category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.PLDs（可编程逻辑器件）' (2797)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量																			JESD-609代码	无铅代码	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	温度等级	传播延迟	建筑学	输入数量	组织结构	座位高度-最大	可编程逻辑类型	筛选水平	输出功能	宏细胞数	JTAG BST	专用输入数量	系统内可编程	产品条款数量	长度	宽度
XC95108F-20PCG84C	AMD Xilinx	数据表	318 In Stock	-	最小起订量: 1 最小包装量: 1	YES	84	XILINX INC	LCC	QCCJ,	50 MHz	3	69	70 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	5 V	4.75 V	5.25 V	有	Obsolete	e3			哑光锡		8542.39.00.01	QUAD	J BEND	245	1.27 mm	compliant	30	84	S-PQCC-J84		不合格	COMMERCIAL	20 ns			0 DEDICATED INPUTS, 69 I/O	5.08 mm	闪存 PLD		MACROCELL						29.3116 mm	29.3116 mm
PZ3064I15A44-T	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	32	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	3.63 V	2.97 V	3.3 V	Transferred	NXP SEMICONDUCTORS	QCCJ,	58 MHz						8542.39.00.01	QUAD	J BEND		1.27 mm	unknown			S-PQCC-J44		不合格	INDUSTRIAL	17.5 ns			2 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD		MACROCELL			2			16.5862 mm	16.5862 mm
XC7336-12WC44M	AMD Xilinx	数据表	98 In Stock	-	最小起订量: 1 最小包装量: 1	YES	44	LCC	WQCCJ,	47.62 MHz	32	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	WQCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER, WINDOW	5.5 V	4.5 V	5 V	Obsolete	XILINX INC			3A001.A.2.C		CONFIGURABLE 3.3V OR 5V I/O OPERATION; 18 OUTPUT MACROCELLS	8542.39.00.01	QUAD	J BEND		1.27 mm	unknown		44	S-CQCC-J44		不合格	MILITARY	19 ns			0 DEDICATED INPUTS, 32 I/O	4.826 mm	UV PLD		MACROCELL						16.51 mm	16.51 mm
XC95108F-15PQG100C	AMD Xilinx	数据表	474 In Stock	-	最小起订量: 1 最小包装量: 1	YES	100	XILINX INC	QFP	QFP,	56 MHz	3	81	70 °C	PLASTIC/EPOXY	QFP	RECTANGULAR	FLATPACK	5 V	4.75 V	5.25 V	有	Obsolete	e3			Matte Tin (Sn)		8542.39.00.01	QUAD	鸥翼	250	0.65 mm	compliant	40	100	R-PQFP-G100		不合格	COMMERCIAL	15 ns			0 DEDICATED INPUTS, 81 I/O	3.4 mm	闪存 PLD		MACROCELL						20 mm	14 mm
XC7372-12PQ100I	AMD Xilinx	数据表	224 In Stock	-	最小起订量: 1 最小包装量: 1	YES	100	无	Obsolete	XILINX INC	QFP	PLASTIC, QFP-100	62.5 MHz	3	42	85 °C	-40 °C	PLASTIC/EPOXY	QFP	QFP100,.7X.9	RECTANGULAR	FLATPACK	5.5 V	4.5 V	5 V	e0			锡铅	72 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 126 FLIP-FLOPS	8542.39.00.01	QUAD	鸥翼	225	0.65 mm	not_compliant	30	100	R-PQFP-G100		不合格	INDUSTRIAL	28 ns			12 DEDICATED INPUTS, 42 I/O	3.4 mm	OT PLD		MACROCELL	72	NO	12	NO		20 mm	14 mm
XC2C128-7CPGG132C	AMD	数据表	361 In Stock	-	最小起订量: 1 最小包装量: 1	YES	132	8 X 8 MM, 0.50 MM PITCH, CSP-132	119 MHz	100	70 °C	PLASTIC/EPOXY	TFBGA	BGA132,14X14,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	1.9 V	1.7 V	1.8 V	有	活跃	ADVANCED MICRO DEVICES INC	e3			哑光锡			BOTTOM	BALL		0.5 mm	compliant			S-PBGA-B132	100	不合格	COMMERCIAL	7.5 ns	PLA-TYPE	100	0 DEDICATED INPUTS, 100 I/O	1.1 mm	闪存 PLD		MACROCELL	128					8 mm	8 mm
XC2C128-7CPGG132C	AMD Xilinx	数据表	361 In Stock	-	最小起订量: 1 最小包装量: 1	YES	132	XILINX INC	BGA	8 X 8 MM, 0.50 MM PITCH, CSP-132	119 MHz	100	70 °C	PLASTIC/EPOXY	TFBGA	BGA132,14X14,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	1.9 V	1.7 V	1.8 V	有	Transferred	e3	无		哑光锡		8542.39.00.01	BOTTOM	BALL		0.5 mm	compliant		132	S-PBGA-B132	100	不合格	COMMERCIAL	7.5 ns	PLA-TYPE	100	0 DEDICATED INPUTS, 100 I/O	1.1 mm	闪存 PLD		MACROCELL	128					8 mm	8 mm
XCR3384XL-7.5CS280C	AMD	数据表	727 In Stock	-	最小起订量: 1 最小包装量: 1	YES	280	SQUARE	BGA280,19X19,32	TFBGA	PLASTIC/EPOXY	70 °C	216	3	CHIP SCALE, BGA-280	ADVANCED MICRO DEVICES INC	活跃	无	GRID ARRAY, THIN PROFILE, FINE PITCH	3.6 V	3 V	3.3 V	e0			锡铅			BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B280		不合格	COMMERCIAL	7.5 ns			216 I/O	1.2 mm	EE PLD		MACROCELL						16 mm	16 mm
PZ5064C10BC	Philips Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	FLATPACK	5 V	无	Transferred	飞利浦半导体	70 °C	PLASTIC/EPOXY	QFP	TQFP44,.47SQ,32	SQUARE	e0			Tin/Lead (Sn/Pb)	YES	8542.39.00.01	QUAD	鸥翼		0.8 mm	unknown			S-PQFP-G44		不合格	COMMERCIAL	12.5 ns					EE PLD			64	YES		YES
XC7236A-25WC44I	AMD Xilinx	数据表	597 In Stock	-	最小起订量: 1 最小包装量: 1	YES	44	无	Obsolete	XILINX INC	QFJ	WQCCJ, LDCC44,.7SQ	33 MHz	1	30	85 °C	-40 °C	CERAMIC, METAL-SEALED COFIRED	WQCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER, WINDOW	5.5 V	4.5 V	5 V					PAL BLOCKS INTERCONNECTED BY PIA; 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V	8542.39.00.01	QUAD	J BEND		1.27 mm	unknown		44	S-CQCC-J44		不合格	INDUSTRIAL	40 ns			2 DEDICATED INPUTS, 30 I/O	4.826 mm	UV PLD		MACROCELL	36	NO	2	NO		16.51 mm	16.51 mm
PZ5064-10A44	Philips Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	LDCC44,.7SQ	SQUARE	CHIP CARRIER	5 V	无	Transferred	飞利浦半导体	QCCJ, LDCC44,.7SQ	70 °C	PLASTIC/EPOXY	QCCJ	e0			Tin/Lead (Sn/Pb)	NO	8542.39.00.01	QUAD	J BEND		1.27 mm	unknown			S-PQCC-J44		不合格	COMMERCIAL	12.5 ns					EE PLD			64	NO		NO
PZ5064-10A44	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	77 MHz	32	70 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	5.25 V	4.75 V	5 V	Obsolete	NXP SEMICONDUCTORS	LCC	PLASTIC, SOT-187-2, LCC-44						8542.39.00.01	QUAD	J BEND		1.27 mm	unknown		44	S-PQCC-J44		不合格	COMMERCIAL	12.5 ns			2 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD		MACROCELL			2			16.5862 mm	16.5862 mm
PZ5064-10A44	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	LDCC44,.7SQ	SQUARE	CHIP CARRIER	5 V	无	Obsolete	XILINX INC	3	70 °C	PLASTIC/EPOXY	QCCJ	e0			锡铅	NO	8542.39.00.01	QUAD	J BEND	225	1.27 mm	not_compliant	30		S-PQCC-J44		不合格	COMMERCIAL	12.5 ns					EE PLD			64	NO		NO
EPM5064LC44-1	Cypress Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	50 MHz	28	70 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	5.25 V	4.75 V	5 V	Obsolete	CYPRESS SEMICONDUCTOR CORP	LCC	QCCJ,					64 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS	8542.39.00.01	QUAD	J BEND		1.27 mm	unknown		44	S-PQCC-J44		不合格	COMMERCIAL	40 ns			7 DEDICATED INPUTS, 28 I/O	4.57 mm	OT PLD		MACROCELL			7			16.5862 mm	16.5862 mm
EPM5064LC44-1	Altera Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	ALTERA CORP	LCC	QCCJ, LDCC44,.7SQ	50 MHz	28	70 °C	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	5.25 V	4.75 V	5 V	无	Transferred	e0			锡铅	64 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS	8542.39.00.01	QUAD	J BEND	220	1.27 mm	unknown		44	S-PQCC-J44		不合格	COMMERCIAL	40 ns			7 DEDICATED INPUTS, 28 I/O	4.57 mm	OT PLD		MACROCELL	64	NO	7	NO		16.5862 mm	16.5862 mm
PAL16R8BJC	Texas Instruments	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	20	DIP	DIP, DIP20,.3	40 MHz	75 °C	CERAMIC, GLASS-SEALED	DIP	DIP20,.3	RECTANGULAR	IN-LINE	5.25 V	4.75 V	5 V	无	Obsolete	NATIONAL SEMICONDUCTOR CORP	e0	无		锡铅		8542.39.00.01	DUAL	THROUGH-HOLE		2.54 mm	unknown		20	R-GDIP-T20	8	不合格	商业扩展	15 ns	PAL-TYPE	8	8 DEDICATED INPUTS, 0 I/O	5.08 mm	OT PLD		REGISTERED			8		64	24.51 mm	7.62 mm
PZ3064I15A44	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	PLASTIC, SOT-187-2, LCC-44	58 MHz	32	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	3.63 V	2.97 V	3.3 V	Obsolete	NXP SEMICONDUCTORS	LCC						8542.39.00.01	QUAD	J BEND		1.27 mm	unknown		44	S-PQCC-J44		不合格	INDUSTRIAL	17.5 ns			2 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD		MACROCELL			2			16.5862 mm	16.5862 mm
PZ3128-S15A84	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	84	59 MHz	64	70 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	3.6 V	3 V	3.3 V	Obsolete	NXP SEMICONDUCTORS	LCC	PEDESTAL, PLASTIC, SOT-189-3, LCC-84						8542.39.00.01	QUAD	J BEND		1.27 mm	unknown		84	S-PQCC-J84		不合格	COMMERCIAL	17.5 ns			2 DEDICATED INPUTS, 64 I/O	4.57 mm	EE PLD		MACROCELL			2			29.3116 mm	29.3116 mm
PZ3128-S15A84	Philips Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	84	LDCC84,1.2SQ	SQUARE	CHIP CARRIER	3.3 V	无	Transferred	飞利浦半导体	QCCJ, LDCC84,1.2SQ	70 °C	PLASTIC/EPOXY	QCCJ	e0			Tin/Lead (Sn/Pb)	YES	8542.39.00.01	QUAD	J BEND		1.27 mm	unknown			S-PQCC-J84		不合格	COMMERCIAL	17.5 ns					EE PLD			128	YES		YES
PALC22V10D-25DMB	Teledyne e2v	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24	10	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	活跃	TELEDYNE E2V (UK) LTD	CERAMIC, DIP-24	30.3 MHz			3A001.A.2.C		IT ALSO AVAILABLE IN GDIP-24 PACKAGE	8542.39.00.01	DUAL	THROUGH-HOLE			compliant			R-CDIP-T24			MILITARY	25 ns			11 DEDICATED INPUTS, 10 I/O		EE PLD		MACROCELL			11
PALC22V10D-25DMB	Cypress Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24	Obsolete	CYPRESS SEMICONDUCTOR CORP	DIP	0.300 INCH, CERDIP-24	30.3 MHz	10	125 °C	-55 °C	CERAMIC, GLASS-SEALED	DIP	DIP24,.3	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	无	e0		3A001.A.2.C	锡铅	10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS	8542.39.00.01	DUAL	THROUGH-HOLE		2.54 mm	not_compliant		24	R-GDIP-T24	10	不合格	MILITARY	25 ns	PAL-TYPE	22	11 DEDICATED INPUTS, 10 I/O		闪存 PLD	38535Q/M;38534H;883B	MACROCELL			11		132
PZ3128IS15A84	Philips Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	84	LDCC84,1.2SQ	SQUARE	CHIP CARRIER	3.3 V	无	Transferred	飞利浦半导体	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	e0			Tin/Lead (Sn/Pb)	YES	8542.39.00.01	QUAD	J BEND		1.27 mm	unknown			S-PQCC-J84		不合格	INDUSTRIAL	17.5 ns					EE PLD			128	YES		YES
PLS153AA-T	YAGEO Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	20	4.75 V	5 V	Obsolete	飞利浦组件	10	75 °C	PLASTIC/EPOXY	SQUARE	CHIP CARRIER	5.25 V						8542.39.00.01	QUAD	J BEND			unknown			S-PQCC-J20		不合格	商业扩展	30 ns			8 DEDICATED INPUTS, 10 I/O		OT PLD		COMBINATORIAL			8
XH95180-10PQG160C	AMD Xilinx	数据表	876 In Stock	-	最小起订量: 1 最小包装量: 1	YES	160	3	133	PLASTIC/EPOXY	QFP	QFP160,1.2SQ	SQUARE	FLATPACK	5 V	有	Transferred	XILINX INC	QFP	PLASTIC, QFP-160	e3	有		哑光锡		8542.39.00.01	QUAD	鸥翼		0.65 mm	compliant		160	S-PQFP-G160		不合格					0 DEDICATED INPUTS, 133 I/O	3.94 mm	MASK PLD		MACROCELL						28 mm	28 mm
PZ5064-10BC	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	SQUARE	TQFP	PLASTIC/EPOXY	70 °C	32	77 MHz	10 X 10 X 1 MM, PLASTIC, SOT-376-1, TQFP-44	QFP	NXP SEMICONDUCTORS	Obsolete	5.25 V	4.75 V	5 V	FLATPACK, THIN PROFILE						8542.39.00.01	QUAD	鸥翼		0.8 mm	unknown		44	S-PQFP-G44		不合格	COMMERCIAL	12.5 ns			2 DEDICATED INPUTS, 32 I/O	1.2 mm	EE PLD		MACROCELL			2			10 mm	10 mm