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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 内存大小 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 定时器/计数器的数量 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 核心架构 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 可编程I/O数 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 输出启用 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 产品类别 | 组织的记忆 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||||||||||||||||||||||||||||||||||||
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 | IDT71V256SA10Y | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 28-BSOJ (0.300, 7.62mm Width) | 28-SOJ | Volatile | 0°C~70°C TA | Tube | Obsolete | 1 (Unlimited) | 3V~3.6V | IDT71V256 | 256Kb 32K x 8 | 10ns | SRAM | Parallel | 10ns | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W971GG8JB-25 | Winbond Electronics | 数据表 | 291 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 60-TFBGA | YES | 60 | Volatile | 0°C~85°C TC | Tube | 2011 | Obsolete | 3 (168 Hours) | 60 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.02 | 1.7V~1.9V | BOTTOM | 未说明 | 1 | 1.8V | 0.8mm | 未说明 | 60 | 不合格 | 1.8V | 1.9V | 1.7V | 1 | 1Gb 128M x 8 | SYNCHRONOUS | 200MHz | 400ps | DRAM | Parallel | 8b | 16MX8 | 3-STATE | 8 | 15ns | 17b | 1 Gb | 800MHz | COMMON | 8192 | 48 | 48 | 1.2mm | 12.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AS7C31025B-12JCN | Alliance Memory, Inc. | 数据表 | 108 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 32-BSOJ (0.400, 10.16mm Width) | 32 | 32-SOJ | Volatile | 0°C~70°C TA | Tube | 2003 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V | 3.3V | Parallel | 3.6V | 3V | 1 | 1Mb 128K x 8 | 12ns | SRAM | Parallel | 12ns | 17b | 1 Mb | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M48Z128Y-85PM1 | STMicroelectronics | 数据表 | 5481 In Stock | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 通孔 | 32-DIP Module (0.600, 15.24mm) | 32 | Non-Volatile | 0°C~70°C TA | Tube | e3 | Obsolete | 1 (Unlimited) | 32 | EAR99 | Matte Tin (Sn) | 10 YEARS OF DATA RETENTION; POWER SUPPLY WRITE PROTECTION; BATTERY BACK-UP | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 2.54mm | 85GHz | 未说明 | M48Z128 | 32 | 不合格 | 5V | 5V | 1 | 105mA | 1Mb 128K x 8 | ASYNCHRONOUS | NVSRAM | Parallel | 8b | 128KX8 | 3-STATE | 8 | 85ns | 1 Mb | 0.004A | 85 ns | 8b | YES | 9.52mm | 42.8mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62148G-45ZSXI | Cypress Semiconductor Corp | 数据表 | 95 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 32-SOIC (0.400, 10.16mm Width) | YES | Volatile | -40°C~85°C TA | Tube | 2012 | MoBL® | 活跃 | 3 (168 Hours) | 32 | 3A991.B.2.A | 8542.32.00.41 | 4.5V~5.5V | DUAL | 未说明 | 1 | 5V | 1.27mm | 未说明 | R-PDSO-G32 | 5.5V | 4.5V | 4Mb 512K x 8 | SRAM | Parallel | 512KX8 | 8 | 45ns | 4194304 bit | 45 ns | 1.2mm | 20.95mm | 10.16mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25AA256T-E/ST | Microchip Technology | 数据表 | 7030 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 25AA256 | 8 | 不合格 | 5.5V | 2/5V | SPI, Serial | 6mA | 256Kb 32K x 8 | SYNCHRONOUS | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 256 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.1mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24128-DRMN8TP/K | STMicroelectronics | 数据表 | 50000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 14 Weeks | ACTIVE (Last Updated: 6 months ago) | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | Automotive grade | -40°C~105°C TA | Cut Tape (CT) | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 未说明 | 1 | 2.5V | 1.27mm | 未说明 | M24128 | 不合格 | 5.5V | 2/5V | 2-Wire, I2C, Serial | 128Kb 16K x 8 | SYNCHRONOUS | 1MHz | 450ns | EEPROM | I2C | 8 | 4ms | 0.000001A | 131072 bit | I2C | 900000 Write/Erase Cycles | 4ms | 50 | HARDWARE | 1010DDDR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93C76T-E/SN | Microchip Technology | 数据表 | 23 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | 有 | -40°C~125°C TA | Tape & Reel (TR) | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1W | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 40 | 93C76 | 8 | 5V | 5V | Serial | 8Kb 1K x 8 512 x 16 | 3mA | 96B | 2MHz | EEPROM | SPI | 8b | 16 | 1 | 10ms | 8 kb | PIC | 13 | MICROWIRE | 200 | HARDWARE/SOFTWARE | 8 | 4.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS46LR32160B-6BLA2 | ISSI, Integrated Silicon Solution Inc | 数据表 | 3043 In Stock | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 90-TFBGA | YES | 90 | Volatile | Automotive grade | -40°C~105°C TA | Tray | e1 | yes | 活跃 | 3 (168 Hours) | 90 | EAR99 | 锡银铜 | AUTO/SELF REFRESH | 8542.32.00.28 | 1.7V~1.95V | BOTTOM | 260 | 1 | 1.8V | 0.8mm | 40 | 90 | 1.8V | 1.95V | 1.7V | 1 | 512Mb 16M x 32 | 166MHz | 5.5ns | DRAM | Parallel | 32b | 16MX32 | 3-STATE | 32 | 12ns | 15b | 512 Mb | 0.00001A | COMMON | 8192 | 24816 | 24816 | 1.2mm | 13mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS42S16100H-6TLI-TR | ISSI, Integrated Silicon Solution Inc | 数据表 | 36 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 50-TSOP (0.400, 10.16mm Width) | Volatile | Industrial grade | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 3V~3.6V | 16Mb 1M x 16 | 166MHz | 5.5ns | DRAM | Parallel | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1010DV33-10VXIT | Cypress Semiconductor Corp | 数据表 | 49827 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 36-BSOJ (0.400, 10.16mm Width) | 36 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1996 | e4 | yes | 活跃 | 3 (168 Hours) | 36 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 30 | CY7C1010 | 3.3V | 3.6V | 3V | 1 | 90mA | 2Mb 256K x 8 | SRAM | Parallel | 256KX8 | 3-STATE | 8 | 10ns | 18b | 2 Mb | COMMON | Asynchronous | 8b | 2V | 2.75mm | 23.495mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FS512SDSBHA213 | Cypress Semiconductor Corp | 数据表 | 15 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 24-TBGA | YES | Non-Volatile | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | Automotive, AEC-Q100, FS-S | 活跃 | 3 (168 Hours) | 24 | IT IS ALSO CONFIGURED AS 512M X 1 | 8542.32.00.51 | 1.7V~2V | BOTTOM | 未说明 | 1 | 1.8V | 1mm | 未说明 | R-PBGA-B24 | 2V | 1.7V | 512Mb 64M x 8 | SYNCHRONOUS | 80MHz | FLASH | SPI - Quad I/O, QPI | 128MX4 | 4 | 536870912 bit | AEC-Q100; TS 16949 | SERIAL | 1.8V | 2 | 1.2mm | 8mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL064S70TFA010 | Cypress Semiconductor Corp | 数据表 | 29 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | YES | Non-Volatile | Automotive grade | -40°C~85°C TA | Tray | 2003 | GL-S | 活跃 | 3 (168 Hours) | 56 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 0.5mm | 未说明 | R-PDSO-G56 | 3.6V | 2.7V | 64Mb 4M x 16 | ASYNCHRONOUS | 70ns | FLASH | Parallel | 4MX16 | 16 | 60ns | 67108864 bit | AEC-Q100 | 3V | 8 | 1.2mm | 18.4mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY15B064J-SXET | Cypress Semiconductor Corp | 数据表 | 4533 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | Automotive, AEC-Q100, F-RAM™ | e3 | yes | 活跃 | 3 (168 Hours) | 8 | EAR99 | Matte Tin (Sn) - annealed | 8542.32.00.71 | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 1.27mm | 未说明 | R-PDSO-N8 | 3.6V | 3V | 64Kb 8K x 8 | SYNCHRONOUS | 1MHz | FRAM | I2C | 8KX8 | 8 | 65536 bit | 1.727mm | 4.889mm | 3.8985mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1399BN-12VXCT | Cypress Semiconductor Corp | 数据表 | 2500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 28-BSOJ (0.300, 7.62mm Width) | 28 | Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2006 | e4 | yes | Obsolete | 3 (168 Hours) | 28 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 12GHz | 40 | CY7C1399 | 3.3V | 3.6V | 3V | 1 | 55mA | 256Kb 32K x 8 | SRAM | Parallel | 32KX8 | 3-STATE | 8 | 12ns | 15b | 256 kb | 0.0005A | COMMON | Asynchronous | 8b | 3V | 3.556mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL128S10DHB010 | Cypress Semiconductor Corp | 数据表 | 36 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 64-LBGA | YES | Non-Volatile | -40°C~105°C TA | Tray | Automotive, AEC-Q100, GL-S | e1 | 活跃 | 3 (168 Hours) | 64 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 1mm | 未说明 | S-PBGA-B64 | 3.6V | 2.7V | 128Mb 8M x 16 | ASYNCHRONOUS | 100ns | FLASH | Parallel | 16MX8 | 8 | 60ns | 134217728 bit | 3V | 1.4mm | 9mm | 9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL116K0XMFI040 | Cypress Semiconductor Corp | 数据表 | 96442 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOIC | Non-Volatile | -40°C~85°C TA | Tray | 2013 | FL1-K | Obsolete | 3 (168 Hours) | 85°C | -40°C | 2.7V~3.6V | SPI, Serial | 3.6V | 2.7V | 16Mb 2M x 8 | 108MHz | 7 ns | FLASH | SPI - Quad I/O | 3ms | 24b | 16 Mb | 256B | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M28W640HCT70N6E | Micron Technology Inc. | 数据表 | 38 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | 48-TSOP | Non-Volatile | -40°C~85°C TA | Tray | 2006 | Obsolete | 3 (168 Hours) | 85°C | -40°C | 2.7V~3.6V | M28W640 | 2.7V | Parallel | 3.6V | 2.7V | 18mA | 64Mb 4M x 16 | 70ns | FLASH | Parallel | 70ns | 22b | 64 Mb | Asynchronous | 16b | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S70FL01GSAGBHBC10 | Cypress Semiconductor Corp | 数据表 | 305 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 24-TBGA | YES | Non-Volatile | -40°C~105°C TA | Tray | Automotive, AEC-Q100, FL-S | 活跃 | 3 (168 Hours) | 24 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 未说明 | 1 | 3V | 1mm | 未说明 | R-PBGA-B24 | 3.6V | 2.7V | 1Gb 128M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O | 128MX8 | 8 | 1073741824 bit | SERIAL | 3V | 1.2mm | 8mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR93G66FVM-3BGTTR | Rohm Semiconductor | 数据表 | 50 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) | YES | 8-MSOP | 8 | 活跃 | Non-Volatile | BR93G66 | 3 MHz | + 85 C | 5.5 V | - 40 C | 3000 | 3 mA | 1.7 V | SMD/SMT | 3-Wire | 40 Year | Rohm Semiconductor | BR93G66FVM-3B | ROHM 半导体 | ROHM 半导体 | Details | VSSOP, | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | 256 | PLASTIC/EPOXY | -40 °C | 未说明 | 85 °C | 有 | BR93G66FVM-3BGTTR | 3 MHz | 256 words | 5 V | VSSOP | RECTANGULAR | 活跃 | ROHM CO LTD | 2.28 | -40°C ~ 105°C (TA) | MouseReel | - | ALSO AVAILABLE 2.5V OPERATES WITH 2MHZ AND 1.7V OPERATES WITH 1MHZ, SEATED HT-CALCULATED | Memory & Data Storage | 1.7V ~ 5.5V | DUAL | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PDSO-G8 | 1.7 V to 5.5 V | 5.5 V | INDUSTRIAL | 4.5 V | 4Kbit | SYNCHRONOUS | 3 MHz | 3 mA | EEPROM | Microwire | 256 x 16 | 0.9 mm | 16 | 5ms | EEPROM | 4096 bit | SERIAL | EEPROM | 3-WIRE | 5 ms | EEPROM | 256 x 16 | 2.9 mm | 2.8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BR93G46NUX-3TTR | Rohm Semiconductor | 数据表 | 50 In Stock | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 years ago) | 表面贴装 | 8-UFDFN Exposed Pad | YES | VSON008X2030 | 8 | 活跃 | Non-Volatile | BR93G46 | 3 MHz | + 85 C | 5.5 V | - 40 C | 4000 | 3 mA | 1.7 V | SMD/SMT | 3-Wire | 40 Year | Rohm Semiconductor | BR93G46NUX-3 | ROHM 半导体 | ROHM 半导体 | Details | HVSON, | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 64 | PLASTIC/EPOXY | -40 °C | 未说明 | 85 °C | 有 | BR93G46NUX-3TTR | 3 MHz | 64 words | 5 V | HVSON | RECTANGULAR | 活跃 | ROHM CO LTD | 2.28 | -40°C ~ 85°C (TA) | MouseReel | - | e3 | Tin (Sn) | IT ALSO OPERATES AT 1MHZ AT 1.7 MIN | Memory & Data Storage | 1.7V ~ 5.5V | DUAL | 无铅 | 未说明 | 1 | 0.5 mm | compliant | R-PDSO-N8 | 1.7 V to 5.5 V | 5.5 V | INDUSTRIAL | 4.5 V | 1Kbit | SYNCHRONOUS | 3 MHz | 3 mA | EEPROM | Microwire | 64 x 16 | 0.6 mm | 16 | 5ms | EEPROM | 1 kb | 1024 bit | SERIAL | EEPROM | 3-WIRE | 5 ms | 8 | EEPROM | 64 x 16 | 3 mm | 2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BR93G66FVT-3BGE2 | Rohm Semiconductor | 数据表 | 50 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8-TSSOP (0.173", 4.40mm Width) | YES | 8-TSSOP-B | 8 | 活跃 | Non-Volatile | BR93G66 | 3 MHz | + 85 C | 5.5 V | - 40 C | 3000 | 3 mA | 1.7 V | SMD/SMT | 3-Wire | 40 Year | Rohm Semiconductor | BR93G66FVT-3B | ROHM 半导体 | ROHM 半导体 | Details | TSSOP, | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 256 | PLASTIC/EPOXY | -40 °C | 未说明 | 85 °C | 有 | BR93G66FVT-3BGE2 | 3 MHz | 256 words | 5 V | TSSOP | RECTANGULAR | 活跃 | ROHM CO LTD | 2.28 | -40°C ~ 105°C (TA) | MouseReel | - | ALSO AVAILABLE 2.5V OPERATES WITH 2MHZ AND 1.7V OPERATES WITH 1MHZ, SEATED HT-CALCULATED | Memory & Data Storage | 1.7V ~ 5.5V | DUAL | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PDSO-G8 | 1.7 V to 5.5 V | 5.5 V | INDUSTRIAL | 4.5 V | 4Kbit | SYNCHRONOUS | 3 MHz | 3 mA | EEPROM | Microwire | 256 x 16 | 1.2 mm | 16 | 5ms | EEPROM | 4096 bit | SERIAL | EEPROM | 3-WIRE | 5 ms | EEPROM | 256 x 16 | 4.4 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF1602C-70-4I-B3KE-T | Microchip Technology | 数据表 | 28 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 48-TFBGA | 48 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2000 | SST39 MPF™ | e1 | 活跃 | 3 (168 Hours) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.7V~3.6V | BOTTOM | 0.8mm | SST39VF1602C | 3.3V | 18mA | 16Mb 1M x 16 | 70ns | FLASH | Parallel | 16b | 1MX16 | 16 | 10μs | 20b | 16 Mb | 0.00002A | Asynchronous | 16b | YES | YES | YES | 12131 | 8K4K16K32K | YES | TOP | YES | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| R1EX24008ASAS0A#S0 | Renesas | 数据表 | 2500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8 | Compliant | EEPROM | 85 °C | -40 °C | 400 kHz | 2-Wire, I2C, Serial | 5.5 V | 1.8 V | 3 mA | 1 kB | 900 ns | 8 kb | 400 kHz | 无 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S29GL01GS11DHV010 | Cypress Semiconductor Corp | 数据表 | 12 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | -40°C~105°C TA | Tray | GL-S | 活跃 | 3 (168 Hours) | 64 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3V | 1mm | 不合格 | 3V | 3.6V | 2.7V | 1Gb 64M x 16 | ASYNCHRONOUS | 0.08mA | 110ns | FLASH | Parallel | 16 | 60ns | 26b | 1 Gb | 0.0002A | 3V | YES | YES | YES | 1K | 64K | 32B | YES | BOTTOM/TOP | YES | 1.4mm | 9mm | ROHS3 Compliant |
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