类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 越来越多的功能 | 外壳材料 | 供应商器件包装 | 插入材料 | 终端数量 | 后壳材料,电镀 | 第一种连接器安装类型 | 第二个连接器安装类型 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 终止次数 | 终端 | 温度系数 | 连接器类型 | 类型 | 电阻 | 定位的数量 | 组成 | 颜色 | 应用 | 行数 | 功率(瓦特) | HTS代码 | 电容量 | 紧固类型 | 子类别 | 触点类型 | 额定电流 | 螺距 | 技术 | 端子位置 | 方向 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度(摄氏度) | 入口保护 | 端子间距 | 样式 | Reach合规守则 | 输出量 | 外壳完成 | 外壳尺寸-插入 | JESD-30代码 | 输出的数量 | 资历状况 | 失败率 | 引线间距 | 电源 | 温度等级 | 行间距 | 注意 | 速度 | 内存大小 | 外壳尺寸,MIL | 引线样式 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 电缆开口 | 重置 | 建筑学 | 电压 - 阈值 | 监测的电压数量 | 触点终端 | 重置超时 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 第一个连接器 | 第二个连接器 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 特征 | 产品类别 | 座位高度(最大) | 长度 | 宽度 | 厚度(最大) | 触点表面处理厚度 - 配套 | 材料可燃性等级 | 评级结果 | ||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | 10AS032E3F27I2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Axial | YES | Axial | 672 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 320000 LE | 1 | SMD/SMT | 40000 LAB | 965290 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | Vishay Dale | - | BGA, BGA672,26X26,40 | 网格排列 | PLASTIC/EPOXY | BGA672,26X26,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032E3F27I2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Tape & Reel (TR) | ERC55 | 活跃 | 240 | 有 | -65°C ~ 175°C | Tray | ERC | 0.097 Dia x 0.280 L (2.46mm x 7.11mm) | ±1% | 活跃 | 2 | ±50ppm/°C | 127 kOhms | Metal Film | 0.25W, 1/4W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 240 | 不合格 | - | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | Moisture Resistant | SoC FPGA | - | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057N3F40I2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 570000 LE | 21 | SMD/SMT | 71250 LAB | 964986 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | Molex | - | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057N3F40I2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Bulk | 121121 | 活跃 | 588 | 有 | -40°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1517 | 588 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066H3F34E2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, MLCC | 0603 (1608 Metric) | YES | 1152-FCBGA (35x35) | 1152 | Vishay Vitramon | Tape & Reel (TR) | Obsolete | 100V | 492 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS066H3F34E2LG | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0.93 V | 5.45 | -55°C ~ 150°C | Tray | GA | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.5pF | 活跃 | C0G, NP0 | 汽车 | 8542.39.00.01 | 1.5 pF | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 492 | 不合格 | - | - | 0.9 V | OTHER | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | 现场可编程门阵列 | FPGA - 660K Logic Elements | 660000 | -- | - | - | 35 mm | 35 mm | 0.038 (0.97mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048E3F29E2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, MLCC | 0603 (1608 Metric) | YES | 780 | Vishay Vitramon | INTEL CORP | 0.93 V | 5.46 | Tape & Reel (TR) | VJ0603 | 活跃 | 50V | 360 | BGA, BGA780,28X28,40 | 网格排列 | PLASTIC/EPOXY | BGA780,28X28,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS048E3F29E2SG | BGA | SQUARE | Intel Corporation | 活跃 | -55°C ~ 125°C | Tray | VJ HIFREQ | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.5pF | 活跃 | C0G, NP0 | RF, Microwave, High Frequency | 8542.39.00.01 | 4.7 pF | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B780 | 360 | 不合格 | - | 0.9 V | OTHER | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | -- | High Q, Low Loss | - | 29 mm | 29 mm | 0.037 (0.94mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057K2F35E2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1206 (3216 Metric) | YES | 1206 | 1152 | Vishay Dale | Tape & Reel (TR) | 活跃 | 396 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057K2F35E2LG | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0.93 V | 5.45 | -55°C ~ 125°C | Tray | TNPU e3 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.1% | 活跃 | 2 | ±5ppm/°C | 46.4 kOhms | Thin Film | 0.25W, 1/4W | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | - | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | FPGA - 570K Logic Elements | 570000 | -- | Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant | 0.026 (0.65mm) | 35 mm | 35 mm | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K2F35I1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | Molex | Bulk | 121129 | 活跃 | 396 | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | 网格排列 | PLASTIC/EPOXY | -40 °C | 0.9 V | 0.87 V | 100 °C | 有 | 10AS066K2F35I1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.66 | -40°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | 现场可编程门阵列 | FPGA - 660K Logic Elements | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS016E4F27I3SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Axial | YES | Axial | 672 | 160000 LE | 1 | SMD/SMT | 20000 LAB | 964720 | Intel | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | BGA, BGA672,26X26,40 | Stackpole Electronics Inc | 网格排列 | PLASTIC/EPOXY | BGA672,26X26,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS016E4F27I3SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 1.95 | Tape & Box (TB) | 活跃 | 240 | Non-Compliant | 有 | 2 x 32 kB | 1.2 GHz | -55°C ~ 155°C | Tray | RNF | 0.093 Dia x 0.250 L (2.35mm x 6.35mm) | ±1% | 活跃 | 2 | ±100ppm/°C | 124 kOhms | Metal Film | 0.25W, 1/4W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 240 | 不合格 | - | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | Flame Retardant Coating, Safety | SoC FPGA | - | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057N3F40E2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-WFBGA, CSPBGA | YES | 4-UCSP (1x1) | 1517 | 1.2 GHz | 570000 LE | 21 | SMD/SMT | 71250 LAB | 965073 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | Analog Devices Inc./Maxim Integrated | - | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057N3F40E2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | MAX16073 | 活跃 | 588 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | -40°C ~ 85°C (TA) | Tray | nanoPower | 活跃 | Simple Reset/Power-On Reset | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | Push-Pull, Totem Pole | S-PBGA-B1517 | 588 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 高电平 | MCU, FPGA | 3.08V | 1 | 34ms Minimum | 588 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066N4F40E3LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2512 (6432 Metric) | YES | 2512 | 1517 | Vishay Dale | 5.46 | Tape & Reel (TR) | TNPW2512 | 活跃 | 588 | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS066N4F40E3LG | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0.93 V | -55°C ~ 155°C | Tray | TNPW e3 | 0.248 L x 0.122 W (6.30mm x 3.10mm) | ±0.1% | 活跃 | 2 | ±25ppm/°C | 169 Ohms | Thin Film | 0.5W, 1/2W | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1517 | 588 | 不合格 | - | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 3.5 mm | 现场可编程门阵列 | FPGA - 660K Logic Elements | 660000 | -- | Moisture Resistant | 0.030 (0.75mm) | 40 mm | 40 mm | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032H4F35I3LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 面板安装 | YES | Flange | Composite | Thermoplastic | 1152 | - | TE Connectivity Deutsch 连接器 | INTEL CORP | 活跃 | Intel Corporation | SQUARE | BGA | 10AS032H4F35I3LG | 有 | 100 °C | - | Bulk | Composite | ACT90 | Discontinued at Digi-Key | Copper Alloy | Gold | 384 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 5.45 | 0.93 V | -65°C ~ 200°C | Tray | MIL-DTL-38999 Series III, ACT | 活跃 | Crimp | Receptacle, Male Pins | 6 | Silver | Aerospace, Military | 8542.39.00.01 | Threaded | 现场可编程门阵列 | 23A | CMOS | BOTTOM | N (Normal) | BALL | Shielded | 未说明 | 抗环境干扰 | 1 mm | compliant | Nickel | 17-6 | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | E | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 384 | 3.5 mm | 现场可编程门阵列 | FPGA - 320K Logic Elements | 320000 | -- | - | 35 mm | 35 mm | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048K2F35E2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, MLCC | 1812 (4532 Metric) | YES | 1152 | 2 x 32 kB | 1.2 GHz | 480000 LE | 1 | SMD/SMT | 60000 LAB | 973520 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | Vishay Vitramon | - | 0.87 V | 100 °C | 有 | 10AS048K2F35E2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.47 | 未说明 | 0.9 V | BGA1152,34X34,40 | PLASTIC/EPOXY | 网格排列 | BGA, BGA1152,34X34,40 | Tape & Reel (TR) | 活跃 | 50V | 396 | 有 | This product may require additional documentation to export from the United States. | -55°C ~ 150°C | Tray | GA | 0.177 L x 0.126 W (4.50mm x 3.20mm) | ±2% | 活跃 | C0G, NP0 | 汽车 | 8542.39.00.01 | 0.012 µF | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | - | - | 0.9 V | OTHER | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | - | SoC FPGA | - | 35 mm | 35 mm | 0.086 (2.18mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032H3F35E2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 320000 LE | 1 | SMD/SMT | 40000 LAB | 965060 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | Molex | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032H3F35E2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Bulk | 203152 | 活跃 | 384 | 有 | 0°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032H4F34I3SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | FBGA-1152 | YES | 1152 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 320000 LE | 1 | SMD/SMT | 40000 LAB | 965297 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | Molex | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032H4F34I3SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Bulk | 034985 | 活跃 | 384 | 有 | -40°C ~ 100°C (TJ) | Tray | MX150 34985 | 活跃 | Receptacle | 16 | Black | 2 | 8542.39.00.01 | 插销座 | SOC - Systems on a Chip | 内螺纹插座 | 0.138 (3.50mm) | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | INDUSTRIAL | - | 不包括触点 | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Crimp | 384 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | Sealed | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H4F35E3SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 964945 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | Molex | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS027H4F35E3SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 1.92 | Bulk | 221050 | 活跃 | 384 | 有 | 0°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022E3F27I1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 0603 (1608 Metric) | YES | 0603 | 672 | KOA Speer Electronics, Inc. | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.67 | Tape & Reel (TR) | RN731J | Obsolete | 240 | Non-Compliant | 27 X 27 MM, ROHS COMPLIANT, FBGA-672 | 网格排列 | PLASTIC/EPOXY | BGA672,26X26,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS022E3F27I1SG | BGA | SQUARE | -55°C ~ 155°C | Tray | RN73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.1% | Discontinued at Digi-Key | 2 | ±50ppm/°C | 34 Ohms | Thin Film | 0.063W, 1/16W | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 240 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | FPGA - 220K Logic Elements | 220000 | -- | Moisture Resistant | 0.022 (0.55mm) | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027E3F27E2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1210 (3225 Metric) | YES | 1210 | 672 | 2 x 32 kB | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 964924 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | Vishay Dale | - | BGA, BGA672,26X26,40 | 网格排列 | PLASTIC/EPOXY | BGA672,26X26,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS027E3F27E2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.43 | Tape & Reel (TR) | CRCW1210 | 活跃 | 240 | 有 | This product may require additional documentation to export from the United States. | -55°C ~ 155°C | Tray | CRCW | 0.126 L x 0.098 W (3.20mm x 2.50mm) | ±1% | 活跃 | 2 | ±100ppm/°C | 3.9 Ohms | 厚膜 | 0.5W, 1/2W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 240 | 不合格 | - | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | Automotive AEC-Q200 | SoC FPGA | 0.024 (0.60mm) | 27 mm | 27 mm | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057N2F40E2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | 2 x 32 kB | 1.2 GHz | 570000 LE | 21 | SMD/SMT | 71250 LAB | 965018 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | Souriau-Sunbank by Eaton | - | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057N2F40E2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Bag | MS27473T22B | 活跃 | 588 | 有 | This product may require additional documentation to export from the United States. | 0°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1517 | 588 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H2F34E2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | Radial | YES | 1152 | 2 x 32 kB | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 964783 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | KYOCERA AVX | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS027H2F34E2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.43 | Tape & Reel (TR) | 活跃 | 100V | 384 | 有 | This product may require additional documentation to export from the United States. | -55°C ~ 125°C | Tray | SkyCap® SR | 0.150 L x 0.100 W (3.81mm x 2.54mm) | ±5% | 活跃 | C0G, NP0 | 通用型 | 8542.39.00.01 | 1000 pF | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.100 (2.54mm) | 0.9 V | OTHER | 1.5GHz | 256KB | Straight | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | - | SoC FPGA | 0.150 (3.81mm) | 35 mm | 35 mm | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057N4F40I3LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 面板安装 | 1517-BBGA, FCBGA | YES | Bulkhead - Front Side Nut | Aluminum | 1517-FCBGA (40x40) | 硅橡胶 | 1517 | - | Gold | 588 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 570000 LE | 21 | SMD/SMT | 71250 LAB | 965074 | Intel | TE Connectivity Deutsch 连接器 | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057N4F40I3LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | - | Bulk | Metal | M83723/74 | Discontinued at Digi-Key | - | -55°C ~ 200°C | Tray | Military, MIL-DTL-83723 Series III | 活跃 | Crimp | Receptacle, Male Pins | 43 | - | Aviation, Automotive, Military | 8542.39.00.01 | 卡口锁 | SOC - Systems on a Chip | 7.5A, 13A | CMOS | BOTTOM | 6 | BALL | - | 未说明 | 抗环境干扰 | 1 mm | compliant | 化学镍 | 24-43 | S-PBGA-B1517 | 588 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 588 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | - | SoC FPGA | 40 mm | 40 mm | 50.0µin (1.27µm) | - | |||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048K3F35I2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1206 (3216 Metric) | YES | 1206 | 1152 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 480000 LE | 1 | SMD/SMT | 60000 LAB | 965083 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | KOA Speer Electronics, Inc. | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS048K3F35I2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.47 | Tape & Reel (TR) | RN732B | Obsolete | 396 | 有 | -55°C ~ 155°C | Tray | RN73 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±1% | 活跃 | 2 | ±25ppm/°C | 759 Ohms | Thin Film | 0.125W, 1/8W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | Moisture Resistant | SoC FPGA | 0.028 (0.70mm) | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057K1F35E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 面板安装 | Free Hanging (In-Line) | 有 | Amphenol Custom Cable | 10AS057K1F35E1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.66 | Female | Bag | 50 Ohms | Q-210530 | Bulkhead - Front Side Nut | 活跃 | Male | 11 GHz | - | RG-316 DB | 396 | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | 网格排列 | PLASTIC/EPOXY | 0.9 V | 0.87 V | 100 °C | - | Tray | - | Discontinued at Digi-Key | Copper | 8542.39.00.01 | BOTTOM | BALL | - | 1 mm | N-Type to TNC | compliant | S-PBGA-B1152 | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | 现场可编程门阵列 | N-Type Jack | TNC Plug | FPGA - 570K Logic Elements | -- | Shielded | 36.00 (914.40mm) | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048K2F35I2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | Intel Corporation | Molex | 活跃 | INTEL CORP | 0.93 V | 5.47 | Bulk | 035828 | 活跃 | 396 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS048K2F35I2LG | BGA | SQUARE | -40°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032E1F27I1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | TE Connectivity Deutsch 连接器 | 5.66 | Box | 0134-201 | 活跃 | 240 | Non-Compliant | 27 X 27 MM, ROHS COMPLIANT, FBGA-672 | 网格排列 | PLASTIC/EPOXY | -40 °C | 0.9 V | 0.87 V | 100 °C | 有 | 10AS032E1F27I1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | -40°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.25 mm | 现场可编程门阵列 | FPGA - 320K Logic Elements | -- | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032E2F29I2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-780 | YES | 780 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 320000 LE | 1 | SMD/SMT | 40000 LAB | 964973 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | Molex | - | BGA, BGA780,28X28,40 | 网格排列 | PLASTIC/EPOXY | BGA780,28X28,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032E2F29I2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Bulk | 095551 | 活跃 | 360 | -40°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B780 | 360 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032E3F27E2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-672 | YES | 672 | 1.2 GHz | 320000 LE | 1 | SMD/SMT | 40000 LAB | 964999 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | Abracon LLC | BGA, BGA672,26X26,40 | 网格排列 | PLASTIC/EPOXY | BGA672,26X26,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032E3F27E2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Bulk | Obsolete | 240 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 0°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 240 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm |
10AS032E3F27I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS057N3F40I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS066H3F34E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS048E3F29E2SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS057K2F35E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS066K2F35I1SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS016E4F27I3SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS057N3F40E2SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS066N4F40E3LG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS032H4F35I3LG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS048K2F35E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS032H3F35E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS032H4F34I3SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS027H4F35E3SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS022E3F27I1SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS027E3F27E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS057N2F40E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS027H2F34E2SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS057N4F40I3LG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS048K3F35I2LG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS057K1F35E1SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS048K2F35I2LG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS032E1F27I1SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS032E2F29I2LG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS032E3F27E2SG
ALTERA
分类:Embedded - System On Chip (SoC)
