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产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	表面安装	供应商器件包装	材料	形状	终端数量	第一种连接器安装类型	第二个连接器安装类型																		厂商																													操作温度	包装	系列	尺寸/尺寸	容差	零件状态	终止次数	温度系数	类型	电阻	组成	颜色	功率(瓦特)	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	入口保护	端子间距	样式	Reach合规守则	JESD-30代码	输出的数量	资历状况	工作电源电压	失败率	电源	温度等级	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	使用方法	建筑学	输入数量	座位高度-最大	可编程逻辑类型	保质期	粘合剂	储存/恢复温度	产品类别	保质期开始	支持，载体	第一个连接器	第二个连接器	外形尺寸	主要属性	逻辑单元数	导热性能	闪光大小	热电阻率	产品类别
XCZU48DR-2FFVG1517I	Xilinx	数据表	968 In Stock	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思	561	Tray	活跃							-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																												533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA													Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU2CG-1UBVA530E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	530-WFBGA, FCBGA	530-FCBGA (16x9.5)	AMD 赛灵思	82	活跃	2 x 32 kB, 2 x 32 kB	103320 LE	+ 100 C	0 C	SMD/SMT	2 x 32 kB, 2 x 32 kB	256 kB							0°C ~ 100°C (TJ)																										850 mV				500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA													Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			4 Core	-
XCVC1702-2MLEVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	608	Tray	活跃									Versal™ AI Core																												600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA													Versal™ AI Core FPGA, 1M Logic Cells				-
AGFB027R31C2I1VAA	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	720	Tray	活跃							-40°C ~ 100°C (TJ)		Agilex F																												1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA													FPGA - 2.7M Logic Elements				-
XCVC1802-2LLEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思	770	Tray	活跃							0°C ~ 100°C (TJ)		Versal™ AI Core																												450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA													Versal™ AI Core FPGA, 1.5M Logic Cells				-
XCVM1802-1MSEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思	726	Tray	活跃							0°C ~ 100°C (TJ)		Versal™ Prime																												600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA													Versal™ Prime FPGA, 1.9M Logic Cells				-
AGFB022R31C2E2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	720	Tray	活跃							0°C ~ 100°C (TJ)		Agilex F																												1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA													FPGA - 2.2M Logic Elements				-
AGFB008R16A2I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	384	Tray	活跃							-40°C ~ 100°C (TJ)		Agilex F																												1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA													FPGA - 764K Logic Elements				-
XAZU4EV-1SFVC784I4942	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1
XCZU2CG-1SFVC784E5074	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1
XCVM1802-2MSIVSVA2197-5200	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx									+ 110 C	- 40 C	1	Xilinx																SOC - Systems on a Chip												800 mV																		System-On-Modules - SOM													SoC FPGA
10AS066N3F40E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	588	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	21	SMD/SMT	82500 LAB	965088	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-								0°C ~ 100°C (TJ)	Tray	Arria 10 SX			活跃									SOC - Systems on a Chip																1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA							SoC FPGA						FPGA - 660K Logic Elements			2 Core	--			SoC FPGA
10AS016E4F27E3SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-BBGA, FCBGA	672-FBGA (27x27)	Silicone, Ceramic Filled	Square	Laird Technologies - Thermal Materials	A17883	活跃	240	Non-Compliant	有	2 x 32 kB	1.2 GHz	160000 LE	1	SMD/SMT	20000 LAB	964702	Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-					Bulk	0°C ~ 100°C (TJ)	Tray	Tflex™ HD80000			活跃			Gap Filler Pad, Sheet			Teal			SOC - Systems on a Chip																1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	-	MCU, FPGA				12 Months	-	32°F ~ 95°F (0°C ~ 35°C)	SoC FPGA	Date of Certification	-			228.60mm x 228.60mm	FPGA - 160K Logic Elements		6.0W/m-K	2 Core	--		-	SoC FPGA				0.150 (3.81mm)
AGFB014R24B2E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Molex						Bulk	085643	活跃	768		0°C ~ 100°C (TJ)		*																												1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA													FPGA - 1.4M Logic Elements				-
CYW4373IUBGT	Cypress	数据表	N/A	-	最小起订量: 1 最小包装量: 1	面板安装	Free Hanging (In-Line)	Amphenol Custom Cable				Female	Bag	50 Ohms	Q-2F02R0	Bulkhead - Front Side Nut	活跃	Male	11 GHz	-	RG-58				-		-									Black								-		SMA to N-Type																										SMA Jack, Right Angle	N-Type Plug, Right Angle							Shielded				48.0 (1.2m) 4.0
10AS027H4F34E3LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Axial	YES	Axial	1152	270000 LE	1	SMD/SMT	33750 LAB	964972	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	Vishay Foil Resistors (Division of Vishay Precision Group)	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	5.43	0.93 V	INTEL CORP	活跃	SQUARE	BGA	10AS027H4F34E3LG	有	100 °C	0.87 V	未说明	0.9 V	BGA1152,34X34,40					Bulk	活跃	384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	-55°C ~ 125°C	Tray	HZ	0.500 Dia x 1.500 L (12.70mm x 38.10mm)	±0.005%	活跃	4	±0.2ppm/°C		100 Ohms	金属箔		2.5W	8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明		1 mm		compliant	S-PBGA-B1152	384	不合格		-	0.9 V	OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	384	3.65 mm	现场可编程门阵列				SoC FPGA						FPGA - 270K Logic Elements	270000		2 Core	--	Non-Inductive		SoC FPGA	-	35 mm	35 mm
BCM3384MKFSBGB0T	Broadcom	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Broadcom Limited						Tray	Obsolete						*
10AS066H4F34I3SGES	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	-	-	TE Connectivity Laird	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66			Male	Bulk	CASNM48	-	活跃	-	-	-	492	BGA,	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	10AS066H4F34I3SGES	BGA	SQUARE	-	Tray	-			Discontinued at Digi-Key						-		8542.39.00.01			BOTTOM	BALL		-	1 mm	RP-BNC to N-Type	compliant	S-PBGA-B1152						INDUSTRIAL	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		3.65 mm	现场可编程门阵列							N-Type Plug	-		FPGA - 660K Logic Elements				--	-				48.0 (1.2m) 4.0	35 mm
10AS066K2F40I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FBGA (40x40)	1517	Renesas Electronics America Inc		Tape & Reel (TR)	Obsolete	696	40 X 40 MM, ROHS COMPLIANT, FBGA-1517	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	有	10AS066K2F40I1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66				-40°C ~ 100°C (TJ)	Tray	-			Discontinued at Digi-Key								8542.39.00.01			BOTTOM	BALL			1 mm		compliant	S-PBGA-B1517						INDUSTRIAL	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		3.5 mm	现场可编程门阵列										FPGA - 660K Logic Elements				--					40 mm	40 mm
1SX250LU3F50I1VG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Molex				Bulk	007700	活跃	704						-40°C ~ 100°C (TJ)	Tray	*			活跃																									1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA													FPGA - 2500K Logic Elements				--
10AS066K2F40E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FBGA (40x40)	1517	Molex	5.46					Bulk	112180	活跃	696	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	0.9 V	未说明	0.87 V	100 °C	有	10AS066K2F40E2LG	BGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	0°C ~ 100°C (TJ)	Tray	*			活跃								8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	未说明		1 mm		compliant	S-PBGA-B1517	696	不合格			0.9 V	OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	696	3.5 mm	现场可编程门阵列										FPGA - 660K Logic Elements	660000			--					40 mm	40 mm
10AS048E2F29I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0603 (1608 Metric)	YES	0603	780	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	480000 LE	1	SMD/SMT	60000 LAB	965350	Intel	Intel / Altera	Arria 10 SoC	Details	KOA Speer Electronics, Inc.	2 x 32 kB	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS048E2F29I2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.49					Tape & Reel (TR)	RN731J	Obsolete	360	有	-55°C ~ 155°C	Tray	RN73	0.063 L x 0.031 W (1.60mm x 0.80mm)	±0.1%	活跃	2	±10ppm/°C		787 Ohms	Thin Film		0.063W, 1/16W	8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明		1 mm		compliant	S-PBGA-B780	360	不合格			0.9 V	INDUSTRIAL	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	360	3.35 mm	现场可编程门阵列				SoC FPGA						FPGA - 480K Logic Elements	480000		2 Core	--	Moisture Resistant		SoC FPGA	0.022 (0.55mm)	29 mm	29 mm
10AS048H2F34E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-1152	YES	1152	Free Hanging (In-Line)	面板安装	Male	Bag	50 Ohms	Q-1X03D0	-	活跃	Female	11 GHz	Bulkhead - Front Side Nut	RG-58	492	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	-	2 x 32 kB	Amphenol Custom Cable	Details	Arria 10 SoC	Intel / Altera	Intel	973516	60000 LAB	SMD/SMT	1	480000 LE	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS048H2F34E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.47				-	Tray	-			活跃						Black		8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	-	1 mm	SMA to N-Type	compliant	S-PBGA-B1152	492	不合格			0.9 V	OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	492	3.65 mm	现场可编程门阵列				SoC FPGA			SMA插头	N-Type Jack		FPGA - 480K Logic Elements	480000		2 Core	--	Shielded	SoC FPGA	12.00 (304.80mm)	35 mm
10AS027E3F27I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0805 (2012 Metric)	YES	0805	672	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	270000 LE	1	SMD/SMT	33750 LAB	973477	Intel	Intel / Altera	Arria 10 SoC	Details	KOA Speer Electronics, Inc.	2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS027E3F27I2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.43					Tape & Reel (TR)	RN732A	Obsolete	240	有	-55°C ~ 155°C	Tray	RN73	0.079 L x 0.049 W (2.00mm x 1.25mm)	±0.5%	活跃	2	±10ppm/°C		305 Ohms	Thin Film		0.1W, 1/10W	8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明		1 mm		compliant	S-PBGA-B672	240	不合格			0.9 V	INDUSTRIAL	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	240	3.25 mm	现场可编程门阵列				SoC FPGA						FPGA - 270K Logic Elements	270000		2 Core	--	Moisture Resistant		SoC FPGA	0.024 (0.60mm)	27 mm	27 mm
AGIB023R18A2E2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	480	Tray	活跃							0°C ~ 100°C (TJ)		Agilex I																												1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA													FPGA - 2.3M Logic Elements				-