类别是'category.片上系统(SoC)' (7720)

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对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

安装类型

包装/外壳

表面安装

越来越多的功能

引脚数

外壳材料

供应商器件包装

质量

插入材料

终端数量

后壳材料,电镀

第一种连接器安装类型

第二个连接器安装类型

厂商

Voltage-Input

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

终止次数

终端

温度系数

连接器类型

电阻

定位的数量

最高工作温度

最小工作温度

组成

颜色

应用

行数

功率(瓦特)

HTS代码

电容量

紧固类型

子类别

额定电流

螺距

技术

电压 - 供电

端子位置

方向

终端形式

屏蔽/屏蔽

峰值回流焊温度(摄氏度)

入口保护

端子间距

样式

已加载定位数量

Reach合规守则

频率

外壳完成

外壳尺寸-插入

触点表面处理

JESD-30代码

功能

输出的数量

资历状况

审批机构

效率

工作电源电压

失败率

引线间距

电源

温度等级

界面

极化

最大输出电流

连接器样式

速度

内存大小

外壳尺寸,MIL

引线样式

核心处理器

周边设备

程序内存大小

连接方式

输入类型

电缆开口

电压 - 输出

建筑学

数据总线宽度

输入数量

座位高度-最大

可编程逻辑类型

产品类别

第一个连接器

第二个连接器

核心架构

表格

使用地区

线长

输入连接器

输出连接器

收发器数量

无负载功耗

连接器用途

主要属性

逻辑单元数

核数量

闪光大小

抽头/步数

独立延误次数

第一拍延迟

可用总延误

特征

触点增量

产品类别

设备核心

座位高度(最大)

长度

宽度

厚度(最大)

触点表面处理厚度

触点表面处理厚度 - 配套

材料可燃性等级

评级结果

AGFB019R25A2I3V
AGFB019R25A2I3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

480

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

A2F500M3G-1FG256M
A2F500M3G-1FG256M
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

256-LBGA

256

256-FPBGA (17x17)

微芯片技术

2.54

Non-Compliant

MCU - 25, FPGA - 66

Tray

A2F500

活跃

无

A2F500M3G-1FG256M

Microsemi Corporation

活跃

MICROSEMI CORP

-55°C ~ 125°C (TJ)

SmartFusion®

125 °C

-55 °C

8542.39.00.01

unknown

100 MHz

EBI/EMI, Ethernet, I2C, SPI, UART, USART

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

XCVM1502-2MLIVSVA2197
XCVM1502-2MLIVSVA2197
AMD 数据表

590 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

608

Tray

活跃

Versal™ Prime

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1M Logic Cells

-

AGFA022R31C2I3E
AGFA022R31C2I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

720

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

AGID023R18A2E1V
AGID023R18A2E1V
Intel 数据表

623 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

活跃

Tray

480

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

XC7Z035-2FFG900I
XC7Z035-2FFG900I
AMD 数据表

532 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

130

Tray

XC7Z035

活跃

-40°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 275K Logic Cells

-

AGFB027R24C2E3V
AGFB027R24C2E3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

744

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

XCZU7EG-2FBVB900I
XCZU7EG-2FBVB900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU7

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

MAX32655GXG
MAX32655GXG
Analog Devices 数据表

35 In Stock

-

最小起订量: 1

最小包装量: 1

81-LFBGA

81-CTBGA (8x8)

Analog Devices Inc./Maxim Integrated

活跃

100 MHz

+ 105 C

1.89 V

- 40 C

1.71 V

SMD/SMT

GPIO, I2C, PWM, SPI, UART, USB

128 kB

MSL 3 - 168 hours

52

Strip

MAX32655

-40°C ~ 105°C

-

I2C, I2S, SPI, UART

100MHz

128KB

ARM® Cortex®-M4

I²S, PWM, WDT

512KB

1-Wire, Bluetooth, I²C, SPI, UART/USART

MCU

32bit

-

512KB

ARM Cortex-M4F

AGFA023R25A1I1V
AGFA023R25A1I1V
Intel 数据表

975 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

8-TSSOP, 8-MSOP (0.118, 3.00mm Width)

8-uMAX/uSOP

Analog Devices Inc./Maxim Integrated

Tube

DS1100

Obsolete

480

-40°C ~ 85°C

-

4.75V ~ 5.25V

Nonprogrammable

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

5

1

100ns

500ns

100 ns

AGFC019R25A2I3E
AGFC019R25A2I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

0402 (1005 Metric)

0402

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

RN73H1E

活跃

480

-55°C ~ 155°C

RN73H

0.039 L x 0.020 W (1.00mm x 0.50mm)

±0.5%

2

±50ppm/°C

10.1 Ohms

Metal Film

0.063W, 1/16W

-

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

Automotive AEC-Q200, Moisture Resistant

0.016 (0.40mm)

AEC-Q200

AGFB027R31C2I3V
AGFB027R31C2I3V
Intel 数据表

989 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Free Hanging (In-Line)

Free Hanging (In-Line)

Hirose Electric Co Ltd

Female

Bulk

50 Ohms

UFL-2HF

-

活跃

Female

6 GHz

-

1.13mm OD Coaxial Cable

720

-40°C ~ 90°C

U.FL

Gray

-

U.FL (UMCC) to U.FL (UMCC)

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

U.FL (UMCC) Plug, Right Angle

U.FL (UMCC) Plug, Right Angle

FPGA - 2.7M Logic Elements

-

-

2.756 (70.00mm)

XCZU3CG-1SFVA625E
XCZU3CG-1SFVA625E
AMD 数据表

2077 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

霍尼韦尔传感与生产力解决方案

Bulk

Obsolete

180

XCZU3

0°C ~ 100°C (TJ)

-

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCZU2EG-2SFVA625I
XCZU2EG-2SFVA625I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

恩智浦半导体

Bulk

74AHC30

活跃

180

-40°C ~ 100°C (TJ)

*

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

AGFB012R24B2E3V
AGFB012R24B2E3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Panel Mount, Through Hole

-

-

不锈钢

-

氟硅弹性体

-

TE Connectivity Deutsch 连接器

600VAC, 850VDC

Bulk

Metal

D38999/25HE

活跃

镍铁合金

Gold

768

-65°C ~ 200°C

MIL-DTL-38999 Series III, DTS

Solder

Receptacle, Female Sockets

23

Silver

Aviation, Communication Systems, Industrial

Threaded

-

D

Shielded

抗环境干扰

化学镍

17-99

1.4GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-

MPU, FPGA

FPGA - 1.2M Logic Elements

-

密封

-

-

10AS057H2F34I2SG
10AS057H2F34I2SG
ALTERA 数据表

964 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

1.2 GHz

570000 LE

24

SMD/SMT

71250 LAB

965012

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

Molex

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS057H2F34I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

Bulk

121024

活跃

492

有

This product may require additional documentation to export from the United States.

2 x 32 kB

-40°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

SoC FPGA

FPGA - 570K Logic Elements

570000

2 Core

--

SoC FPGA

35 mm

35 mm

10AS048K4F35I3LG
10AS048K4F35I3LG
ALTERA 数据表

724 In Stock

-

最小起订量: 1

最小包装量: 1

YES

-

1152

Advantech Corp

Bulk

Obsolete

396

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS048K4F35I3LG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

230VAC

5.47

-

Tray

-

2.39 L x 2.01 W x 1.55 H (60.7mm x 51.1mm x 39.4mm)

活跃

ITE (Commercial)

6 W

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

CE, TUVgs

-

0.9 V

INDUSTRIAL

Positive Tip, Negative Sleeve

500mA

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

固定刀片

12V

MCU, FPGA

396

3.5 mm

现场可编程门阵列

Wall Mount (Class II)

Europe

72 (1.83m)

CEE 7/16

Phono Plug, 2.5mm O.D. x 11.5mm

-

FPGA - 480K Logic Elements

480000

--

35 mm

35 mm

10AS048K3F35I2SG
10AS048K3F35I2SG
ALTERA 数据表

554 In Stock

-

最小起订量: 1

最小包装量: 1

Axial

YES

Axial

1152

1.2 GHz

480000 LE

1

SMD/SMT

60000 LAB

965306

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

Vishay Dale

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS048K3F35I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

Tape & Reel (TR)

RNC60

活跃

396

有

This product may require additional documentation to export from the United States.

2 x 32 kB

-65°C ~ 175°C

Tray

Military, MIL-PRF-55182/03, RNC60

0.097 Dia x 0.280 L (2.46mm x 7.11mm)

±0.1%

活跃

2

±50ppm/°C

124 Ohms

Metal Film

0.25W, 1/4W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

M (1%)

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

SoC FPGA

FPGA - 480K Logic Elements

480000

2 Core

--

Military, Moisture Resistant, Weldable

SoC FPGA

-

35 mm

35 mm

10AS066K3F35E2LG
10AS066K3F35E2LG
ALTERA 数据表

928 In Stock

-

最小起订量: 1

最小包装量: 1

0805 (2012 Metric)

YES

0805

1152

SMD/SMT

82500 LAB

965076

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

Stackpole Electronics Inc

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

有

10AS066K3F35E2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

活跃

Tape & Reel (TR)

396

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

24

-55°C ~ 155°C

Tray

RNCS

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.1%

活跃

2

±50ppm/°C

15.4 kOhms

Thin Film

0.1W, 1/10W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

-

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

SoC FPGA

FPGA - 660K Logic Elements

660000

2 Core

--

Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant

SoC FPGA

0.026 (0.65mm)

35 mm

35 mm

AEC-Q200

XCVP1202-2MLEVSVA2785
XCVP1202-2MLEVSVA2785
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Surface Mount, MLCC

0805 (2012 Metric)

Vishay Vitramon

Tape & Reel (TR)

Obsolete

50V

-55°C ~ 150°C

GA

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.1pF

C0G, NP0

汽车

3.3 pF

-

-

-

Epoxy Mountable, High Temperature

-

0.057 (1.45mm)

AEC-Q200

AGFB008R16A2E3E
AGFB008R16A2E3E
Intel 数据表

595 In Stock

-

最小起订量: 1

最小包装量: 1

0805 (2012 Metric)

0805

KOA Speer Electronics, Inc.

Tape & Reel (TR)

RS73G2A

活跃

384

-55°C ~ 155°C

RS73

0.079 L x 0.049 W (2.00mm x 1.25mm)

±1%

2

±50ppm/°C

4.22 MOhms

厚膜

0.25W, 1/4W

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

Automotive AEC-Q200, Moisture Resistant

0.024 (0.60mm)

AEC-Q200

10AS022E3F29E1HG
10AS022E3F29E1HG
ALTERA 数据表

527 In Stock

-

最小起订量: 1

最小包装量: 1

780-BBGA, FCBGA

780-FBGA (29x29)

活跃

INTEL CORP

5.67

288

有

2 x 32 kB

1.2 GHz

220000 LE

+ 100 C

0 C

36

SMD/SMT

27500 LAB

973472

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

有

10AS022E3F29E1HG

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

12 Transceiver

FPGA - 220K Logic Elements

2 Core

--

SoC FPGA

10AS048H2F34E1SG
10AS048H2F34E1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

0603 (1608 Metric)

YES

0603

1152

KOA Speer Electronics, Inc.

Tape & Reel (TR)

RN731J

Obsolete

492

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

有

10AS048H2F34E1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.68

-55°C ~ 155°C

Tray

RN73

0.063 L x 0.031 W (1.60mm x 0.80mm)

±1%

Discontinued at Digi-Key

2

±50ppm/°C

16.4 kOhms

Thin Film

0.063W, 1/16W

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

--

Moisture Resistant

0.022 (0.55mm)

35 mm

35 mm

10AS066N4F40I3SGES
10AS066N4F40I3SGES
ALTERA 数据表

983 In Stock

-

最小起订量: 1

最小包装量: 1

-

1517-BBGA, FCBGA

YES

1517-FCBGA (40x40)

1517

KYOCERA AVX

250VAC/DC

Bag

活跃

588

BGA,

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

10AS066N4F40I3SGES

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

-55°C ~ 125°C

Tray

8071, Kyocera

Discontinued at Digi-Key

-

Receptacle, Female Sockets

55

-

8542.39.00.01

1 A

0.079 (2.00mm)

BOTTOM

BALL

1 mm

All

compliant

-

S-PBGA-B1517

INDUSTRIAL

-

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.5 mm

现场可编程门阵列

-

FPGA - 660K Logic Elements

--

-

40 mm

40 mm

-

10AS057K3F40E2SG
10AS057K3F40E2SG
ALTERA 数据表

938 In Stock

-

最小起订量: 1

最小包装量: 1

2512 (6432 Metric)

YES

2512

1517

965069

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA,

网格排列

PLASTIC/EPOXY

Stackpole Electronics Inc

0.9 V

0.87 V

100 °C

有

10AS057K3F40E2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

Tape & Reel (TR)

活跃

696

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

570000 LE

21

SMD/SMT

71250 LAB

-55°C ~ 155°C

Tray

RMCF

0.248 L x 0.126 W (6.30mm x 3.20mm)

±1%

活跃

2

±400ppm/°C

7.32 Ohms

厚膜

1W

8542.39.00.01

SOC - Systems on a Chip

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1517

-

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.5 mm

现场可编程门阵列

SoC FPGA

FPGA - 570K Logic Elements

2 Core

--

Automotive AEC-Q200

SoC FPGA

0.028 (0.70mm)

40 mm

40 mm

AEC-Q200