N/A

-

YES

16

有

活跃

NXP SEMICONDUCTORS

SOP, SOP16,.4

105 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

小概要

5 V

8542.39.00.01

DUAL

鸥翼

未说明

1

1.27 mm

compliant

未说明

R-PDSO-G16

不合格

INDUSTRIAL

0.07 mA

1000 Mbps

2.65 mm

以太网收发器

1

10.3 mm

7.5 mm

N/A

-

YES

20

13 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

RECTANGULAR

SOLCC20,.14,20

HVSON

PLASTIC/EPOXY

HVSON-20

NXP SEMICONDUCTORS

活跃

有

DUAL

无铅

1

0.5 mm

compliant

R-PDSO-N20

67 mA

15000 Mbps

1 mm

AEC-Q100

CAN FD TRANSCEIVER

1

5.5 mm

3.5 mm

N/A

-

YES

32

Transferred

STANDARD MICROSYSTEMS CORP

5 X 5 MM, 0.90 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, SQFN-32

85 °C

-40 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.2 V

8542.39.00.01

QUAD

无铅

1

0.5 mm

unknown

S-XQCC-N32

INDUSTRIAL

1 mm

以太网收发器

5 mm

5 mm

N/A

-

YES

8

有

Obsolete

NXP SEMICONDUCTORS

SOIC

SOP,

1

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

5 V

e4

有

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

8542.39.00.01

DUAL

鸥翼

260

1

1.27 mm

compliant

40

8

R-PDSO-G8

不合格

1.75 mm

电路接口

4.9 mm

3.9 mm

N/A

-

YES

8

有

活跃

NXP SEMICONDUCTORS

SON

HVSON, SOLCC8,.12,25

1

150 °C

-40 °C

PLASTIC/EPOXY

HVSON

SOLCC8,.12,25

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

5 V

e4

有

镍钯金银

8542.39.00.01

DUAL

无铅

260

1

0.65 mm

compliant

30

8

S-PDSO-N8

不合格

AUTOMOTIVE

70 mA

5000000 Mbps

1 mm

AEC-Q100

CAN FD TRANSCEIVER

1

3 mm

3 mm

N/A

-

YES

8

有

Obsolete

NXP SEMICONDUCTORS

SOIC

SOP,

1

125 °C

-40 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

5 V

e4

有

镍钯金银

8542.39.00.01

DUAL

鸥翼

260

1

1.27 mm

compliant

30

8

R-PDSO-G8

不合格

AUTOMOTIVE

1.75 mm

电路接口

4.9 mm

3.9 mm

N/A

-

N/A

-

Transferred

GENERAL ELECTRIC SOLID STATE

unknown

N/A

-

YES

56

QCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER

1.8 V

Obsolete

U-BLOX AG

QCCN, LCC56,.31SQ,20

85 °C

-40 °C

PLASTIC/EPOXY

8542.39.00.01

QUAD

无铅

0.5 mm

unknown

S-PQCC-N56

不合格

INDUSTRIAL

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

YES

324

2017-10-29

BGA324(UNSPEC)

RECTANGULAR

Obsolete

INTEL CORP

LBGA-324

PLASTIC/EPOXY

8542.39.00.01

BOTTOM

BALL

1

compliant

R-PBGA-B324

pcm收发器

N/A

-

N/A

-

N/A

-

2017-10-28

Obsolete

INTEL CORP

5A991

8542.39.00.01

compliant

PCM 编解码器

N/A

-

N/A

-

YES

128

无

Transferred

NATIONAL SEMICONDUCTOR CORP

QFP-128

70 °C

PLASTIC/EPOXY

FQFP

QFP128,.67X.93,20

RECTANGULAR

FLATPACK, FINE PITCH

1.8 V

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

鸥翼

245

1

0.5 mm

not_compliant

30

R-PQFP-G128

不合格

COMMERCIAL

1000000 Mbps

3.15 mm

以太网收发器

1

3

20 mm

14 mm

N/A

-

YES

28

KGM

1210

3225

0.026 g

MLCC

有

Transferred

康讯系统

QFN

HVQCCN, LCC28,.2SQ,20

70 °C

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.3 V

SMD

ceramic

-55...125°C

±5%

e3

有

哑光锡

8542.39.00.01

150pF

QUAD

无铅

260

1

0.5 mm

compliant

30

28

S-XQCC-N28

不合格

C0G (NP0)

COMMERCIAL

56 Mbps

1 mm

MODEM-SUPPORT CIRCUIT

1

2kV

5 mm

5 mm

N/A

-

YES

16

有

Transferred

RF MICRO DEVICES INC

QFN

HQCCN, LCC16,.12SQ,20

85 °C

-40 °C

UNSPECIFIED

HQCCN

LCC16,.12SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

3.3 V

5A991.G

8517.62.00.50

QUAD

无铅

1

0.5 mm

unknown

16

S-XQCC-N16

不合格

INDUSTRIAL

0.23 mA

1.05 mm

电信电路

3 mm

3 mm