类别是'category.片上系统(SoC)' (7695)

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AGIC040R39A2I3V
AGIC040R39A2I3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 4.047M Logic Elements

AGIA035R39A1E2VB
AGIA035R39A1E2VB
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

0°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 3.54M Logic Elements

AGFD023R31C2E4X
AGFD023R31C2E4X
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

AGFC023R31C2E3V
AGFC023R31C2E3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

AGIC040R39A2I3E
AGIC040R39A2I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 4.047M Logic Elements

AGFB014R24D1E3V
AGFB014R24D1E3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2340-BFBGA Exposed Pad

2340-BGA (45x42)

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

AGID019R31B2I3V
AGID019R31B2I3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

AGFB023R31C2I3E
AGFB023R31C2I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

-40°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

AGIA035R39A2I1VB
AGIA035R39A2I1VB
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 3.54M Logic Elements

AGFA023R31C3E3V
AGFA023R31C3E3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

AGIA035R39A2I2VB
AGIA035R39A2I2VB
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 3.54M Logic Elements

AGFB008R24D1E2V
AGFB008R24D1E2V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2340-BFBGA Exposed Pad

2340-BGA (45x42)

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

AGIA040R39A2E2VB
AGIA040R39A2E2VB
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

0°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 4.047M Logic Elements

AGFB019R31C3I3E
AGFB019R31C3I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

-40°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

AGFA023R31C2E4X
AGFA023R31C2E4X
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

AGFA023R24C3E3V
AGFA023R24C3E3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2340-BFBGA Exposed Pad

2340-BGA (45x42)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

AGFA006R24C2I1VB
AGFA006R24C2I1VB
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2340-BFBGA Exposed Pad

2340-BGA (45x42)

576

-40°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

AGFA008R24C2E1VB
AGFA008R24C2E1VB
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2340-BFBGA Exposed Pad

2340-BGA (45x42)

576

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

AMA3B1KK-KCR-TB
AMA3B1KK-KCR-TB
Ambiq Micro, Inc. 数据表

N/A

-

最小起订量: 1

最小包装量: 1

66-UFBGA, CSPBGA

66-CSP (3.38x3.25)

AMA3B1KK

37

-40°C ~ 85°C (TA)

Tape & Reel (TR)

Apollo3 Blue

活跃

96MHz

384KB

ARM® Cortex®-M4F

Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

I2C, SPI, UART/USART

MCU

1MB

AGIA040R39A1I2VB
AGIA040R39A1I2VB
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 4.047M Logic Elements

XCVM2902-1LSEVFVF1760
XCVM2902-1LSEVFVF1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Xilinx

Xilinx

+ 100 C

0 C

1

SOC - Systems on a Chip

700 mV

System-On-Modules - SOM

SoC FPGA

XCVM1302-2LLEVFVC1596
XCVM1302-2LLEVFVC1596
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

1

Xilinx

Xilinx

AMD 赛灵思

532

Tray

活跃

+ 110 C

0 C

0°C ~ 100°C (TJ)

Versal™ Prime

50 ppm/°C

162 kOhm

SOC - Systems on a Chip

0.25 W

高可靠性

700 mV

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

System-On-Modules - SOM

1

Versal™ Prime FPGA, 70k Logic Cells

-

SoC FPGA

3.2

1.6

XCVM1102-2MSISFVA784
XCVM1102-2MSISFVA784
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

- 40 C

1

Xilinx

Xilinx

AEC-Q200

+ 110 C

100 ppm/K

825 Ohm

SOC - Systems on a Chip

0.1 W

通用型

800 mV

System-On-Modules - SOM

1

SoC FPGA

1.55 mm

0.85 mm

XCVP1402-1LSEVFVF1760
XCVP1402-1LSEVFVF1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Xilinx

Xilinx

+ 100 C

0 C

1

SOC - Systems on a Chip

125 mW

High Reliability, MIL-PRF-55182

700 mV

System-On-Modules - SOM

1

SoC FPGA

XQVP1202-1LSIVSRC2197
XQVP1202-1LSIVSRC2197
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Xilinx

Xilinx

+ 110 C

- 40 C

1

100.0000 ppm/°C

2.26 kOhm

SOC - Systems on a Chip

0.125 W

High Reliability, MIL-PRF-39017

700 mV

System-On-Modules - SOM

1

SoC FPGA

4.75