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产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	表面安装	供应商器件包装	终端数量			Core												厂商																											操作温度	包装	系列	零件状态	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	速度	内存大小	核心处理器	周边设备	连接方式	建筑学	输入数量	座位高度-最大	可编程逻辑类型	产品类别	收发器数量
AGFB012R24C2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			744	Tray		活跃	-40°C ~ 100°C (TJ)		Agilex F																1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 1.2M Logic Elements			-
AGIB027R31B1E2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			720	Tray		活跃	0°C ~ 100°C (TJ)		Agilex I																1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 2.7M Logic Elements			-
AGFC023R25A2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			480	Tray		活跃	0°C ~ 100°C (TJ)		Agilex F																1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 2.3M Logic Elements			-
XCZU7EV-1FFVF1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD			464	Tray		XCZU7	活跃	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EV																500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 504K+ Logic Cells			-
XCZU4EV-L2SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD			252	Tray		XCZU4	活跃	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EV																533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 192K+ Logic Cells			-
XCZU4CG-2SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD			252	Tray		XCZU4	活跃	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																533MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 192K+ Logic Cells			-
XCVM1502-2LSENFVB1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1									XCVM1502
10AS048E4F29E3LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-780	YES	780	480000 LE	1	SMD/SMT	60000 LAB	965300	Intel	Intel / Altera	Arria 10 SoC		Details	2 x 32 kB	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	0.9 V	未说明	0.87 V	100 °C	有	10AS048E4F29E3LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.47		360	有		This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	0°C ~ 100°C (TJ)	Tray	Arria 10 SX	活跃	8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant	S-PBGA-B780	360	不合格		0.9 V	OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	360	3.35 mm	现场可编程门阵列	SoC FPGA	FPGA - 480K Logic Elements	480000	2 Core	--	SoC FPGA	29 mm	29 mm
XCVM1302-2HSINSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			316	Tray		活跃	-40°C ~ 100°C (TJ)		Versal™ Prime																800MHz, 1.65GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 70k Logic Cells			-
XCVM1402-2LSENSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			424	Tray		活跃	0°C ~ 100°C (TJ)		Versal™ Prime																450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.2M Logic Cells			-
XCVC1702-1LLINSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			500	Tray		活跃	-40°C ~ 100°C (TJ)		Versal™ AI Core																400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ AI Core FPGA, 1M Logic Cells			-
XCVC1702-1LSENSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			500	Tray		活跃	0°C ~ 100°C (TJ)		Versal™ AI Core																400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ AI Core FPGA, 1M Logic Cells			-
XCVM1302-2MSENSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			316	Tray		活跃	0°C ~ 100°C (TJ)		Versal™ Prime																600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 70k Logic Cells			-
XCVM1402-1LSENSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			424	Tray		活跃	0°C ~ 100°C (TJ)		Versal™ Prime																400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.2M Logic Cells			-
XCVM1302-1LLINSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			316	Tray		活跃	-40°C ~ 100°C (TJ)		Versal™ Prime																400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 70k Logic Cells			-
XCVM1402-2MLIVFVC1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD 赛灵思	748	Tray		活跃	+ 110 C	- 40 C			-40°C ~ 100°C (TJ)		Versal™ Prime													800 mV			600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.2M Logic Cells			-
XCVC1502-1LSINSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思			478	Tray		活跃	-40°C ~ 100°C (TJ)		Versal™ AI Core																400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 80k Logic Cells			-
XAZU11EG-1FFVF1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1517	1517-FCBGA (40x40)	ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2	AMD 赛灵思	Details	SMD/SMT	500 MHz, 600 MHz, 1.2 GHz	2 x 32 kB, 4 x 32 kB	2 x 32 kB, 4 x 32 kB	-	653100 LE	464 I/O	- 40 C	+ 100 C	9.1 Mbit	21.1 Mbit	37320 LAB	1	Zynq UltraScale+	活跃			This product may require additional documentation to export from the United States.	-40°C ~ 100°C (TJ)		XAZU11EG													0.85 V			500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	-	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					32 Transceiver	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells		7 Core	-
XAZU11EG-1FFVF1517Q	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1517	1517-FCBGA (40x40)	ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2	AMD 赛灵思		This product may require additional documentation to export from the United States.	+ 125 C	9.1 Mbit	21.1 Mbit	37320 LAB	1	Zynq UltraScale+	Details	SMD/SMT	500 MHz, 600 MHz, 1.2 GHz	2 x 32 kB, 4 x 32 kB	2 x 32 kB, 4 x 32 kB	-	653100 LE	464 I/O	- 40 C	Tray	活跃		-40°C ~ 125°C (TJ)		XAZU11EG													0.85 V			500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	-	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					32 Transceiver	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells		7 Core	-
XC7Z010-1CLG400C4826	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	ARM Cortex A9	2 x 32 kB	2 x 32 kB	-	28000 LE	2200 LAB	1	Zynq					667 MHz				XC7Z045																				-										2 Core
XCZU9EG-DIE4812	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2	600 MHz, 667 MHz, 1.5 GHz	SMD/SMT	This product may require additional documentation to export from the United States.	34260 LAB	183	Zynq UltraScale+						32.1 Mbit	8.8 Mbit	599500 LE	-	2 x 32 kB, 4 x 32 kB	2 x 32 kB, 4 x 32 kB			XCZU9EG																				-										7 Core
XCZU7EV-L1FFVC1156I4524	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1156	ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2	-	504000 LE	360 I/O	Zynq UltraScale+	1	28800 LAB	11 Mbit	6.2 Mbit	+ 100 C		- 40 C				SMD/SMT	600 MHz, 667 MHz, 1.5 GHz	2 x 32 kB, 4 x 32 kB	2 x 32 kB, 4 x 32 kB			XCZU7EV													720 mV/850 mV							-							20 Transceiver			7 Core
XC7Z014S-1CLG400I4873	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	ARM Cortex A9			667 MHz	32 kB	32 kB	-	65000 LE	5075 LAB	1	Zynq	SMD/SMT						XC7Z045																				-										1 Core
XC7Z020-2CLG484I4539	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	ARM Cortex A9	2 x 32 kB	2 x 32 kB	-	85000 LE	6650 LAB	1	Zynq					766 MHz				XC7Z045																				-										2 Core
XCZU2CG-L1SBVA484I4524	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-484	ARM Cortex A53, ARM Cortex R5	-	103320 LE	82 I/O	- 40 C	+ 100 C	1.2 Mbit	5.3 Mbit	5904 LAB	1		Zynq UltraScale+				SMD/SMT	600 MHz, 1.5 GHz	2 x 32 kB, 2 x 32 kB	2 x 32 kB, 2 x 32 kB			XCZU2CG													720 mV/850 mV							-										4 Core