N/A

-

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

40

1.14 V

85 °C

有

M2S005-VFG400

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.28

2.5, 3.3 V

169

Tray

M2S005

活跃

-

166 MHz

6060 LE

+ 85 C

0 C

SMD/SMT

-

64 kB

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

0 to 85 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

171

1.51 mm

现场可编程门阵列

STD

FPGA - 5K Logic Modules

6060

1 Core

128KB

17 mm

17 mm

N/A

-

FPBGA-484

YES

484-FPBGA (23x23)

484

Microchip

Microchip Technology / Atmel

SmartFusion

Details

-

64 kB

Tray

微芯片技术

A2F500

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

-40 °C

1.5 V

30

1.425 V

100 °C

有

A2F500M3G-FGG484I

80 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.22

有

-

80 MHz

6000 LE

204 I/O

+ 100 C

0.062696 oz

- 40 C

60

SMD/SMT

-

-40°C ~ 100°C (TJ)

Tray

A2F500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

128

不合格

1.5 V

1.5,1.8,2.5,3.3 V

INDUSTRIAL

16.5 mA

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

现场可编程门阵列

SoC FPGA

500000

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

SoC FPGA

23 mm

23 mm

N/A

-

400-LFBGA

400-VFBGA (17x17)

微芯片技术

活跃

-

166 MHz

27696 LE

-

64 kB

207

Tray

M2S025

0°C ~ 85°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

484-BGA

YES

484-FPBGA (23x23)

484

100 MHz

6000 LE

+ 85 C

0.534969 oz

0 C

60

SMD/SMT

-

Microchip

微芯片技术

Microchip Technology / Atmel

SmartFusion

Details

-

64 kB

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

1.5 V

40

1.425 V

85 °C

有

A2F500M3G-1FGG484

100 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

1.36

1.5000 V

1.425 V

1.575 V

MCU - 41, FPGA - 128

Tray

A2F500

活跃

有

-

0 to 85 °C

Tray

SmartFusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

128

不合格

1.5 V

1.5,1.8,2.5,3.3 V

OTHER

16.5 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

现场可编程门阵列

SoC FPGA

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

SoC FPGA

23 mm

23 mm

N/A

-

484-BGA

484-FPBGA (23x23)

微芯片技术

SMD/SMT

-

64 kB

25 V

1.2000 V

1.14 V

1.26 V

267

Tray

M2S025

活跃

-

166 MHz

27696 LE

+ 85 C

0 C

0 to 85 °C

SmartFusion®2

200 ppm/°C

6.8

0.05 W

通用型

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

1

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

484-BGA

484-FPBGA (23x23)

微芯片技术

12084 LE

+ 85 C

0 C

SMD/SMT

-

64 kB

233

Tray

M2S010

活跃

-

166 MHz

0°C ~ 85°C (TJ)

SmartFusion®2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 10K Logic Modules

1 Core

256KB

N/A

-

Production (Last Updated: 1 month ago)

VFPBGA-256

256-FPBGA (17x17)

微芯片技术

138

Tray

M2S010

活跃

Compliant

有

This product may require additional documentation to export from the United States.

-

166 MHz

12084 LE

119

SMD/SMT

1007 LAB

Microchip

Microchip Technology / Atmel

-

64 kB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

SOC - Systems on a Chip

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

SoC FPGA

FPGA - 10K Logic Modules

1 Core

256KB

SoC FPGA

831 In Stock

-

FPBGA-484

YES

484-FPBGA (23x23)

484

表面贴装

1.5000 V

1.425 V

500000

500000

1.575 V

有

This product may require additional documentation to export from the United States.

-

80 MHz

6000 LE

204 I/O

+ 85 C

0 C

60

微芯片技术

SMD/SMT

-

Microchip

Microchip Technology / Atmel

SmartFusion

Details

-

64 kB

Tray

A2F500

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

1.5 V

40

1.425 V

85 °C

有

A2F500M3G-FGG484

80 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

1.37

±2.8(20th) ppm/Year

40 MHz

40 MHz

-20 to 70 °C

Tray

A2F500

e1

Temperature Compensated Crystal Oscillator (TCXO)

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

250

1 mm

compliant

4.6 ppm

10

S-PBGA-B484

128

不合格

3.0000 V

1.5,1.8,2.5,3.3 V

OTHER

16.5 mA

10 pF

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

现场可编程门阵列

SoC FPGA

500000

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

削波正弦波

512KB

SoC FPGA

23 mm

23 mm

N/A

-

144-LQFP

144-TQFP (20x20)

微芯片技术

84

Tray

Obsolete

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 10K Logic Modules

256KB

N/A

-

Renesas Electronics America Inc

Bulk

活跃

*

50

N/A

-

-

-

Intel

Tray

活跃

3707-600500-NBR

Name Brand Replacements™

384

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

N/A

-

-

-

Intel

3336435

cUL, UL

Rittal

720

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

N/A

-

-

-

Intel

480

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

746 In Stock

-

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

XAZU2

活跃

128

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 1.2GHz

1.2MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

N/A

-

-

-

Intel

744

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

N/A

-

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

561

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

532

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

N/A

-

1024-BFBGA

1024-BGA (31x31)

AMD

316

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

N/A

-

494-WFBGA, FCBGA

494-FCBGA (14x14)

AMD

180

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

Zynq®UltraScale+™ FPGA, 81K+ Logic Cells

-

N/A

-

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

-

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™

CAN/Serial I2C/SPI/U

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

-

-

N/A

-

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

-

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™

CAN/Serial I2C/SPI/U

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

-

N/A

-

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

活跃

Tray

-

N/A

-

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

-

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

-

N/A

-

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-