类别是'category.片上系统(SoC)' (7695)

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JESD-609代码

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端子表面处理

最高工作温度

最小工作温度

组成

HTS代码

子类别

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电压 - 供电

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Reach合规守则

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JESD-30代码

输出的数量

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uPs/uCs/外围ICs类型

核心处理器

周边设备

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输出功率

最大反向漏电电流

箝位电压

建筑学

数据总线宽度

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最大浪涌电流

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方向

测试电流

座位高度-最大

可编程逻辑类型

产品类别

议定书

反向击穿电压

筛选水平

功率 - 输出

速度等级

无线电频率系列/标准

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串行接口

接收电流

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传输电流

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调制

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双向通道数

[医]GPIO

闪光大小

最小击穿电压

产品类别

高度

长度

宽度

辐射硬化

XCVC1802-2HSIVIVA1596
XCVC1802-2HSIVIVA1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD

500

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ AI Core

800MHz, 1.65GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

AGIB023R18A1E2V
AGIB023R18A1E2V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

480

Tray

活跃

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

XCVC1902-2MLEVSVA2197
XCVC1902-2MLEVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XAZU3EG-1SFVC784I
XAZU3EG-1SFVC784I
AMD 数据表

800 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

128

Tray

活跃

XAZU3

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 1.2GHz

1.8MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

M2S010T-VFG400I
M2S010T-VFG400I
Microchip 数据表

35 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

400-LFBGA

YES

2

400-VFBGA (17x17)

400

微芯片技术

M2S010

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

M2S010T-VFG400I

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.77

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

12.2 V

11 V

1

Compliant

195

Tray

-40°C ~ 100°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

150 °C

-55 °C

Zener

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

195

不合格

11 V

双向

1.2 V

5 µA

Single

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

5 µA

18.2 V

MCU, FPGA

82.4 A

82.4 A

1.5 kW

195

双向

1 mA

1.51 mm

现场可编程门阵列

12.2 V

FPGA - 10K Logic Modules

12084

1 Core

1

256KB

12.2 V

17 mm

17 mm

XCZU7EG-3FFVC1156E
XCZU7EG-3FFVC1156E
AMD 数据表

929 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.9000 V

0.873 V

0.927 V

360

Tray

XCZU7

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU4EV-L1SFVC784I
XCZU4EV-L1SFVC784I
AMD 数据表

937 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

192,150

FCBGA

0.9000 V

0.88 V

0.92 V

252

Tray

XCZU4

活跃

Industrial grade

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EV

784

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

1L

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

175,680

-

XCZU2CG-L1SBVA484I
XCZU2CG-L1SBVA484I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

82

Tray

XCZU2

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XAZU5EV-L1SFVC784I
XAZU5EV-L1SFVC784I
AMD 数据表

630 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

0.7200 V

0.698 V

0.742 V

252

Tray

XAZU5

活跃

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1L

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

ATWINC1500B-MU-Y042
ATWINC1500B-MU-Y042
Microchip 数据表

834 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

QFN-40

YES

40-QFN (5x5)

40

微芯片技术

48 MHz

72.2 Mbps

+ 85 C

4.2 V

- 40 C

490

2.7 V

SMD/SMT

268 mA

I2C, SPI, UART

61 mA

Microchip

Microchip Technology / Atmel

RAM

64 kB, 128 kB

Tray

ATWINC1500

活跃

VQFN-40

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

PLASTIC/EPOXY

LCC40,.2SQ,16

-40 °C

3.3 V

85 °C

ATWINC1500B-MU-Y042

48 MHz

HQCCN

SQUARE

活跃

MICROCHIP TECHNOLOGY INC

5.06

-40°C ~ 85°C

Tray

-

Wi-Fi

Wireless & RF Integrated Circuits

Si

2.7V ~ 3.6V

QUAD

无铅

0.4 mm

compliant

2.4GHz

S-PQCC-N40

2.4 GHz

INDUSTRIAL

4MB Flash, 128kB ROM, 224kB RAM

网络控制器

Flash

4 MB

18.5 dBm

32 bit

1 mm

RF System on a Chip - SoC

802.11b/g/n

20.5dBm

WiFi

- 74 dBm

72.2Mbps

I²C, SDIO, SPI, UART

22mA ~ 58.5mA

22mA ~ 294mA

CCK, DSSS, OFDM

9

RF System on a Chip - SoC

0.85 mm

5 mm

5 mm

XCZU7CG-1FFVF1517E
XCZU7CG-1FFVF1517E
AMD 数据表

623 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

0.8500 V

0.808 V

0.892 V

464

Tray

XCZU7

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU5EV-3SFVC784E
XCZU5EV-3SFVC784E
AMD 数据表

384 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

0.9000 V

0.873 V

0.927 V

252

Tray

XCZU5

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

A2F200M3F-1FG256I
A2F200M3F-1FG256I
Microchip 数据表

45 In Stock

-

最小起订量: 1

最小包装量: 1

256-LBGA

256-FPBGA (17x17)

微芯片技术

MCU - 25, FPGA - 66

Tray

A2F200

活跃

-40°C ~ 100°C (TJ)

SmartFusion®

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

XCZU4EV-2SFVC784E
XCZU4EV-2SFVC784E
AMD 数据表

747 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

Tray

XCZU4

活跃

192,150

0.8500 V

252

表面贴装

252

0 to 100 °C

Zynq® UltraScale+™ MPSoC EV

784

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

2

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

175,680

-

XCZU11EG-3FFVC1760E
XCZU11EG-3FFVC1760E
AMD 数据表

922 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

653100

0.9000 V

512

512

Tray

XCZU11

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

1760

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

3

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

597120

-

M2S025-1FG484
M2S025-1FG484
Microchip 数据表

2947 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

微芯片技术

1.2000 V

1.14 V

1.26 V

267

Tray

M2S025

活跃

-

166 MHz

27696 LE

SMD/SMT

-

64 kB

0 to 85 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 25K Logic Modules

1 Core

256KB

XCZU19EG-2FFVE1924E
XCZU19EG-2FFVE1924E
AMD 数据表

660 In Stock

-

最小起订量: 1

最小包装量: 1

1924-BBGA, FCBGA

1924-FCBGA (45x45)

AMD

668

Tray

XCZU19

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

A2F500M3G-CSG288I
A2F500M3G-CSG288I
Microchip 数据表

2494 In Stock

-

最小起订量: 1

最小包装量: 1

288-TFBGA, CSPBGA

288-CSP (11x11)

微芯片技术

Tray

A2F500

活跃

1.5000 V

1.425 V

500000

1.575 V

MCU - 31, FPGA - 78

-40 to 100 °C

SmartFusion®

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

M2S050-FG484I
M2S050-FG484I
Microchip 数据表

2847 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

微芯片技术

活跃

SMARTFUSION2

100C

Industrial

FPBGA

-40C to 100C

267

56340

65nm

1.26(V)

1.2(V)

1.14(V)

-40C

56340

表面贴装

This product may require additional documentation to export from the United States.

-

166 MHz

56340 LE

60

SMD/SMT

4695 LAB

Microchip

Microchip Technology / Atmel

N

-

64 kB

267

Tray

M2S050

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

SOC - Systems on a Chip

484

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

SoC FPGA

FPGA - 50K Logic Modules

1 Core

256KB

SoC FPGA

XCVC1802-2MLEVSVA2197
XCVC1802-2MLEVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

AGFB012R24C2E2V
AGFB012R24C2E2V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

744

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

XCZU17EG-1FFVD1760I
XCZU17EG-1FFVD1760I
AMD 数据表

575 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

308

Tray

XCZU17

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

AGFA012R24C3E3E
AGFA012R24C3E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

744

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

XCVC1702-2MLIVSVA2197
XCVC1702-2MLIVSVA2197
AMD 数据表

620 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

608

Tray

活跃

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

XCZU6CG-1FFVB1156I
XCZU6CG-1FFVB1156I
AMD 数据表

966 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.8500 V

0.808 V

0.892 V

328

Bulk

XCZU6

活跃

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-