类别是'category.存储器' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS816136DD-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 150 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 0 to 85 °C | 165 | 18 Mbit | 4 | 175 mA, 190 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | 18 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z32CGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 100 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 表面贴装 | 2.7, 3.6 V | 32 Bit | 256 kWords | 有 | 300 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | 未说明 | 5 ns | 70 °C | 有 | GS881Z32CGD-300 | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.29 | QFP | Commercial grade | 200@Flow-Through/300@Pipelined MHz | FBGA | SDR | 0 to 70 °C | Tray | GS881Z32CGD | e1 | 有 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 165 | R-PQFP-G100 | 不合格 | 2.7 V | COMMERCIAL | 2.3 V | 9 Mbit | 1 | SYNCHRONOUS | 165 mA, 225 mA | 5 ns | Flow-Through/Pipelined | 256 k x 32 | 1.6 mm | 32 | 18 Bit | SRAM | 8 Mbit | 8388608 bit | Commercial | PARALLEL | ZBT SRAM | SRAM | 20 mm | 14 mm | |||||||||
![]() | GS816132DGD-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | 0 C | 18 | 1.7 V | 0 to 85 °C | Tray | GS816132DGD | 同步突发 | Memory & Data Storage | 165 | 18 Mbit | 4 | 225 mA, 245 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 32 | 19 Bit | SRAM | 18 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182S36BGD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SigmaSIO DDR-II | Details | DDR | 有 | 200 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Tray | GS8182S36BGD | SigmaSIO DDR-II | Memory & Data Storage | 18 Mbit | 445 mA | 512 k x 36 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161Z18DD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 2.7, 3.6 V | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 无 | GS8161Z18DD-200I | 1048576 words | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.26 | BGA | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 18 Bit | -40 to 85 °C | Tray | GS8161Z18DD | 3A991.B.2.B | NBT | FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 2.7 V | INDUSTRIAL | 2.3 V | 18 Mbit | SYNCHRONOUS | 215 mA | 6.5@Flow-Through/3@P | 1 M x 18 | 1.4 mm | 18 | SRAM | 18 | Industrial | PARALLEL | ZBT SRAM | SRAM | 15 mm | 13 mm | ||||||||||||||||||||
![]() | GS8342DT10BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342DT10BGD | SigmaQuad-II+ B4 | Memory & Data Storage | 165 | 36 Mbit | 2 | 540 mA | Pipelined | 4 M x 9 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T10BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Industrial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8342T10BD | SigmaDDR-II+ B2 | Memory & Data Storage | 165 | 36 Mbit | 1 | 460 mA | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672Q18BE-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | QDR-II | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 0.45 ns | 70 °C | 无 | GS8672Q18BE-200 | BGA | 5.49 | GSI TECHNOLOGY | Obsolete | RECTANGULAR | LBGA | 1.8 V | 4194304 words | 200 MHz | 有 | 200 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | N | Tray | GS8672Q18BE | 3A991.B.2.B | SigmaQuad-II | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | 72 Mbit | SYNCHRONOUS | 850 mA | 4 M x 18 | 3-STATE | 1.5 mm | 18 | SRAM | 72 | PARALLEL | SEPARATE | 标准SRAM | 1.7 V | SRAM | 17 mm | 15 mm | |||||||||||||||||||||||||||
![]() | GS816132DGD-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 100 C | 2.7 V | - 40 C | 18 | 1.7 V | -40 to 100 °C | Tray | GS816132DGD | 同步突发 | Memory & Data Storage | 165 | 18 Mbit | 4 | 195 mA, 210 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 32 | 19 Bit | SRAM | 18 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T19BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Industrial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8342T19BD | SigmaDDR-II+ B2 | Memory & Data Storage | 165 | 36 Mbit | 1 | 460 mA | Pipelined | 2 M x 18 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161Z36DGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5.5 ns | 85 °C | 有 | GS8161Z36DGD-250I | 524288 words | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.26 | BGA | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | Tray | GS8161Z36DGD | 3A991.B.2.B | NBT | FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 2.7 V | INDUSTRIAL | 2.3 V | 18 Mbit | SYNCHRONOUS | 250 mA, 270 mA | 5.5 ns | 512 k x 36 | 1.4 mm | 36 | SRAM | 18874368 bit | PARALLEL | ZBT SRAM | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||||||
![]() | GS8342TT07BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8342TT07BGD-333 | 333 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | Commercial grade | 333 MHz | FBGA | 0 to 85 °C | Tray | GS8342TT07BGD | 3A991.B.2.B | SigmaDDR-II+ B2 | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | 36 Mbit | 1 | SYNCHRONOUS | 515 mA | Pipelined | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 21 Bit | SRAM | 36 Mbit | 33554432 bit | Commercial | PARALLEL | COMMON | DDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||
![]() | GS8672D19BGE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SigmaQuad-II+ | Details | QDR-II | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Tray | GS8672D19BGE | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 1.49 A | 4 M x 18 | SRAM | 72 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672Q18BGE-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SigmaQuad-II | Details | QDR-II | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Tray | GS8672Q18BGE | SigmaQuad-II | Memory & Data Storage | 72 Mbit | 1.1 A | 4 M x 18 | SRAM | 72 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816136DD-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 200@Flow-Through/333@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS816136DD | 同步突发 | Memory & Data Storage | 165 | 18 Mbit | 4 | 260 mA, 330 mA | 5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | SRAM | 18 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8160Z36DGT-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | LQFP, | FLATPACK, LOW PROFILE | 512000 | PLASTIC/EPOXY | 未说明 | 5.5 ns | 70 °C | 有 | GS8160Z36DGT-250V | 524288 words | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.49 | QFP | 有 | 250 MHz | + 85 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Tray | GS8160Z36DGT | 3A991.B.2.B | NBT | ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 2 V | COMMERCIAL | 1.7 V | 18 Mbit | SYNCHRONOUS | 225 mA, 245 mA | 5.5 ns | 512 k x 36 | 1.6 mm | 36 | SRAM | 18 | PARALLEL | ZBT SRAM | SRAM | 20 mm | 14 mm | ||||||||||||||||||||||||||||||
![]() | GS816218DD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 1 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 无 | GS816218DD-200IV | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.25 | BGA | Industrial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | -40 to 100 °C | Tray | GS816218DD | 3A991.B.2.B | Pipeline/Flow Through | ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 2 V | INDUSTRIAL | 1.7 V | 18 Mbit | 2 | SYNCHRONOUS | 210 mA, 215 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.4 mm | 18 | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | 缓存SRAM | SRAM | 15 mm | 13 mm | ||||||||||||||||
![]() | GS8182S09BD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Tray | GS8182S09BD | SigmaSIO DDR-II | Memory & Data Storage | 18 Mbit | 430 mA | 2 M x 9 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672D19BGE-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SigmaQuad-II+ | Details | QDR-II | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Tray | GS8672D19BGE | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 1.12 A | 4 M x 18 | SRAM | 72 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS84036CB-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | YES | 119 | GS84036CB-250 | 131072 words | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.73 | 250 MHz | Parallel | 2.3 V | 0 C | + 70 C | SMD/SMT | SDR | 有 | 84 | SyncBurst | 3.6 V | BGA, | 网格排列 | 128000 | PLASTIC/EPOXY | 未说明 | 70 °C | 无 | Tray | GS84036CB | 3A991.B.2.B | Pipeline/Flow Through | IT ALSO OPERATES AT 3 TO 3.6 V SUPPLY VOLTAGE | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 2.7 V | COMMERCIAL | 2.3 V | 4 Mbit | SYNCHRONOUS | 155 mA, 195 mA | 6.5 ns | 128 k x 36 | 1.99 mm | 36 | 4718592 bit | PARALLEL | 缓存SRAM | 22 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | GS84032CB-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 0 C | + 70 C | SMD/SMT | SDR | 有 | 84 | SyncBurst | 3.6 V | 250 MHz | Parallel | 2.3 V | Tray | GS84032CB | Pipeline/Flow Through | 4 Mbit | 155 mA, 195 mA | 6.5 ns | 128 k x 32 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672D37BGE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SigmaQuad-II+ | Details | QDR-II | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Tray | GS8672D37BGE | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 2.05 A | 2 M x 36 | SRAM | 72 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672Q37BE-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SigmaQuad-II+ | N | QDR-II | 有 | 375 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Tray | GS8672Q37BE | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 1.76 A | 2 M x 36 | SRAM | 72 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q07BGD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 200 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 200 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342Q07BGD | SigmaQuad-II+ B2 | Memory & Data Storage | 165 | 36 Mbit | 2 | 565 mA | Pipelined | 4 M x 8 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672D38BE-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | 500 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | GS8672D38BE | 72 Mbit | 2.25 A | 2 M x 36 | 72 |
GS816136DD-150V
GSI Technology
分类:Memory
GS881Z32CGD-300
GSI Technology
分类:Memory
GS816132DGD-250V
GSI Technology
分类:Memory
GS8182S36BGD-200I
GSI Technology
分类:Memory
GS8161Z18DD-200I
GSI Technology
分类:Memory
GS8342DT10BGD-300I
GSI Technology
分类:Memory
GS8342T10BD-300I
GSI Technology
分类:Memory
GS8672Q18BE-200
GSI Technology
分类:Memory
GS816132DGD-150IV
GSI Technology
分类:Memory
GS8342T19BD-300I
GSI Technology
分类:Memory
GS8161Z36DGD-250I
GSI Technology
分类:Memory
GS8342TT07BGD-333
GSI Technology
分类:Memory
GS8672D19BGE-450
GSI Technology
分类:Memory
GS8672Q18BGE-300
GSI Technology
分类:Memory
GS816136DD-333IV
GSI Technology
分类:Memory
GS8160Z36DGT-250V
GSI Technology
分类:Memory
GS816218DD-200IV
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