类别是'category.片上系统(SoC)' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 越来越多的功能 | 引脚数 | 外壳材料 | 供应商器件包装 | 质量 | 插入材料 | 终端数量 | 后壳材料,电镀 | 第一种连接器安装类型 | 第二个连接器安装类型 | 厂商 | Voltage-Input | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 终止次数 | 终端 | 温度系数 | 连接器类型 | 电阻 | 定位的数量 | 最高工作温度 | 最小工作温度 | 组成 | 颜色 | 应用 | 行数 | 功率(瓦特) | HTS代码 | 电容量 | 紧固类型 | 子类别 | 额定电流 | 螺距 | 技术 | 电压 - 供电 | 端子位置 | 方向 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度(摄氏度) | 入口保护 | 端子间距 | 样式 | 已加载定位数量 | Reach合规守则 | 频率 | 外壳完成 | 外壳尺寸-插入 | 触点表面处理 | JESD-30代码 | 功能 | 输出的数量 | 资历状况 | 审批机构 | 效率 | 工作电源电压 | 失败率 | 引线间距 | 电源 | 温度等级 | 界面 | 极化 | 最大输出电流 | 连接器样式 | 速度 | 内存大小 | 外壳尺寸,MIL | 引线样式 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 输入类型 | 电缆开口 | 电压 - 输出 | 建筑学 | 数据总线宽度 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 第一个连接器 | 第二个连接器 | 核心架构 | 表格 | 使用地区 | 线长 | 输入连接器 | 输出连接器 | 收发器数量 | 无负载功耗 | 连接器用途 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 抽头/步数 | 独立延误次数 | 第一拍延迟 | 可用总延误 | 特征 | 触点增量 | 产品类别 | 设备核心 | 座位高度(最大) | 长度 | 宽度 | 厚度(最大) | 触点表面处理厚度 | 触点表面处理厚度 - 配套 | 材料可燃性等级 | 评级结果 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | AGFB019R25A2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 480 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-1FG256M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | 微芯片技术 | 2.54 | Non-Compliant | MCU - 25, FPGA - 66 | Tray | A2F500 | 活跃 | 无 | A2F500M3G-1FG256M | Microsemi Corporation | 活跃 | MICROSEMI CORP | -55°C ~ 125°C (TJ) | SmartFusion® | 125 °C | -55 °C | 8542.39.00.01 | unknown | 100 MHz | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-2MLIVSVA2197 | AMD | 数据表 | 590 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | 活跃 | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA022R31C2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 720 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGID023R18A2E1V | Intel | 数据表 | 623 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | Tray | 480 | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z035-2FFG900I | AMD | 数据表 | 532 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 130 | Tray | XC7Z035 | 活跃 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 275K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R24C2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 744 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-2FBVB900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU7 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MAX32655GXG | Analog Devices | 数据表 | 35 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 81-LFBGA | 81-CTBGA (8x8) | Analog Devices Inc./Maxim Integrated | 活跃 | 100 MHz | + 105 C | 1.89 V | - 40 C | 1.71 V | SMD/SMT | GPIO, I2C, PWM, SPI, UART, USB | 128 kB | MSL 3 - 168 hours | 52 | Strip | MAX32655 | -40°C ~ 105°C | - | I2C, I2S, SPI, UART | 100MHz | 128KB | ARM® Cortex®-M4 | I²S, PWM, WDT | 512KB | 1-Wire, Bluetooth, I²C, SPI, UART/USART | MCU | 32bit | - | 512KB | ARM Cortex-M4F | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA023R25A1I1V | Intel | 数据表 | 975 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8-uMAX/uSOP | Analog Devices Inc./Maxim Integrated | Tube | DS1100 | Obsolete | 480 | -40°C ~ 85°C | - | 4.75V ~ 5.25V | Nonprogrammable | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | 5 | 1 | 100ns | 500ns | 100 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFC019R25A2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 0402 (1005 Metric) | 0402 | KOA Speer Electronics, Inc. | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | RN73H1E | 活跃 | 480 | -55°C ~ 155°C | RN73H | 0.039 L x 0.020 W (1.00mm x 0.50mm) | ±0.5% | 2 | ±50ppm/°C | 10.1 Ohms | Metal Film | 0.063W, 1/16W | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | Automotive AEC-Q200, Moisture Resistant | 0.016 (0.40mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R31C2I3V | Intel | 数据表 | 989 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Free Hanging (In-Line) | Free Hanging (In-Line) | Hirose Electric Co Ltd | Female | Bulk | 50 Ohms | UFL-2HF | - | 活跃 | Female | 6 GHz | - | 1.13mm OD Coaxial Cable | 720 | -40°C ~ 90°C | U.FL | Gray | - | U.FL (UMCC) to U.FL (UMCC) | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | U.FL (UMCC) Plug, Right Angle | U.FL (UMCC) Plug, Right Angle | FPGA - 2.7M Logic Elements | - | - | 2.756 (70.00mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3CG-1SFVA625E | AMD | 数据表 | 2077 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | 霍尼韦尔传感与生产力解决方案 | Bulk | Obsolete | 180 | XCZU3 | 0°C ~ 100°C (TJ) | - | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2EG-2SFVA625I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | 恩智浦半导体 | Bulk | 74AHC30 | 活跃 | 180 | -40°C ~ 100°C (TJ) | * | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB012R24B2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Panel Mount, Through Hole | - | - | 不锈钢 | - | 氟硅弹性体 | - | TE Connectivity Deutsch 连接器 | 600VAC, 850VDC | Bulk | Metal | D38999/25HE | 活跃 | 镍铁合金 | Gold | 768 | -65°C ~ 200°C | MIL-DTL-38999 Series III, DTS | Solder | Receptacle, Female Sockets | 23 | Silver | Aviation, Communication Systems, Industrial | Threaded | - | D | Shielded | 抗环境干扰 | 化学镍 | 17-99 | 1.4GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MPU, FPGA | FPGA - 1.2M Logic Elements | - | 密封 | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057H2F34I2SG | ALTERA | 数据表 | 964 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 1.2 GHz | 570000 LE | 24 | SMD/SMT | 71250 LAB | 965012 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | Molex | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057H2F34I2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Bulk | 121024 | 活跃 | 492 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | -40°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 492 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048K4F35I3LG | ALTERA | 数据表 | 724 In Stock |
- | 最小起订量: 1 最小包装量: 1 | YES | - | 1152 | Advantech Corp | Bulk | Obsolete | 396 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS048K4F35I3LG | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0.93 V | 230VAC | 5.47 | - | Tray | - | 2.39 L x 2.01 W x 1.55 H (60.7mm x 51.1mm x 39.4mm) | 活跃 | ITE (Commercial) | 6 W | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | CE, TUVgs | - | 0.9 V | INDUSTRIAL | Positive Tip, Negative Sleeve | 500mA | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 固定刀片 | 12V | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | Wall Mount (Class II) | Europe | 72 (1.83m) | CEE 7/16 | Phono Plug, 2.5mm O.D. x 11.5mm | - | FPGA - 480K Logic Elements | 480000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048K3F35I2SG | ALTERA | 数据表 | 554 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Axial | YES | Axial | 1152 | 1.2 GHz | 480000 LE | 1 | SMD/SMT | 60000 LAB | 965306 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | Vishay Dale | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS048K3F35I2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.47 | Tape & Reel (TR) | RNC60 | 活跃 | 396 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | -65°C ~ 175°C | Tray | Military, MIL-PRF-55182/03, RNC60 | 0.097 Dia x 0.280 L (2.46mm x 7.11mm) | ±0.1% | 活跃 | 2 | ±50ppm/°C | 124 Ohms | Metal Film | 0.25W, 1/4W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | M (1%) | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | Military, Moisture Resistant, Weldable | SoC FPGA | - | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K3F35E2LG | ALTERA | 数据表 | 928 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 0805 (2012 Metric) | YES | 0805 | 1152 | SMD/SMT | 82500 LAB | 965076 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | Stackpole Electronics Inc | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS066K3F35E2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | 活跃 | Tape & Reel (TR) | 396 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | 24 | -55°C ~ 155°C | Tray | RNCS | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1% | 活跃 | 2 | ±50ppm/°C | 15.4 kOhms | Thin Film | 0.1W, 1/10W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | - | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant | SoC FPGA | 0.026 (0.65mm) | 35 mm | 35 mm | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1202-2MLEVSVA2785 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, MLCC | 0805 (2012 Metric) | Vishay Vitramon | Tape & Reel (TR) | Obsolete | 50V | -55°C ~ 150°C | GA | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1pF | C0G, NP0 | 汽车 | 3.3 pF | - | - | - | Epoxy Mountable, High Temperature | - | 0.057 (1.45mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB008R16A2E3E | Intel | 数据表 | 595 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 0805 (2012 Metric) | 0805 | KOA Speer Electronics, Inc. | Tape & Reel (TR) | RS73G2A | 活跃 | 384 | -55°C ~ 155°C | RS73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±1% | 2 | ±50ppm/°C | 4.22 MOhms | 厚膜 | 0.25W, 1/4W | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | Automotive AEC-Q200, Moisture Resistant | 0.024 (0.60mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022E3F29E1HG | ALTERA | 数据表 | 527 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 780-BBGA, FCBGA | 780-FBGA (29x29) | 活跃 | INTEL CORP | 5.67 | 288 | 有 | 2 x 32 kB | 1.2 GHz | 220000 LE | + 100 C | 0 C | 36 | SMD/SMT | 27500 LAB | 973472 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 有 | 10AS022E3F29E1HG | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 12 Transceiver | FPGA - 220K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048H2F34E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 0603 (1608 Metric) | YES | 0603 | 1152 | KOA Speer Electronics, Inc. | Tape & Reel (TR) | RN731J | Obsolete | 492 | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS048H2F34E1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.68 | -55°C ~ 155°C | Tray | RN73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±1% | Discontinued at Digi-Key | 2 | ±50ppm/°C | 16.4 kOhms | Thin Film | 0.063W, 1/16W | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 492 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | -- | Moisture Resistant | 0.022 (0.55mm) | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066N4F40I3SGES | ALTERA | 数据表 | 983 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | KYOCERA AVX | 250VAC/DC | Bag | 活跃 | 588 | BGA, | 网格排列 | PLASTIC/EPOXY | -40 °C | 0.9 V | 0.87 V | 100 °C | 10AS066N4F40I3SGES | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.66 | -55°C ~ 125°C | Tray | 8071, Kyocera | Discontinued at Digi-Key | - | Receptacle, Female Sockets | 55 | - | 8542.39.00.01 | 1 A | 0.079 (2.00mm) | BOTTOM | BALL | 1 mm | All | compliant | - | S-PBGA-B1517 | INDUSTRIAL | - | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | 现场可编程门阵列 | - | FPGA - 660K Logic Elements | -- | - | 40 mm | 40 mm | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057K3F40E2SG | ALTERA | 数据表 | 938 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2512 (6432 Metric) | YES | 2512 | 1517 | 965069 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, | 网格排列 | PLASTIC/EPOXY | Stackpole Electronics Inc | 0.9 V | 0.87 V | 100 °C | 有 | 10AS057K3F40E2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Tape & Reel (TR) | 活跃 | 696 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 570000 LE | 21 | SMD/SMT | 71250 LAB | -55°C ~ 155°C | Tray | RMCF | 0.248 L x 0.126 W (6.30mm x 3.20mm) | ±1% | 活跃 | 2 | ±400ppm/°C | 7.32 Ohms | 厚膜 | 1W | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | - | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 2 Core | -- | Automotive AEC-Q200 | SoC FPGA | 0.028 (0.70mm) | 40 mm | 40 mm | AEC-Q200 |
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