类别是'category.片上系统(SoC)' (7720)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 供应商器件包装 | Core | 厂商 | 操作温度 | 包装 | 系列 | 工作电源电压 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 收发器数量 | 主要属性 | 核数量 | 闪光大小 | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | XAZU2EG-1SFVC784Q5210 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 103320 LE | 252 I/O | - 40 C | + 125 C | 1.2 Mb | 5904 LAB | 1 | SMD/SMT | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 850 mV | 7 Core | |||||||||||||||||||||
![]() | XQZU43DR-L2FSQE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-1156 | ARM Cortex A53, ARM Cortex R5F | 930300 LE | - 40 C | + 100 C | 13 Mb | 53160 LAB | 1 | SMD/SMT | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 720 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||
![]() | XQZU43DR-2FFQE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-1156 | ARM Cortex A53, ARM Cortex R5F | - 40 C | 930300 LE | 256 kB | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | SMD/SMT | 1 | 53160 LAB | 13 Mb | + 100 C | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||
![]() | XCZU5EG-L1SFVC784I5255 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 256200 LE | 252 I/O | - 40 C | + 100 C | 3.5 Mb | 14640 LAB | 1 | SMD/SMT | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 850 mV | 16 Transceiver | 7 Core | ||||||||||||||||||||
![]() | XQZU42DR-L1FSQE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-1156 | ARM Cortex A53, ARM Cortex R5F | 489300 LE | - 40 C | + 100 C | 6.8 Mb | 27960 LAB | 1 | SMD/SMT | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 850 mV | 8 Transceiver | 6 Core | |||||||||||||||||||||
![]() | XCZU11EG-2FFVC1760I4524 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1760 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 653100 LE | 560 I/O | - 40 C | + 100 C | 9.1 Mb | 37320 LAB | 1 | SMD/SMT | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 850 mV | 48 Transceiver | 7 Core | ||||||||||||||||||||
![]() | XCZU19EG-2FFVC1760E5187 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1760 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1143450 LE | 560 I/O | 0 C | + 100 C | 9.8 Mb | 65340 LAB | 1 | SMD/SMT | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 850 mV | 72 Transceiver | 7 Core | ||||||||||||||||||||
![]() | XCZU3CG-2UBVA530E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5F | 2 x 32 kB, 2 x 32 kB | 256 kB | 154350 LE | 82 I/O | 0 C | AMD 赛灵思 | + 100 C | 1.8 Mb | 8820 LAB | 1 | Tray | 活跃 | SMD/SMT | 2 x 32 kB, 2 x 32 kB | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 850 mV | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 4 Core | - | |||||||
![]() | XCZU3CG-2UBVA530I | Xilinx | 数据表 | 2124 In Stock | - | 最小起订量: 1 最小包装量: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5F | 2 x 32 kB, 2 x 32 kB | 256 kB | 154350 LE | 82 I/O | - 40 C | AMD 赛灵思 | + 100 C | 1.8 Mb | 8820 LAB | 1 | 活跃 | Tray | SMD/SMT | 2 x 32 kB, 2 x 32 kB | -40°C ~ 100°C (TJ) | - | 850 mV | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 4 Core | - | |||||||
![]() | XCZU19EG-2FFVC1760E5106 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1760 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1143450 LE | 560 I/O | 0 C | + 100 C | 9.8 Mb | 65340 LAB | 1 | SMD/SMT | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 850 mV | 72 Transceiver | 7 Core | ||||||||||||||||||||
![]() | XCZU3EG-L1UBVA530IES9818 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-530 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 154350 LE | 82 I/O | - 40 C | + 100 C | 1.8 Mb | 8820 LAB | 1 | SMD/SMT | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 850 mV | 7 Core | |||||||||||||||||||||
![]() | XCZU2EG-2UBVA530I | Xilinx | 数据表 | 2119 In Stock | - | 最小起订量: 1 最小包装量: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 2 x 32 kB, 4 x 32 kB | 256 kB | 103320 LE | 82 I/O | - 40 C | AMD 赛灵思 | + 100 C | 1.2 Mb | 5904 LAB | 1 | Tray | 活跃 | SMD/SMT | 2 x 32 kB, 4 x 32 kB | -40°C ~ 100°C (TJ) | - | 850 mV | 533MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 7 Core | - | |||||||
![]() | XCZU2EG-1UBVA530I | Xilinx | 数据表 | 2117 In Stock | - | 最小起订量: 1 最小包装量: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 2 x 32 kB, 4 x 32 kB | 256 kB | 103320 LE | 82 I/O | - 40 C | AMD 赛灵思 | + 100 C | 1.2 Mb | 5904 LAB | 1 | Tray | 活跃 | SMD/SMT | 2 x 32 kB, 4 x 32 kB | -40°C ~ 100°C (TJ) | - | 850 mV | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 7 Core | - | |||||||
![]() | MPFS160TLS-FCVG784I | Microchip Technology | 数据表 | 2767 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | 0 C | 微芯片技术 | SMD/SMT | 312 I/O | 161000 LE | Tray | 活跃 | This product may require additional documentation to export from the United States. | - | 1 | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | |||||
![]() | MPFS160TS-1FCSG536I | Microchip Technology | 数据表 | 2693 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-536 | 536-LFBGA | RV64GC, RV64IMAC | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | 0 C | 微芯片技术 | SMD/SMT | 312 I/O | 161000 LE | Tray | 活跃 | This product may require additional documentation to export from the United States. | - | 1 | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | |||||
![]() | MPFS250T-1FCG1152I | Microchip Technology | 数据表 | 2401 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-1152 | 1152-FCBGA (35x35) | RV64GC, RV64IMAC | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | 0 C | 微芯片技术 | SMD/SMT | 372 I/O | 254000 LE | Tray | 活跃 | This product may require additional documentation to export from the United States. | - | 1 | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | |||||
![]() | MPFS095TS-1FCVG484I | Microchip Technology | 数据表 | 2986 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | - 40 C | 微芯片技术 | SMD/SMT | 276 I/O | 93000 LE | Tray | 活跃 | This product may require additional documentation to export from the United States. | - | 1 | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | |||||
![]() | MPFS160T-FCSG536E | Microchip Technology | 数据表 | 2467 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCSG-536 | 536-LFBGA | RV64GC, RV64IMAC | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 161000 LE | 微芯片技术 | 312 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | |||||
![]() | MPFS160TL-FCVG484E | Microchip Technology | 数据表 | 2784 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 161000 LE | 微芯片技术 | 312 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | |||||
![]() | MPFS095TS-1FCSG325I | Microchip Technology | 数据表 | 2021 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-325 | 325-LFBGA (11x14.5) | RV64GC, RV64IMAC | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 微芯片技术 | 276 I/O | - 40 C | + 100 C | 1 | Bulk | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | -40°C ~ 100°C | Tray | - | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128KB | |||||
![]() | MPFS160T-1FCVG484E | Microchip Technology | 数据表 | 2386 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCVG-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 161000 LE | 微芯片技术 | 312 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 0°C ~ 100°C | Tray | PolarFire® | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | |||||
![]() | MPFS160T-FCVG484E | Microchip Technology | 数据表 | 2651 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCVG-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 161000 LE | 微芯片技术 | 312 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | |||||
![]() | MPFS095TLS-FCSG325I | Microchip Technology | 数据表 | 2772 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-325 | 325-LFBGA (11x14.5) | RV64GC, RV64IMAC | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 微芯片技术 | 276 I/O | - 40 C | + 100 C | 1 | Bulk | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | -40°C ~ 100°C | Tray | - | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128KB | |||||
![]() | MPFS250T-FCVG484I | Microchip Technology | 数据表 | 2264 In Stock | - | 最小起订量: 1 最小包装量: 1 | FCVG-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 微芯片技术 | 372 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | |||||
![]() | MPFS095T-1FCSG325I | Microchip Technology | 数据表 | 2848 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-325 | 325-LFBGA (11x14.5) | RV64GC, RV64IMAC | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 微芯片技术 | 276 I/O | 0 C | + 100 C | 1 | Bulk | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | -40°C ~ 100°C | Tray | - | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128KB |
XAZU2EG-1SFVC784Q5210
Xilinx
分类:Embedded - System On Chip (SoC)
XQZU43DR-L2FSQE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
XQZU43DR-2FFQE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU5EG-L1SFVC784I5255
Xilinx
分类:Embedded - System On Chip (SoC)
XQZU42DR-L1FSQE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU11EG-2FFVC1760I4524
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU19EG-2FFVC1760E5187
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU3CG-2UBVA530E
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU3CG-2UBVA530I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU19EG-2FFVC1760E5106
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU3EG-L1UBVA530IES9818
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU2EG-2UBVA530I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU2EG-1UBVA530I
Xilinx
分类:Embedded - System On Chip (SoC)
MPFS160TLS-FCVG784I
Microchip Technology
分类:Embedded - System On Chip (SoC)
2,355.737062
MPFS160TS-1FCSG536I
Microchip Technology
分类:Embedded - System On Chip (SoC)
2,421.505339
MPFS250T-1FCG1152I
Microchip Technology
分类:Embedded - System On Chip (SoC)
3,334.768428
MPFS095TS-1FCVG484I
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,380.671314
MPFS160T-FCSG536E
Microchip Technology
分类:Embedded - System On Chip (SoC)
2,637.479485
MPFS160TL-FCVG484E
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,753.637022
MPFS095TS-1FCSG325I
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,277.286701
MPFS160T-1FCVG484E
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,797.812544
MPFS160T-FCVG484E
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,448.659181
MPFS095TLS-FCSG325I
Microchip Technology
分类:Embedded - System On Chip (SoC)
2,184.596401
MPFS250T-FCVG484I
Microchip Technology
分类:Embedded - System On Chip (SoC)
MPFS095T-1FCSG325I
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,230.973697
