类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 供应商器件包装 | Core | 厂商 | 操作温度 | 包装 | 系列 | 类型 | 电压 - 供电 | 频率 | 工作频率 | 工作电源电压 | 内存大小 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序存储器类型 | 程序内存大小 | 连接方式 | 输出功率 | 数据率 | 建筑学 | 数据总线宽度 | 使用的 IC/零件 | 议定书 | 功率 - 输出 | 无线电频率系列/标准 | 收发器数量 | 天线类型 | 敏感度 | 数据率(最大) | ADC通道数量 | 主要属性 | 串行接口 | 接收电流 | 传输电流 | 定时器数量 | 调制 | 核数量 | [医]GPIO | 闪光大小 | ADC Resolution | 高度 | 长度 | 宽度 | ||||||||||||||||||||||||||||
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![]() | XCZU47DR-2FSVE1156I5149 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1156 | ARM Cortex A53, ARM Cortex R5F | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 930300 LE | 394 I/O | - 40 C | + 100 C | 13 Mb | 53160 LAB | 1 | SMD/SMT | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3CG-L1UBVA530I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5F | AMD 赛灵思 | SMD/SMT | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 154350 LE | 82 I/O | - 40 C | + 100 C | 1.8 Mb | 8820 LAB | 1 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 850 mV | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 4 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2CG-L2UBVA530E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5F | AMD 赛灵思 | 2 x 32 kB, 2 x 32 kB | 256 kB | 103320 LE | 82 I/O | 0 C | + 110 C | 1.2 Mb | 5904 LAB | 1 | 活跃 | SMD/SMT | 2 x 32 kB, 2 x 32 kB | 0°C ~ 100°C (TJ) | 850 mV | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 4 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-2UBVA530I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | AMD 赛灵思 | SMD/SMT | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 256 kB | 154350 LE | 82 I/O | - 40 C | + 100 C | 1.8 Mb | 8820 LAB | 1 | Tray | 活跃 | -40°C ~ 100°C (TJ) | - | 850 mV | 533MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 7 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1EG-2SBVA484E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-484 | 484-FCBGA (19x19) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | AMD 赛灵思 | SMD/SMT | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 256 kB | 81900 LE | 82 I/O | 0 C | + 100 C | 1 Mb | 4680 LAB | 1 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 850 mV | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | 7 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1EG-2UBVA494E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-494 | 494-FCBGA (14x14) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | AMD 赛灵思 | 1 | 4680 LAB | 1 Mb | + 100 C | 0 C | 82 I/O | 81900 LE | 256 kB | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | SMD/SMT | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 850 mV | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | 7 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1EG-2UBVA494I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-494 | 494-FCBGA (14x14) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | AMD 赛灵思 | SMD/SMT | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 256 kB | 81900 LE | 82 I/O | - 40 C | + 100 C | 1 Mb | 4680 LAB | 1 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 850 mV | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | 7 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU28DR-L2FFVG1517I5073 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1517 | ARM Cortex A53, ARM Cortex R5F | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 930300 LE | 597 I/O | - 40 C | + 100 C | 13 Mb | 53160 LAB | 1 | SMD/SMT | 720 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250TL-FCVG784E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TS-1FCVG784I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-BGA | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | - 40 C | + 100 C | 1 | Tray | 活跃 | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250TS-FCVG784I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | - 40 C | + 100 C | 1 | Tray | 活跃 | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250T-1FCSG536I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCSG-536 | 536-LFBGA | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095T-1FCVG784E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-BGA | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | 0°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TS-FCSG536I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-536 | 536-LFBGA | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | - 40 C | + 100 C | 1 | Tray | 活跃 | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-2FFVG1517I5089 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1517 | ARM Cortex A53, ARM Cortex R5F | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 930300 LE | 597 I/O | - 40 C | + 100 C | 13 Mb | 53160 LAB | 1 | SMD/SMT | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2MLEVIVA1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD 赛灵思 | 0 C | + 110 C | 1 | 500 | Tray | 活跃 | Details | 0°C ~ 100°C (TJ) | Versal™ AI Core | 800 mV | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3CG-1SFVC784I4806 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5 | 7.6 Mbit | 8820 LAB | 1 | Zynq UltraScale+ | This product may require additional documentation to export from the United States. | SMD/SMT | 600 MHz, 1.5 GHz | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | - | 154350 LE | 252 I/O | - 40 C | + 100 C | 1.8 Mbit | XCZU15EG | 0.85 V | - | 4 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EV-2SFVC784I4793 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | Zynq UltraScale+ | This product may require additional documentation to export from the United States. | SMD/SMT | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 192150 LE | 252 I/O | 2.6 Mbit | 4.5 Mbit | 10980 LAB | 1 | XCZU4EV | - | 4 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1EG-1SFVA625E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-625 | 625-FCBGA (21x21) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | AMD 赛灵思 | SMD/SMT | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 256 kB | 81900 LE | 72 I/O | 0 C | + 100 C | 1 Mb | 4680 LAB | 1 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 850 mV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | 7 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1EG-1SFVA625I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-625 | 625-FCBGA (21x21) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | AMD 赛灵思 | 2 x 32 kB, 4 x 32 kB | 256 kB | 81900 LE | 72 I/O | - 40 C | + 100 C | 1 Mb | 4680 LAB | 1 | 活跃 | SMD/SMT | 2 x 32 kB, 4 x 32 kB | -40°C ~ 100°C (TJ) | 850 mV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | 7 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATWINC1500B-MU-Y042 | Atmel (Microchip Technology) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | QFN-40 | APS3 | SMD/SMT | 490 | 72.2 Mbps | 2.7 V | 4.2 V | 61 mA | 268 mA | - 40 C | + 85 C | 64 kB, 128 kB | RAM | I2C, SPI, UART | 48 MHz | 有 | Tray | Wi-Fi | 2.4 GHz | Flash | 4 MB | 18.5 dBm | 32 bit | - 74 dBm | 0.85 mm | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ESP8684H2 | Espressif Systems | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | QFN-24 | 24-QFN (4x4) | RISC-V | SMD/SMT | Espressif Systems | 5000 | Tape & Reel (TR) | ESP8684 | 活跃 | 3.6 V | 72.2 Mbps | 3 V | 62 mA | 370 mA | - 40 C | + 105 C | 272 kB | SRAM | GPIO, I2C, SPI, UART | 120 MHz | 有 | -40°C ~ 105°C | ESP8684 | Bluetooth, Wi-Fi | 3V ~ 3.6V | 2.402GHz ~ 2.48GHz, 2.412GHz ~ 2.484GHz | 2.4 GHz | 576KB ROM, 272KB SRAM | Flash | 2 MB | 20 dBm | 802.11b/g/n, Bluetooth v5.0 | 21.5dBm | Bluetooth, WiFi | - 106.5 dBm | 72.2Mbps | 5 Channel | ADC, GPIO, I²C, I²S, PWM, SPI, UART | 65mA | 300mA ~ 370mA | 3 | - | 14 | 12 bit | 0.85 mm | 4 mm | 4 mm | |||||||||||||||||||||||||||||
![]() | ESP32-S3FH4R2 | Espressif Systems | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | QFN-56 | LX7 | 2 MB | PSRAM | SPI | 240 MHz | 有 | Espressif Systems | SMD/SMT | 45 I/O | LX7 | 2000 | Tape & Reel (TR) | ESP32-S3 | 活跃 | 3.6 V | This product may require additional documentation to export from the United States. | 150 Mbps | 1.8 V | 91 mA | 340 mA | - 40 C | + 105 C | -40°C ~ 85°C (TA) | ESP32 | Bluetooth, Wi-Fi | 3V ~ 3.6V | 2.4GHz | 2.4 GHz | 2MB Flash, 2MB SRAM | Flash | 4 MB | 21 dBm | 150Mbps | 32 bit | ESP32-S3R8 | 802.11b/g/n, Bluetooth v5.0 | 21dBm | Bluetooth, WiFi | 不包括天线 | - 76.5 dBm | 20 Channel | ADC, GPIO, I²C, I²S, IrDA, JTAG, PCM, PWM, SDIO, SPI, UART, USB | 88mA ~ 91mA | 283mA ~ 340mA | 8 | - | 12 bit | 0.85 mm | 7 mm | 7 mm | |||||||||||||||||||||||||
![]() | EFR32FG23B020F512IM40-C | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | QFN-40 | ARM Cortex M33 | SMD/SMT | Details | 1.71 V | - 40 C | + 125 C | 64 kB | 有 | 3.8 V | 78 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EFR32FG23A011F512GM40-CR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | QFN-40 | ARM Cortex M33 | I2C, SPI, UART | RAM | 64 kB | 3.8 V | Details | 2 Mbps | 1.71 V | 4.2 mA | 25 mA | - 40 C | + 85 C | 78 MHz | 有 | SMD/SMT | 22 I/O | Wi-Fi | 868 MHz, 915 MHz, 920 MHz | Flash | 512 kB | 14 dBm | 32 bit | - 96.9 dBm | 1 Channel | 5 | 12 bit, 16 bit | 0.85 mm | 5 mm | 5 mm |
XCZU47DR-2FSVE1156I5149
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU3CG-L1UBVA530I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU2CG-L2UBVA530E
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU3EG-2UBVA530I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU1EG-2SBVA484E
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU1EG-2UBVA494E
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU1EG-2UBVA494I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU28DR-L2FFVG1517I5073
Xilinx
分类:Embedded - System On Chip (SoC)
MPFS250TL-FCVG784E
Microchip Technology
分类:Embedded - System On Chip (SoC)
MPFS095TS-1FCVG784I
Microchip Technology
分类:Embedded - System On Chip (SoC)
MPFS250TS-FCVG784I
Microchip Technology
分类:Embedded - System On Chip (SoC)
MPFS250T-1FCSG536I
Microchip Technology
分类:Embedded - System On Chip (SoC)
MPFS095T-1FCVG784E
Microchip Technology
分类:Embedded - System On Chip (SoC)
MPFS095TS-FCSG536I
Microchip Technology
分类:Embedded - System On Chip (SoC)
XCZU48DR-2FFVG1517I5089
Xilinx
分类:Embedded - System On Chip (SoC)
XCVC1902-2MLEVIVA1596
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU3CG-1SFVC784I4806
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU4EV-2SFVC784I4793
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU1EG-1SFVA625E
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU1EG-1SFVA625I
Xilinx
分类:Embedded - System On Chip (SoC)
ATWINC1500B-MU-Y042
Atmel (Microchip Technology)
分类:Embedded - System On Chip (SoC)
ESP8684H2
Espressif Systems
分类:Embedded - System On Chip (SoC)
ESP32-S3FH4R2
Espressif Systems
分类:Embedded - System On Chip (SoC)
EFR32FG23B020F512IM40-C
Silicon Labs
分类:Embedded - System On Chip (SoC)
EFR32FG23A011F512GM40-CR
Silicon Labs
分类:Embedded - System On Chip (SoC)
