173 In Stock

-

表面贴装

4-SMD, No Lead

1156-FCBGA (35x35)

Suntsu Electronics, Inc.

Bulk

活跃

328

XCZU6

-40°C ~ 85°C

SXT214

0.079 L x 0.063 W (2.00mm x 1.60mm)

兆赫晶体

37.4 MHz

±25ppm

100 Ohms

15pF

500MHz, 600MHz, 1.2GHz

256KB

Fundamental

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

±25ppm

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

0.020 (0.50mm)

-

N/A

-

1210 (3225 Metric)

1210

KOA Speer Electronics, Inc.

Tape & Reel (TR)

SG73P2

活跃

0.8500 V

0.808 V

0.892 V

328

-55°C ~ 155°C

SG73P-RT

0.126 L x 0.102 W (3.20mm x 2.60mm)

±0.5%

2

±200ppm/°C

6.19 kOhms

厚膜

0.5W, 1/2W

-

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

Anti-Sulfur, Automotive AEC-Q200, Pulse Withstanding

0.028 (0.70mm)

AEC-Q200

N/A

-

484-LFBGA, CSPBGA

484-CSPBGA (19x19)

Amphenol Socapex

Box

USBFTVX7

活跃

1.0000 V

0.95 V

1.05 V

200

0 to 100 °C

USBF TVX

-

Shielded

24 AWG, 28 AWG

A Female to A Male (Circular Coupling)

766MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

USB 2.0

2

Artix™-7 FPGA, 65K Logic Cells

-

Data Transfer and Charge, Extension Cable, Industrial Environments - IP68, Panel Mount

3.28 (1.00m)

N/A

-

表面贴装

64-LQFP

64-LQFP (10x10)

Infineon Technologies

51

Tray

CY9AF312

A/D 9x12b SAR

活跃

0.8500 V

0.808 V

0.892 V

-40°C ~ 105°C (TA)

FM3 CY9A310

External, Internal

40MHz

16K x 8

2.7V ~ 5.5V

ARM® Cortex®-M3

DMA, LVD, POR, PWM, WDT

FLASH

32-Bit Single-Core

128KB (128K x 8)

CSIO, I²C, LINbus, SPI, UART/USART

MCU, FPGA

-

2

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

N/A

-

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

活跃

0.808 V

0.892 V

204

Tray

XCZU9

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

N/A

-

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU4

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

N/A

-

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.8500 V

0.808 V

0.892 V

360

Tray

XCZU11

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

N/A

-

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

180

Tray

XCZU3

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

N/A

-

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

192,150

FCBGA

0.8500 V

0.808 V

0.892 V

252

Tray

XCZU4

活跃

Industrial grade

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EV

784

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

2

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

175,680

-

N/A

-

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

64 kB

Momentary

MP1-42L10L8

CSA, IEC, UL

ABB

169

Tray

M2S005

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

30

1.14 V

无

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.86

-

166 MHz

6060 LE

SMD/SMT

-

-40°C ~ 100°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1.51 mm

现场可编程门阵列

Fingersafe Screw

1.91

1

FPGA - 5K Logic Modules

1 Core

128KB

LED

1NO

IP66

17 mm

17 mm

N/A

-

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

ACH580-BCR-027A-6+E213+K465+L512

ABB

1.5000 V

1.425 V

200000

200000

1.575 V

MCU - 25, FPGA - 66

Tray

A2F200

活跃

LBGA, BGA256,16X16,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.5 V

30

1.425 V

100 °C

有

100 MHz

LBGA

-40 to 100 °C

SmartFusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B256

66

不合格

1.5,1.8,2.5,3.3 V

INDUSTRIAL

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

66

4608 CLBS, 200000 GATES

1.7 mm

现场可编程门阵列

1

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

200000

256KB

17 mm

17 mm

N/A

-

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

SMD/SMT

-

64 kB

1.2000 V

267

Tray

M2S090

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

有

M2S090TS-FGG484I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.8

-

166 MHz

86316 LE

-40 to 100 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

STD

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

400-LFBGA

YES

400-VFBGA (17x17)

400

PEI-Genesis

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

85 °C

有

M2S060T-VFG400

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.81

Bulk

活跃

Non-Compliant

207

M2S060

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

0°C ~ 85°C (TJ)

*

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

256KB

17 mm

17 mm

N/A

-

Production (Last Updated: 1 month ago)

400-LFBGA

YES

400-VFBGA (17x17)

400

Amphenol PCD

1.26 V

5.81

Box

SJT5

-

活跃

Non-Compliant

195

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

无

M2S010T-VF400I

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

-40°C ~ 100°C (TJ)

SJT

4.144 L x 0.885 W x 0.900 H (105.26mm x 22.48mm x 22.86mm)

e0

Rail

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

195

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

195

1.51 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

8

17 mm

17 mm

N/A

-

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Knowles Syfer

Tape & Reel (TR)

活跃

561

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

表面贴装

8-SMD, No Lead

YES

1152-FBGA (35x35)

1152

CTS-Frequency Controls

0.93 V

INTEL CORP

Obsolete

Intel Corporation

SQUARE

BGA

10AS027H1F34E1SG

Tape & Reel (TR)

580

活跃

384

Non-Compliant

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

0.9 V

0.87 V

100 °C

有

5.64

-40°C ~ 85°C

Tray

580

0.197 L x 0.126 W (5.00mm x 3.20mm)

Discontinued at Digi-Key

TCXO

8542.39.00.01

2.5V

BOTTOM

BALL

1 mm

compliant

16 MHz

±280ppb

削波正弦波

S-PBGA-B1152

Standby (Power Down)

Crystal

6mA

OTHER

10µA

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.65 mm

现场可编程门阵列

-

FPGA - 270K Logic Elements

--

0.079 (2.00mm)

35 mm

35 mm

-

N/A

-

Axial

Axial

Stackpole Electronics Inc

Bulk

活跃

576

-55°C ~ 235°C

RSF

0.177 Dia x 0.433 L (4.50mm x 11.00mm)

±5%

2

±200ppm/°C

390 Ohms

金属氧化膜

1W

-

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

-

Flame Retardant Coating, Safety

-

N/A

-

-

-

TE Connectivity Deutsch 连接器

Bag

DIV46E19

活跃

480

-40°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

N/A

-

-

-

Molex

Bulk

094266

活跃

720

0°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

N/A

-

表面贴装

6-SMD, No Lead

-

Skyworks Solutions Inc.

活跃

480

Tape & Reel (TR)

-40°C ~ 85°C

Ultra™ Si545

0.197 L x 0.126 W (5.00mm x 3.20mm)

XO (Standard)

1.8V ~ 3.3V

106.5 MHz

±20ppm

CMOS

Enable/Disable

Crystal

127mA

112mA

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

-

FPGA - 1.9M Logic Elements

-

0.052 (1.33mm)

-

N/A

-

1596-BFBGA

1596-BGA (37.5x37.5)

Corsair

Bag

MS27496E25B

活跃

500

0°C ~ 100°C (TJ)

*

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

N/A

-

-

-

Amphenol Custom Cable

Q-2I01A0

活跃

Male

6 GHz

RG-316

720

Male

Bag

50 Ohms

-

-

Copper

-

MCX to N-Type

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

MCX Plug, Right Angle

N-Type Plug

FPGA - 2.2M Logic Elements

-

Shielded

39.4 (1.0m) 3.3

N/A

-

780-BBGA, FCBGA

YES

780-FBGA (29x29)

780

Fox Electronics

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

Tape & Reel (TR)

活跃

360

Non-Compliant

29 X 29 MM, ROHS COMPLIANT, FBGA-780

网格排列

PLASTIC/EPOXY

0.9 V

0.87 V

100 °C

有

10AS032E1F29E1SG

BGA

0°C ~ 100°C (TJ)

Tray

*

Discontinued at Digi-Key

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B780

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.35 mm

现场可编程门阵列

FPGA - 320K Logic Elements

--

29 mm

29 mm

N/A

-

FBGA-672

YES

672

Arria 10 SoC

2 x 32 kB

-

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

Amphenol ICC (Commercial Products)

BGA672,26X26,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS027E3F27I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.43

Tray

RJMG2

Obsolete

240

Non-Compliant

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

1

SMD/SMT

33750 LAB

964925

Intel

Intel / Altera

-40°C ~ 100°C (TJ)

Tray

-

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

SoC FPGA

FPGA - 270K Logic Elements

270000

2 Core

--

SoC FPGA

27 mm

27 mm

N/A

-

FBGA-1152

YES

1152

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

Analog Devices Inc./Maxim Integrated

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS032H4F34I3LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

Box

MAX147

Obsolete

384

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

320000 LE

1

SMD/SMT

40000 LAB

965347

Intel

Intel / Altera

Arria 10 SoC

-40°C ~ 100°C (TJ)

Tray

-

活跃

电源管理

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

电池充电器

384

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.65 mm

MAX14750

Board(s)

现场可编程门阵列

SoC FPGA

-

-

-

320000

2 Core

--

SoC FPGA

35 mm

35 mm