类别是'category.片上系统(SoC)' (7720)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | Core | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | 类型 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | JESD-30代码 | 输出的数量 | 资历状况 | 工作频率 | 工作电源电压 | 电源 | 温度等级 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 输出功率 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 收发器数量 | 敏感度 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | AGFA022R31C2E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 720 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-2FFVC1156E | AMD | 数据表 | 713 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 360 | Tray | XCZU11 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-2MSINSVG1369 | AMD | 数据表 | 837 In Stock |
- | 最小起订量: 1 最小包装量: 1 | AMD | 活跃 | 500 | Tray | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z007S-2CLG400E | AMD | 数据表 | 20 In Stock | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | AMD | 100 | Tray | XC7Z007 | 活跃 | 0°C ~ 100°C (TJ) | Zynq®-7000 | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA027R24C2E3V | Intel | 数据表 | 726 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 744 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX040HH3F35I3XG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3CG-1SFVC784I | AMD | 数据表 | 50 In Stock | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 活跃 | XCZU3 | Bulk | 252 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032E2F29E2SG | ALTERA | 数据表 | 878 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-780 | YES | 780 | SMD/SMT | 40000 LAB | 965337 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA780,28X28,40 | 网格排列 | PLASTIC/EPOXY | BGA780,28X28,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032E2F29E2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.44 | 360 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 320000 LE | 1 | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B780 | 360 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 29 mm | 29 mm | ||||||||||||||||||||
![]() | I.MX 6ULTRALITE / MCIMX6G2AVM07AB | NXP | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | I.MX 8MQUADLITE / MIMX8MQ5CVAHZAA | NXP | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | I.MX 8MQUADLITE / MIMX8MQ5DVAJZAA | NXP | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | I.MX 6ULTRALITE / MCIMX6G2CVK05AB | NXP | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | I.MX 6SOLOX / MCIMX6X4AVM08AB | NXP | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | I.MX 8MQUAD / MIMX8MQ6DVAJZAA | NXP | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | I.MX 6SOLOX / MCIMX6X4EVM10AB | NXP | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFC023R25A2E1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 480 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250TS-FCV484M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | 微芯片技术 | 活跃 | 1 | - | SMD/SMT | MCU - 136, FPGA - 372 | Tray | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU46DR-2FSVH1760I5184 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1760 | ARM Cortex A53, ARM Cortex R5F | SMD/SMT | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 930300 LE | 618 I/O | - 40 C | + 100 C | 13 Mb | 53160 LAB | 1 | 850 mV | 16 Transceiver | 6 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM43236BKMLG | Infineon Technologies | 数据表 | 233 In Stock | - | 最小起订量: 1 最小包装量: 1 | ARM Cortex M3 | Details | 300 Mbps | 1.14 V | 462 mA | 462 mA | 0 C | + 65 C | 有 | 168 | 1.26 V | Tray | Wi-Fi | 2.4 GHz, 5 GHz | 256 kB | 15.5 dBm | - 66 dBm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM20737A1KML2G | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ARM Cortex M3 | Details | 1 Mbps | 1.14 V | 9.8 mA | 9.1 mA | - 30 C | + 85 C | 有 | 490 | 1.26 V | Tray | Bluetooth | 2.4 GHz | 320 kB | 4 dBm | - 94 dBm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250T-1FCVG484I | Microchip Technology | 数据表 | 2766 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCVG-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | 微芯片技术 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | 0 C | + 100 C | 1 | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250TL-FCVG784I | Microchip Technology | 数据表 | 2508 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | 微芯片技术 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | - 40 C | + 100 C | 1 | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TL-FCVG784E | Microchip Technology | 数据表 | 2803 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-BGA | RV64GC, RV64IMAC | 微芯片技术 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 1 | + 100 C | 0 C | 276 I/O | 93000 LE | - | 4 x 32 kB | 16 kB, 4 x 32 kB | 0°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250TL-FCSG536E | Microchip Technology | 数据表 | 2077 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-536 | 536-LFBGA | RV64GC, RV64IMAC | 微芯片技术 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | 0 C | + 100 C | 1 | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095T-1FCVG784I | Microchip Technology | 数据表 | 2843 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-BGA | RV64GC, RV64IMAC | 微芯片技术 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | 0 C | + 100 C | 1 | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB |
AGFA022R31C2E2V
Intel
分类:Embedded - System On Chip (SoC)
XCZU11EG-2FFVC1156E
AMD
分类:Embedded - System On Chip (SoC)
40,387.410588
XCVE1752-2MSINSVG1369
AMD
分类:Embedded - System On Chip (SoC)
166,178.751899
XC7Z007S-2CLG400E
AMD
分类:Embedded - System On Chip (SoC)
AGFA027R24C2E3V
Intel
分类:Embedded - System On Chip (SoC)
147,351.057253
1SX040HH3F35I3XG
Intel
分类:Embedded - System On Chip (SoC)
XCZU3CG-1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
10AS032E2F29E2SG
ALTERA
分类:Embedded - System On Chip (SoC)
12,148.628599
I.MX 6ULTRALITE / MCIMX6G2AVM07AB
NXP
分类:Embedded - System On Chip (SoC)
I.MX 8MQUADLITE / MIMX8MQ5CVAHZAA
NXP
分类:Embedded - System On Chip (SoC)
I.MX 8MQUADLITE / MIMX8MQ5DVAJZAA
NXP
分类:Embedded - System On Chip (SoC)
I.MX 6ULTRALITE / MCIMX6G2CVK05AB
NXP
分类:Embedded - System On Chip (SoC)
I.MX 6SOLOX / MCIMX6X4AVM08AB
NXP
分类:Embedded - System On Chip (SoC)
I.MX 8MQUAD / MIMX8MQ6DVAJZAA
NXP
分类:Embedded - System On Chip (SoC)
I.MX 6SOLOX / MCIMX6X4EVM10AB
NXP
分类:Embedded - System On Chip (SoC)
AGFC023R25A2E1V
Intel
分类:Embedded - System On Chip (SoC)
MPFS250TS-FCV484M
Microchip Technology
分类:Embedded - System On Chip (SoC)
XCZU46DR-2FSVH1760I5184
Xilinx
分类:Embedded - System On Chip (SoC)
BCM43236BKMLG
Infineon Technologies
分类:Embedded - System On Chip (SoC)
BCM20737A1KML2G
Infineon Technologies
分类:Embedded - System On Chip (SoC)
MPFS250T-1FCVG484I
Microchip Technology
分类:Embedded - System On Chip (SoC)
3,449.328446
MPFS250TL-FCVG784I
Microchip Technology
分类:Embedded - System On Chip (SoC)
3,497.856954
MPFS095TL-FCVG784E
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,537.180769
MPFS250TL-FCSG536E
Microchip Technology
分类:Embedded - System On Chip (SoC)
2,416.272064
MPFS095T-1FCVG784I
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,538.888239
