category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.PLDs（可编程逻辑器件）' (2797)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量																			JESD-609代码	无铅代码	ECCN 代码	端子表面处理	附加功能	HTS代码	包装方式	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	温度等级	传播延迟	建筑学	输入数量	组织结构	座位高度-最大	可编程逻辑类型	筛选水平	输出功能	宏细胞数	JTAG BST	专用输入数量	系统内可编程	产品条款数量	长度	宽度
PAL10H20P8JS	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24	RECTANGULAR	IN-LINE	无	Obsolete	ADVANCED MICRO DEVICES INC	DIP, DIP24,.3	70 °C	CERAMIC	DIP	DIP24,.3	e0			Tin/Lead (Sn/Pb)		8542.39.00.01		DUAL	THROUGH-HOLE		2.54 mm	unknown			R-XDIP-T24	8	不合格	COMMERCIAL	6 ns	PAL-TYPE	20			OT PLD		COMBINATORIAL					32
PZ5064I10BB	AMD Xilinx	数据表	347 In Stock	-	最小起订量: 1 最小包装量: 1	YES	100	无	Obsolete	XILINX INC	QFP	14 X 20 X 2.80 MM, PLASTIC, SOT-382-1, QFP-100	67 MHz	3	64	85 °C	-40 °C	PLASTIC/EPOXY	QFP	QFP100,.7X.9	RECTANGULAR	FLATPACK	5.5 V	4.5 V	5 V	e0			锡铅	NO	8542.39.00.01		QUAD	鸥翼	225	0.65 mm	not_compliant	30	100	R-PQFP-G100		不合格	INDUSTRIAL	15 ns			2 DEDICATED INPUTS, 64 I/O	3.4 mm	EE PLD		MACROCELL	64	NO	2	NO		19.6 mm	14 mm
PZ5064I10BB	Philips Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	5 V	FLATPACK	RECTANGULAR	QFP100,.7X.9	QFP	PLASTIC/EPOXY	无	Transferred	飞利浦半导体	QFP, QFP100,.7X.9	85 °C	-40 °C	e0			Tin/Lead (Sn/Pb)	NO	8542.39.00.01		QUAD	鸥翼		0.635 mm	unknown			R-PQFP-G100		不合格	INDUSTRIAL	12.5 ns					EE PLD			64	NO		NO
XCR3128-12PQ160C	AMD Xilinx	数据表	900 In Stock	-	最小起订量: 1 最小包装量: 1	YES	160	Obsolete	XILINX INC	QFP	PLASTIC, QFP-160	66 MHz	3	96	70 °C	PLASTIC/EPOXY	QFP	QFP160,1.2SQ	SQUARE	FLATPACK	3.63 V	2.97 V	3.3 V	无	e0			锡铅	YES	8542.39.00.01		QUAD	鸥翼	225	0.65 mm	not_compliant	30	160	S-PQFP-G160		不合格	COMMERCIAL	12 ns			2 DEDICATED INPUTS, 96 I/O	4.1 mm	EE PLD		MACROCELL	128	YES	2	YES		28 mm	28 mm
XC9536F-10PCG44C	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	Obsolete	5 V	4.75 V	5.25 V	CHIP CARRIER	SQUARE	LDCC44,.7SQ	QCCJ	PLASTIC/EPOXY	70 °C	34	3	67 MHz	QCCJ,	LCC	XILINX INC	有	e3			Matte Tin (Sn)		8542.39.00.01		QUAD	J BEND	245	1.27 mm	compliant	30	44	S-PQCC-J44		不合格	COMMERCIAL	10 ns			0 DEDICATED INPUTS, 34 I/O	4.572 mm	闪存 PLD		MACROCELL						16.5862 mm	16.5862 mm
XC9572F-10PQG100I	AMD Xilinx	数据表	74 In Stock	-	最小起订量: 1 最小包装量: 1	YES	100	Obsolete	XILINX INC	QFP	QFP,	67 MHz	3	72	85 °C	-40 °C	PLASTIC/EPOXY	QFP	RECTANGULAR	FLATPACK	5.5 V	4.5 V	5 V	有	e3			哑光锡		8542.39.00.01		QUAD	鸥翼		0.65 mm	compliant		100	R-PQFP-G100		不合格	INDUSTRIAL	10 ns			0 DEDICATED INPUTS, 72 I/O	3.4 mm	闪存 PLD		MACROCELL						20 mm	14 mm
EPM7128AETC144-4	Altera Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	144	250 MHz	100	70 °C	PLASTIC/EPOXY	LFQFP	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	3.6 V	3 V	3.3 V	Obsolete	ALTERA CORP	QFP	LFQFP,	e3			哑光锡		8542.39.00.01		QUAD	鸥翼		0.5 mm	unknown		144	S-PQFP-G144		不合格	COMMERCIAL	4.5 ns			0 DEDICATED INPUTS, 100 I/O	1.6 mm	EE PLD		MACROCELL						20 mm	20 mm
PZ3128-S15BB2-T	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	160	96	70 °C	PLASTIC/EPOXY	QFP	QFP160,1.2SQ	SQUARE	FLATPACK	3.6 V	3 V	3.3 V	Transferred	NXP SEMICONDUCTORS	QFP,	59 MHz						8542.39.00.01		QUAD	鸥翼		0.65 mm	unknown			S-PQFP-G160		不合格	COMMERCIAL	17.5 ns			2 DEDICATED INPUTS, 96 I/O	4.07 mm	EE PLD		MACROCELL			2			28 mm	28 mm
XCR5064C-12PC44I	AMD Xilinx	数据表	570 In Stock	-	最小起订量: 1 最小包装量: 1	YES	44	无	Obsolete	XILINX INC	LCC	QCCJ, LDCC44,.7SQ	67 MHz	3	32	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	5.5 V	4.5 V	5 V	e0			锡铅	YES	8542.39.00.01		QUAD	J BEND	225	1.27 mm	not_compliant	30	44	S-PQCC-J44		不合格	INDUSTRIAL	12 ns			2 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD		MACROCELL	64	YES	2	YES		16.5862 mm	16.5862 mm
XCR3320-10BG256C	AMD Xilinx	数据表	557 In Stock	-	最小起订量: 1 最小包装量: 1	YES	256	Obsolete	XILINX INC	BGA	PLASTIC, BGA-256	87 MHz	3	3	70 °C	PLASTIC/EPOXY	BGA	BGA256,20X20,50	SQUARE	网格排列	3.6 V	3 V	3.3 V	无	e0			锡铅	YES	8542.39.00.01		BOTTOM	BALL	225	1.27 mm	not_compliant	30	256	S-PBGA-B256		不合格	COMMERCIAL	10 ns			12 DEDICATED INPUTS, 3 I/O	2.55 mm	可加载 PLD		MACROCELL	320	YES	12	YES		27 mm	27 mm
PZ5128CS10BE-T	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	128	96	70 °C	PLASTIC/EPOXY	LFQFP	QFP128,.63X.87,20	RECTANGULAR	FLATPACK, LOW PROFILE, FINE PITCH	5.25 V	4.75 V	5 V	Transferred	NXP SEMICONDUCTORS	LFQFP,	71 MHz					128 MACROCELLS	8542.39.00.01		QUAD	鸥翼		0.5 mm	unknown			R-PQFP-G128		不合格	COMMERCIAL	12 ns			2 DEDICATED INPUTS, 96 I/O	1.6 mm	EE PLD		MACROCELL			2			20 mm	14 mm
XC7236-25PC44I	AMD Xilinx	数据表	134 In Stock	-	最小起订量: 1 最小包装量: 1	YES	44	无	Obsolete	XILINX INC	LCC	PLASTIC, LCC-44	33 MHz	3	30	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	5.5 V	4.5 V	5 V	e0			锡铅	36 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V; 3 EXTERNAL CLOCKS	8542.39.00.01		QUAD	J BEND	225	1.27 mm	not_compliant	30	44	S-PQCC-J44		不合格	INDUSTRIAL	40 ns			2 DEDICATED INPUTS, 30 I/O	4.57 mm	OT PLD		MACROCELL	36	NO	2	NO		16.5862 mm	16.5862 mm
EPM9560RC240-25	Altera Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	240	66.7 MHz	191	70 °C	PLASTIC/EPOXY	HFQFP	SQUARE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	5.25 V	4.75 V	5 V	Obsolete	ALTERA CORP	QFP	HFQFP,	e3			哑光锡	560 MACROCELLS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION - 3.3V OR 5V	8542.39.00.01		QUAD	鸥翼		0.5 mm	unknown		240	S-PQFP-G240		不合格	COMMERCIAL	25 ns			0 DEDICATED INPUTS, 191 I/O	4.1 mm	EE PLD		MACROCELL						32 mm	32 mm
PAL16R8DMJ/883B	Rochester Electronics LLC	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	20	4.5 V	5 V	DIP	CERAMIC, GLASS-SEALED	-55 °C	125 °C	37 MHz	DIP,	ROCHESTER ELECTRONICS LLC	活跃	DIP20,.3	RECTANGULAR	IN-LINE	5.5 V			3A001.A.2.C			8542.39.00.01		DUAL	THROUGH-HOLE	未说明		unknown	未说明		R-GDIP-T20			MILITARY	12 ns			8 DEDICATED INPUTS, 0 I/O		OT PLD		REGISTERED			8
PAL16R8DMJ/883B	AMD	数据表	506 In Stock	-	最小起订量: 1 最小包装量: 1	NO	20	ADVANCED MICRO DEVICES INC	DIP	DIP, DIP20,.3	37 MHz	125 °C	-55 °C	CERAMIC, GLASS-SEALED	DIP	DIP20,.3	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	无	Obsolete	e0		3A001.A.2.C	锡铅		8542.39.00.01		DUAL	THROUGH-HOLE		2.54 mm	unknown		20	R-GDIP-T20	8	不合格	MILITARY	12 ns	PAL-TYPE	8	8 DEDICATED INPUTS, 0 I/O		OT PLD	38535Q/M;38534H;883B	REGISTERED			8		64
XH95180-10HQG208I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	208	HFQFP	SQUARE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	5 V	有	Obsolete	ADVANCED MICRO DEVICES INC	HEAT SINK, QFP-208	3	168	PLASTIC/EPOXY	e3			哑光锡				QUAD	鸥翼	245	0.5 mm	compliant	30		S-PQFP-G208		不合格					0 DEDICATED INPUTS, 168 I/O	4.1 mm	MASK PLD		MACROCELL						28 mm	28 mm
P3Z22V10-DDH	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	24	PLASTIC/EPOXY	TSSOP	TSSOP24,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	3.3 V	无	Obsolete	XILINX INC	TSSOP, TSSOP24,.25	80 MHz	70 °C	e0			Tin/Lead (Sn/Pb)		8542.39.00.01		DUAL	鸥翼		0.635 mm	unknown			R-PDSO-G24	10	不合格	COMMERCIAL	10 ns	PAL-TYPE	22			EE PLD		MACROCELL					132
P3Z22V10-DDH	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	24	4.40 MM, PLASTIC, SOT-355-1, TSSOP-24	83 MHz	10	70 °C	PLASTIC/EPOXY	TSSOP	TSSOP24,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	3.6 V	3 V	3.3 V	Obsolete	NXP SEMICONDUCTORS	TSSOP						8542.39.00.01		DUAL	鸥翼		0.65 mm	unknown		24	R-PDSO-G24		不合格	COMMERCIAL	10 ns			11 DEDICATED INPUTS, 10 I/O	1.1 mm	EE PLD		MACROCELL			11			7.8 mm	4.4 mm
PZ3064DS10BP	Philips Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	SQUARE	FLATPACK	无	Transferred	飞利浦半导体	85 °C	-40 °C	PLASTIC/EPOXY	QFP	TQFP100,.63SQ	e0			Tin/Lead (Sn/Pb)	YES	8542.39.00.01		QUAD	鸥翼		0.5 mm	unknown			S-PQFP-G100		不合格	INDUSTRIAL	11.5 ns					EE PLD			64	YES		YES
PZ3064DS10BP	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	-40 °C	PLASTIC/EPOXY	QFP	TQFP100,.63SQ	SQUARE	FLATPACK	无	Obsolete	XILINX INC	QFP, TQFP100,.63SQ	3	85 °C					YES	8542.39.00.01		QUAD	鸥翼	240	0.5 mm	unknown	30		S-PQFP-G100		不合格	INDUSTRIAL	11.5 ns					EE PLD			64	YES		YES
PZ5032-10BC-S	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	Obsolete	XILINX INC	QFP	10 X 10 MM, 1 MM HEIGHT, PLASTIC, TQFP-44	59 MHz	3	32	70 °C	PLASTIC/EPOXY	TQFP	TQFP44,.47SQ,32	SQUARE	FLATPACK, THIN PROFILE	5.25 V	4.75 V	5 V	无					32 MACROCELLS	8542.39.00.01	TRAY	QUAD	鸥翼	240	0.8 mm	unknown	30	44	S-PQFP-G44		不合格	COMMERCIAL	12.5 ns			2 DEDICATED INPUTS, 32 I/O	1.2 mm	EE PLD		MACROCELL	32	NO	2	NO		10 mm	10 mm
PZ5032-10BC-S	Philips Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	QFP, TQFP44,.47SQ,32	飞利浦半导体	Transferred	无	5 V	FLATPACK	SQUARE	TQFP44,.47SQ,32	QFP	PLASTIC/EPOXY	70 °C	e0			Tin/Lead (Sn/Pb)	NO	8542.39.00.01	TRAY	QUAD	鸥翼		0.8 mm	unknown			S-PQFP-G44		不合格	COMMERCIAL	12.5 ns					EE PLD			32	NO		NO
XC7336-15WC44M	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	LCC	WQCCJ,	41.67 MHz	32	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	WQCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER, WINDOW	5.5 V	4.5 V	5 V	Obsolete	XILINX INC			3A001.A.2.C		CONFIGURABLE 3.3V OR 5V I/O OPERATION; 18 OUTPUT MACROCELLS	8542.39.00.01		QUAD	J BEND		1.27 mm	unknown		44	S-CQCC-J44		不合格	MILITARY	23 ns			0 DEDICATED INPUTS, 32 I/O	4.826 mm	UV PLD		MACROCELL						16.51 mm	16.51 mm
PZ3032CS10A44-T	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	57 MHz	32	70 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	3.63 V	2.97 V	3.3 V	Obsolete	XILINX INC	LPCC	QCCJ,					32 MACROCELLS	8542.39.00.01		QUAD	J BEND		1.27 mm	unknown		44	S-PQCC-J44		不合格	COMMERCIAL	13 ns			2 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD		MACROCELL			2			16.5862 mm	16.5862 mm
PAL16R6AMJ/883B	Rochester Electronics LLC	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	20	接触制造商	ROCHESTER ELECTRONICS LLC	DIP	CERAMIC, DIP-20	20 MHz	2	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	DIP20,.3	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	无		无	3A001.A.2.C		PAL; REGISTER PRELOAD; POWER-UP RESET	8542.39.00.01		DUAL	THROUGH-HOLE	未说明	2.54 mm	unknown	未说明	20	R-CDIP-T20		不合格	MILITARY	30 ns			8 DEDICATED INPUTS, 2 I/O	5.08 mm	OT PLD		MIXED			8			24.257 mm	7.62 mm