类别是'category.电信接口IC' (8324)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 应用 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 电源电流-最大值 | 座位高度-最大 | 通信IC类型 | 收发器数量 | 过滤器 | 压缩法 | 负电源电压 | 增益公差-最大 | 线性编码 | 电池供电 | PSRR-Min | 混合动力车 | 电池供电 | 马克斯噪音 | 晶振频率 | 突破比率 | 《汇编》 | 长度 | 宽度 | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | LAN9311-NZW-TR | SMSC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 128 | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 3.3 V | Transferred | STANDARD MICROSYSTEMS CORP | TFQFP, | 70 °C | PLASTIC/EPOXY | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.4 mm | unknown | S-PQFP-G128 | COMMERCIAL | 1.2 mm | LAN 交换电路 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||
![]() | W91F820AN | Winbond Electronics Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 22 | Obsolete | WINBOND ELECTRONICS CORP | DIP | DIP, DIP22(UNSPEC) | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP22(UNSPEC) | RECTANGULAR | IN-LINE | 2.5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | not_compliant | 22 | R-PDIP-T22 | 不合格 | COMMERCIAL | 0.0006 mA | 电话拨号电路 | 3.58 MHz | 2:3 | REPERTORY | |||||||||||||||||||||||
![]() | OQ2541HPB-S | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AM7943-1JC | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | ADVANCED MICRO DEVICES INC | QFJ | QCCJ, LDCC32,.5X.6 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | 5 V | 无 | Transferred | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | 不合格 | COMMERCIAL | 8.5 mA | 3.556 mm | SLIC | -5 V | CONSTANT CURRENT | 30 dB | 2-4 CONVERSION | -19 TO -56.5 V | 10 dBrnC | 13.97 mm | 11.43 mm | |||||||||||||||||
![]() | TISP61CAP3P | JW Miller | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | RECTANGULAR | IN-LINE | Transferred | POWER INNOVATIONS LTD | DIP | DIP, | PLASTIC/EPOXY | DIP | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 8 | R-PDIP-T8 | 不合格 | 5.08 mm | 浪涌保护电路 | 7.62 mm | ||||||||||||||||||||||||||||||||
![]() | RFFC5071SQ | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | RF MICRO DEVICES INC | QFN | HVQCCN, | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | 有 | Transferred | 有 | 5A991.G | 8517.70.00.00 | QUAD | 无铅 | 未说明 | 1 | 0.5 mm | compliant | 未说明 | 32 | S-XQCC-N32 | 不合格 | INDUSTRIAL | 0.95 mm | 电信电路 | 5 mm | 5 mm | ||||||||||||||||||||||
![]() | RFG1M20090 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 2 | , | 85 °C | -25 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | FLANGE MOUNT | 有 | Transferred | RF MICRO DEVICES INC | DFM | 有 | 8542.39.00.01 | DUAL | FLAT | 未说明 | 1 | compliant | 未说明 | 2 | R-CDFM-F2 | 不合格 | OTHER | 电信电路 | |||||||||||||||||||||||||||||
![]() | FX-500-LAC-GNJ-A3-E7 | Vectron International | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 6 | PACKAGE-6 | 1 | 70 °C | PLASTIC/EPOXY | SOJ | RECTANGULAR | 小概要 | 3.3 V | 有 | Transferred | VECTRON INTERNATIONAL | e4 | 有 | 镍金 | 8542.39.00.01 | DUAL | J BEND | 260 | 1 | 2.54 mm | compliant | 30 | R-PDSO-J6 | COMMERCIAL | 4.69 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 13.97 mm | 8.89 mm | ||||||||||||||||||||||||
![]() | HM9113A | Hualon Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 接触制造商 | HUALON MICROELECTRONICS CORP | , | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RCV56ACF/SP | Rockwell Automation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | QET-5100M-0-LGA78B-TR-03-0 | Qualcomm | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 接触制造商 | QUALCOMM | unknown | 电信电路 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX613DW | CML Microcircuits Plc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | SOIC | SOP, SOP16,.4 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | 小概要 | 3.3 V | Obsolete | CML MICROCIRCUITS LTD | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 16 | R-PDSO-G16 | 不合格 | INDUSTRIAL | 1 mA | 2.67 mm | 音调解码电路 | 10.26 mm | 7.425 mm | |||||||||||||||||||||||||
![]() | 88E3018-XX-NNC1I000 | Marvell Technology Group Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | MARVELL SEMICONDUCTOR INC | HVQCCN, LCC64,.35SQ,20 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 2.5 V | 有 | 活跃 | 有 | 8542.39.00.01 | QUAD | 无铅 | 未说明 | 1 | 0.5 mm | compliant | 未说明 | S-XQCC-N64 | 不合格 | INDUSTRIAL | 1 mm | 以太网收发器 | 1 | 9 mm | 9 mm | |||||||||||||||||||||||
![]() | BCM957608-P1400GDF00 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M5917 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | DIP-16 | 70 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | STMICROELECTRONICS | e0 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | R-PDIP-T16 | 不合格 | COMMERCIAL | 0.01 mA | PCM 编解码器 | NO | A-LAW | -5 V | 0.125 dB | 不提供 | |||||||||||||||||||||||
![]() | ML4667CQ | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | MICRO LINEAR CORP | QLCC | QCCJ, LDCC28,.5SQ | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | 5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | unknown | 28 | S-PQCC-J28 | 不合格 | COMMERCIAL | 120 mA | 4.57 mm | 以太网收发器 | 1 | 11.505 mm | 11.505 mm | ||||||||||||||||||||||
![]() | HM9114C | Hualon Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 接触制造商 | HUALON MICROELECTRONICS CORP | , | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TEA1067T/C2 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | SOP, | 75 °C | -25 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 2.8 V | Obsolete | NXP SEMICONDUCTORS | SOIC | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 20 | R-PDSO-G20 | 不合格 | 商业扩展 | 2.65 mm | 电话语音电路 | 12.8 mm | 7.5 mm | |||||||||||||||||||||||||||
![]() | PEB2086HV1.4D | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HI-1568CDI | Holt Integrated Circuits Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 20 | HOLT INTEGRATED CIRCUITS INC | DIP | DIP, | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | 5 V | 有 | 活跃 | e4 | 无 | GOLD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2 | 2.54 mm | compliant | 20 | R-CDIP-T20 | 不合格 | INDUSTRIAL | 5.08 mm | MIL-STD-1553 DATA BUS TRANSCEIVER | 25.4 mm | 7.62 mm | |||||||||||||||||||||||
![]() | W6810SG | Nuvoton Technology Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | NUVOTON TECHNOLOGY CORP | SOP, SOP20,.4 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | 小概要 | 5 V | 有 | 活跃 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | R-PDSO-G20 | 不合格 | INDUSTRIAL | 8 mA | PCM 编解码器 | YES | A/MU-LAW | 1.6 dB | ||||||||||||||||||||||||||
![]() | TDK5110 | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | 有 | Obsolete | INFINEON TECHNOLOGIES AG | TSSOP | TSSOP, TSSOP16,.25 | 3 | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3 V | e3 | 有 | TIN | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 16 | R-PDSO-G16 | 不合格 | AUTOMOTIVE | 0.019 mA | 1.2 mm | 电信电路 | 5 mm | 4.4 mm | |||||||||||||||||||
![]() | 7289-9710-30 | Yazaki Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MAX3873EGP | Maxim Integrated Products | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | 3.3 V | CHIP CARRIER, VERY THIN PROFILE | SQUARE | LCC20,.16SQ,20 | VQCCN | CERAMIC, METAL-SEALED COFIRED | -40 °C | 85 °C | 1 | 4 X 4 MM, 0.90 MM HEIGHT, EXPOSED PAD, QFN-20 | QFN | MAXIM INTEGRATED PRODUCTS INC | Obsolete | 无 | e0 | 无 | EAR99 | 锡铅 | SDH; SONET | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | not_compliant | 20 | S-CQCC-N20 | 不合格 | INDUSTRIAL | 1 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 4 mm | 4 mm | |||||||||||||||||||
![]() | PT8A991AP | Diodes Incorporated | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | PLASTIC/EPOXY | DIP | DIP24(UNSPEC) | RECTANGULAR | IN-LINE | 4 V | Obsolete | DIODES INC | DIP, DIP24(UNSPEC) | 70 °C | EAR99 | 8542.39.00.01 | DUAL | THROUGH-HOLE | compliant | R-PDIP-T24 | 不合格 | COMMERCIAL | 电信电路 |
LAN9311-NZW-TR
SMSC
分类:Interface - Telecom
W91F820AN
Winbond Electronics Corp
分类:Interface - Telecom
OQ2541HPB-S
Philips Semiconductors
分类:Interface - Telecom
AM7943-1JC
AMD
分类:Interface - Telecom
TISP61CAP3P
JW Miller
分类:Interface - Telecom
RFFC5071SQ
RF Micro Devices Inc
分类:Interface - Telecom
RFG1M20090
RF Micro Devices Inc
分类:Interface - Telecom
FX-500-LAC-GNJ-A3-E7
Vectron International
分类:Interface - Telecom
HM9113A
Hualon Microelectronics Corp
分类:Interface - Telecom
RCV56ACF/SP
Rockwell Automation
分类:Interface - Telecom
QET-5100M-0-LGA78B-TR-03-0
Qualcomm
分类:Interface - Telecom
MX613DW
CML Microcircuits Plc
分类:Interface - Telecom
88E3018-XX-NNC1I000
Marvell Technology Group Ltd
分类:Interface - Telecom
BCM957608-P1400GDF00
Broadcom Limited
分类:Interface - Telecom
M5917
STMicroelectronics
分类:Interface - Telecom
ML4667CQ
RF Micro Devices Inc
分类:Interface - Telecom
HM9114C
Hualon Microelectronics Corp
分类:Interface - Telecom
TEA1067T/C2
NXP Semiconductors
分类:Interface - Telecom
PEB2086HV1.4D
Infineon Technologies AG
分类:Interface - Telecom
HI-1568CDI
Holt Integrated Circuits Inc
分类:Interface - Telecom
W6810SG
Nuvoton Technology Corp
分类:Interface - Telecom
TDK5110
Infineon Technologies AG
分类:Interface - Telecom
7289-9710-30
Yazaki Corp
分类:Interface - Telecom
MAX3873EGP
Maxim Integrated Products
分类:Interface - Telecom
PT8A991AP
Diodes Incorporated
分类:Interface - Telecom
