category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	供应商器件包装														厂商												操作温度	系列	温度系数	电阻	性别	子类别	额定功率	电阻器类型	引脚数量	速度	内存大小	核心处理器	程序内存大小
XCVE2202-1LSISFVA784	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1	Xilinx	Xilinx				+ 110 C	- 40 C			100 ppm/K	9.09 kOhm		SOC - Systems on a Chip	0.05 W	通用型		700 mV									System-On-Modules - SOM	1				SoC FPGA	0.6 mm	0.3 mm
XQVC1902-2MSIVSQA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1	Xilinx	Xilinx				+ 110 C	- 40 C						SOC - Systems on a Chip	125 mW	High Reliability, MIL-PRF-55182		800 mV									System-On-Modules - SOM	0.5				SoC FPGA
XCVE2102-1LLISBVA625	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		32 V	+ 110 C	- 40 C	1	Xilinx		Xilinx							SOC - Systems on a Chip				700 mV									System-On-Modules - SOM					SoC FPGA
XCVE1752-1LSEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思	+ 100 C	0 C	1	Xilinx	Xilinx	608	Tray	活跃	0°C ~ 100°C (TJ)	Versal™ AI Core	100 ppm/K	91 Ohm		SOC - Systems on a Chip	1 W	Pulse Proof, High Power		700 mV	400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		System-On-Modules - SOM	1	Versal™ AI Core FPGA, 1M Logic Cells		-	SoC FPGA
XCZU55DR-2FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	1	Xilinx	Xilinx	-	Tray	活跃	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC DR	100.0000 ppm/°C	392 kOhm		SOC - Systems on a Chip	0.25 W				533MHz, 1.3GHz	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		1	Zynq® UltraScale+™ RFSoC		-	SoC FPGA	10.8
XCVE2002-2MLISBVA484	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1	Xilinx	Xilinx				+ 110 C	- 40 C			50.0000 ppm/°C	1.5		SOC - Systems on a Chip	10.0000 W			800 mV									System-On-Modules - SOM	1				SoC FPGA	32.51 mm
XCZU65DR-1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		700 V		1	Xilinx	Xilinx							SOC - Systems on a Chip																	SoC FPGA
XCVM2202-2MSIVSVC2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1	Xilinx	Xilinx				+ 110 C	- 40 C			50.0000 ppm/°C	634 Ohm		SOC - Systems on a Chip	0.5 W	Industrial		800 mV									System-On-Modules - SOM	1				SoC FPGA	6.1
XCZU55DR-1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	1	Xilinx	Xilinx	-	Tray	活跃	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC DR	100 ppm/K	680 Ohm		SOC - Systems on a Chip	0.05 W	通用型			500MHz, 1.2GHz	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		1	Zynq® UltraScale+™ RFSoC		-	SoC FPGA	0.6 mm	0.3 mm
XQVP1202-1MLIVSQA2785	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		AEC-Q200	+ 110 C	- 40 C	1	Xilinx		Xilinx				100 ppm/K	2.2 Ohm		SOC - Systems on a Chip	0.75 W	通用型		800 mV									System-On-Modules - SOM	1				SoC FPGA	5 mm	2.5 mm
XCVE2002-1MSESBVA625	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx	Xilinx			75 V	AEC-Q200	+ 100 C	0 C		1			50 ppm/K	18		SOC - Systems on a Chip	0.1 W	Semi-Precision		800 mV									System-On-Modules - SOM	0.5				SoC FPGA	1.55 mm	0.85 mm
XCVE2102-2MLESBVA625	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1	Xilinx	Xilinx				+ 110 C	0 C						SOC - Systems on a Chip	125 mW	High Reliability, MIL-PRF-39017		800 mV									System-On-Modules - SOM	1				SoC FPGA
XCVM2502-2MSEVSVC2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		250 V	+ 110 C	0 C	1	Xilinx		Xilinx				25.0000 ppm/°C	100		SOC - Systems on a Chip	0.25 W	High Reliability, MIL-PRF-55182		800 mV									System-On-Modules - SOM	0.1				SoC FPGA	8.89 mm
XCZU67DR-L1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1				1	Xilinx	Xilinx						SOC - Systems on a Chip																	SoC FPGA
XC7Z045-2FBG676E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BBGA, FCBGA	676-FCBGA (27x27)	AMD	XC7Z045	130	Tray	活跃	0°C ~ 100°C (TJ)	Zynq®-7000									800MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Kintex™-7 FPGA, 350K Logic Cells		-
AGFA014R24C2I2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃	Tray	744	-40°C ~ 100°C (TJ)	Agilex F									1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA				FPGA - 1.4M Logic Elements		-
AGFA027R25A3E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	624	Tray	活跃	0°C ~ 100°C (TJ)	Agilex F									1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA				FPGA - 2.7M Logic Elements		-
XCZU46DR-DIE4058	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1
XCZU47DR-1FFVG1517IES9819	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2 x 32 kB, 4 x 32 kB	533 MHz, 1.3 GHz	930300 LE				-	2 x 32 kB, 4 x 32 kB		XCZU47DR													-							6 Core
XCZU19EG-2FFVC1760I	AMD	数据表	1760 In Stock	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD	XCZU19	512	Tray	活跃	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG									533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells		-
XC7Z045-2FBG676CES	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BBGA, FCBGA	676-FCBGA (27x27)	AMD	130	Tray	XC7Z045	Obsolete	0°C ~ 85°C (TJ)	Zynq®-7000									800MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Kintex™-7 FPGA, 350K Logic Cells		-
XCVM1302-2MLINSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思	316	Tray	活跃	-40°C ~ 100°C (TJ)	Versal™ Prime									600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA				Versal™ Prime FPGA, 70k Logic Cells		-
XCVE1752-2LLENSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思	500	Tray	活跃	0°C ~ 100°C (TJ)	Versal™ AI Core									450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA				Versal™ AI Core FPGA, 1M Logic Cells		-
XC7Z100-1FF900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	Straight	AMD	Solder	法兰安装	RISC	1.5, 2, 2.5 V	FBGA	2	CAN/I2C/SPI/UART	130	Tray	XC7Z100	活跃	-40 to 100 °C	Zynq®-7000			Plug				900	1, 1.8 V	667MHz	256 KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32 Bit			Kintex™-7 FPGA, 444K Logic Cells	-		86.1 mm	ARM Cortex A9
XA7Z010-1CLG400I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA, CSPBGA	400-CSPBGA (17x17)	AMD	130	Tray	活跃	RISC	1.8, 3.3 V	CSBGA	1	CAN/GPIO/SPI/UART	表面贴装	-40 to 100 °C	Automotive, AEC-Q100, Zynq®-7000 XA							400	1 V	667MHz	256 KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32 Bit			Artix™-7 FPGA, 28K Logic Cells		-			ARM Cortex A9