD | Tray | XC7Z020 | 活跃 | 130 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB027R31C2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 720 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-2SB485I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-FBGA, FCBGA | 484-FCBGA (19x19) | AMD | Tray | XC7Z030 | 活跃 | 130 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - |
-
AGFA014R24C3E3E
Intel
分类:Embedded - System On Chip (SoC)
-
XCVC1702-1LSIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1702-1MLINSVG1369
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1502-2LSEVFVC1760
AMD
分类:Embedded - System On Chip (SoC)
-
1SX280LH2F55E1VG
ALTERA
分类:Embedded - System On Chip (SoC)
-
AGFB012R24B2E4F
Intel
分类:Embedded - System On Chip (SoC)
-
XCZU7EV-1FFVC1156I
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1802-2LLEVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
-
XCVP1202-2LLEVSVA2785
AMD
分类:Embedded - System On Chip (SoC)
-
5CSXFC5C6U23C7N
ALTERA
分类:Embedded - System On Chip (SoC)
-
5CSXFC2C6U23A7N
ALTERA
分类:Embedded - System On Chip (SoC)
-
5ASXMB5G4F40C5N
ALTERA
分类:Embedded - System On Chip (SoC)
-
XA7Z030-1FBG484Q
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU7EG-1FFVC1156E
AMD
分类:Embedded - System On Chip (SoC)
-
AGIB022R31B2E2VAA
Intel
分类:Embedded - System On Chip (SoC)
-
XCVC1902-1LLIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
AGFA022R31C3I3V
Intel
分类:Embedded - System On Chip (SoC)
-
XCZU3EG-3SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1502-2LLEVFVC1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1702-1LLIVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
-
XC7Z015-2CLG485I
AMD
分类:Embedded - System On Chip (SoC)
-
1SX040HH3F35I1VG
Intel
分类:Embedded - System On Chip (SoC)
-
XC7Z020-L1CLG400I
AMD
分类:Embedded - System On Chip (SoC)
-
AGFB027R31C2E3V
Intel
分类:Embedded - System On Chip (SoC)
-
XC7Z030-2SB485I
AMD
分类:Embedded - System On Chip (SoC)