类别是'category.电信接口IC' (8324)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | Contact plating | 表面安装 | Number of pins | 终端数量 | Connector pinout layout | Contacts pitch | Date Of Intro | Electrical mounting | Gross weight | Kind of connector | Row pitch | Spatial orientation | Type of connector | Operating temperature | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | Current rating | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 筛选水平 | 通信IC类型 | 收发器数量 | Rated voltage | 个人资料 | 饱和电流 | 负电源电压 | 运输载体类型 | 长度 | 宽度 | Plating thickness | Flammability rating | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | TJA1042TK/3 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 5 V | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SQUARE | SOLCC8,.12,25 | HVSON | PLASTIC/EPOXY | -40 °C | 150 °C | HVSON, SOLCC8,.12,25 | SON | NXP SEMICONDUCTORS | 活跃 | 有 | e4 | 有 | 镍钯金银 | 8542.39.00.01 | DUAL | 无铅 | 260 | 1 | 0.65 mm | compliant | 30 | 8 | S-PDSO-N8 | 不合格 | AUTOMOTIVE | 70 mA | 5000000 Mbps | 1 mm | AEC-Q100 | CAN FD TRANSCEIVER | 1 | 1 | 3 mm | 3 mm | |||||||||||||||||||||||||
![]() | TJA1048TK | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 14 | 不推荐 | NXP SEMICONDUCTORS | SON | VSON-14 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | 有 | 8542.39.00.01 | DUAL | 无铅 | 260 | 1 | 0.65 mm | compliant | 30 | 14 | R-PDSO-N14 | 不合格 | 1 mm | 电路接口 | 1 | 4.5 mm | 3 mm | ||||||||||||||||||||||||||||||||||||
![]() | TJA1028TK/3V3/10 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | NXP SEMICONDUCTORS | SON | HVSON, | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 活跃 | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.65 mm | unknown | 8 | S-PDSO-N8 | 1 mm | MIL-STD-1553 DATA BUS TRANSCEIVER | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | TJA1028TK/5V0/20 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | NXP SEMICONDUCTORS | SON | HVSON, | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | 活跃 | 8542.39.00.01 | DUAL | 无铅 | 260 | 1 | 0.65 mm | unknown | 30 | 8 | S-PDSO-N8 | 1 mm | MIL-STD-1553 DATA BUS TRANSCEIVER | 1 | 3 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||
![]() | SKY53730-11 | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 56 | 2020-07-02 | SKYWORKS SOLUTIONS INC | , | 85 °C | -30 °C | RECTANGULAR | 1.2 V | 活跃 | 8542.39.00.01 | 260 | 1 | unknown | 射频和基带电路 | 3 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TLE9350SJ | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | INFINEON TECHNOLOGIES AG | 有 | 活跃 | NICKEL GOLD PALLADIUM | compliant | CAN FD TRANSCEIVER | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TLE9351VSJ | Infineon Technologies AG | 数据表 | 50 In Stock |
- | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 6 | 8 | 2x3 | 2.54mm | THT | 0.22 g | 有 | female | 活跃 | INFINEON TECHNOLOGIES AG | SOP-8 | 150 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 3.3 V | socket | 2.54mm | straight | pin strips | -40...163°C | NICKEL GOLD PALLADIUM | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | 1.5A | R-PDSO-G8 | 48 mA | 5000 Mbps | 1.73 mm | AEC-Q100 | CAN FD TRANSCEIVER | 1 | 60V | beryllium copper | 1 | 4.93 mm | 3.94 mm | 0.254µm | UL94V-0 | |||||||||||||||||
![]() | TJA1100HN | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 13 | 36 | 1x13 | 2.54mm | THT | 0.49 g | 有 | female | 不推荐 | NXP SEMICONDUCTORS | HVQFN-36 | 125 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | LCC36,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.8 V | socket | straight | pin strips | -40...163°C | 3.3V NOMINAL SUPPLY ALSO AVAILABLE | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 0.5 mm | compliant | 1.5A | 30 | S-PQCC-N36 | AUTOMOTIVE | 27 mA | 100000 Mbps | 1 mm | AEC-Q100 | 以太网收发器 | 1 | 60V | beryllium copper | 1 | 6 mm | 6 mm | 0.254µm | UL94V-0 | ||||||||||||||
![]() | TJA1028T/3V3/20 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 7 | 8 | 1x7 | 2.54mm | THT | 0.53 g | female | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 3.3 V | socket | 活跃 | NXP SEMICONDUCTORS | SOIC | straight | SOP, | pin strips | -40...163°C | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 1.5A | 8 | R-PDSO-G8 | 不合格 | 1.75 mm | MIL-STD-1553 DATA BUS TRANSCEIVER | 60V | beryllium copper | 4.9 mm | 3.9 mm | 0.75µm | UL94V-0 | ||||||||||||||||||||||||
![]() | SKY58255-11 | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 30 | 42 | 2x15 | 2.54mm | 2019-10-31 | THT | 1.05 g | female | -20 °C | HVQCCN | LCC42,.17X.21,16 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.2 V | socket | 有 | 活跃 | SKYWORKS SOLUTIONS INC | 2.54mm | straight | 85 °C | pin strips | -40...163°C | 8542.39.00.01 | QUAD | 无铅 | 未说明 | 1 | 0.4 mm | unknown | 1.5A | 未说明 | R-XQCC-N42 | 0.7 mm | 射频和基带电路 | 60V | beryllium copper | 5.5 mm | 4.5 mm | 0.254µm | UL94V-0 | |||||||||||||||||||||
![]() | PN5321A3HN/C106 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 10 | 40 | 2x5 | 2.54mm | THT | 0.35 g | female | QFN | HVQCCN, | 85 °C | -30 °C | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | socket | 活跃 | 2.54mm | straight | NXP SEMICONDUCTORS | pin strips | -40...163°C | e4 | EAR99 | 镍钯金 | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 0.5 mm | unknown | 1.5A | 30 | 40 | S-PQCC-N40 | OTHER | 1 mm | 电信电路 | 60V | beryllium copper | 2 | 6 mm | 6 mm | 0.254µm | UL94V-0 | ||||||||||||||||
![]() | RFFM6907 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 31 | 28 | 1x31 | 2.54mm | THT | 1.49 g | female | 70 °C | -30 °C | UNSPECIFIED | HLGA | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG | 3.6 V | socket | Transferred | RF MICRO DEVICES INC | straight | HLGA, | pin strips | -40...163°C | 8542.39.00.01 | BOTTOM | BUTT | 1 | unknown | 1.5A | R-XBGA-B28 | OTHER | 1.215 mm | 电信电路 | 60V | beryllium copper | 5.5 mm | 5 mm | 0.254µm | UL94V-0 | |||||||||||||||||||||||||
![]() | TFF11092HN | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | NXP SEMICONDUCTORS | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-1, HVQFN-24 | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | Obsolete | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | unknown | S-PQCC-N24 | INDUSTRIAL | 1 mm | 电信电路 | 4 mm | 4 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | XR1020-QH-TR1 | MACOM | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SE5010L | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | UNSPECIFIED | -40 °C | 85 °C | HVQCCN, | SKYWORKS SOLUTIONS INC | 活跃 | HVQCCN | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | unknown | S-XQCC-N16 | INDUSTRIAL | 0.9 mm | 射频和基带电路 | 3 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | HA16811AMP | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | RENESAS TECHNOLOGY CORP | QFI | QFI, | 70 °C | PLASTIC/EPOXY | QFI | RECTANGULAR | FLATPACK | 5 V | Transferred | 8542.39.00.01 | QUAD | BUTT | 1 | 1.016 mm | unknown | 44 | R-PQFP-B44 | 不合格 | COMMERCIAL | 2.92 mm | SLIC | -5 V | 14.42 mm | 11.88 mm | |||||||||||||||||||||||||||||||||||||
![]() | BCM5770 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | 活跃 | BROADCOM INC | BGA | PLASTIC, BGA-324 | 1 | PLASTIC/EPOXY | BGA | 网格排列 | 无 | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 324 | X-PBGA-B324 | 不合格 | 电信电路 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | SIM28M | SIMCom | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TDA18275AHN/C1 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RF5365TR7 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 12 | RF MICRO DEVICES INC | QFN | VQCCN, | 85 °C | -40 °C | PLASTIC/EPOXY | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | 3.3 V | Transferred | 5A991.G | 8517.70.00.00 | QUAD | 无铅 | 1 | 0.5 mm | unknown | 12 | S-PQCC-N12 | INDUSTRIAL | 0.5 mm | 射频和基带电路 | 2.5 mm | 2.5 mm | |||||||||||||||||||||||||||||||||||||
![]() | PBL38620/1 | Ericsson | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TISPPBL1SE | Power Innovations International, Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 4 | POWER INNOVATIONS LTD | SIP, | 85 °C | -40 °C | PLASTIC/EPOXY | SIP | RECTANGULAR | IN-LINE | Transferred | 8542.39.00.01 | SINGLE | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PSIP-T4 | 不合格 | INDUSTRIAL | 10 mm | 浪涌保护电路 | ||||||||||||||||||||||||||||||||||||||||||
![]() | MJ1440 | Dynex Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | Obsolete | GEC PLESSEY SEMICONDUCTORS | DIP, DIP16,.3 | 70 °C | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 5 V | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T16 | 不合格 | COMMERCIAL | 0.05 mA | 2048 Mbps | CEPT PCM-30/E-1 | ||||||||||||||||||||||||||||||||||||||
![]() | RS9113-NB0-D1W-X78 | Silicon Laboratories Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 79 | SILICON LABORATORIES INC | MODULE-79 | 85 °C | -40 °C | UNSPECIFIED | XMA | RECTANGULAR | 微电子组件 | 3.3 V | Obsolete | ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C | UNSPECIFIED | 无铅 | 1 | unknown | R-XXMA-N79 | INDUSTRIAL | 54000 Mbps | 3.3 mm | 电信电路 | 27 mm | 16 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | SI3210-X-FMR | Silicon Laboratories Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 38 | Obsolete | SILICON LABORATORIES INC | QFN | HVQCCN, | 70 °C | UNSPECIFIED | HVQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 有 | 有 | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 0.5 mm | unknown | 40 | 38 | R-XQCC-N38 | 不合格 | COMMERCIAL | 0.95 mm | SLIC | 7 mm | 5 mm |
TJA1042TK/3
NXP Semiconductors
分类:Interface - Telecom
TJA1048TK
NXP Semiconductors
分类:Interface - Telecom
TJA1028TK/3V3/10
NXP Semiconductors
分类:Interface - Telecom
TJA1028TK/5V0/20
NXP Semiconductors
分类:Interface - Telecom
SKY53730-11
Skyworks Solutions Inc
分类:Interface - Telecom
TLE9350SJ
Infineon Technologies AG
分类:Interface - Telecom
TLE9351VSJ
Infineon Technologies AG
分类:Interface - Telecom
5.043830
TJA1100HN
NXP Semiconductors
分类:Interface - Telecom
TJA1028T/3V3/20
NXP Semiconductors
分类:Interface - Telecom
SKY58255-11
Skyworks Solutions Inc
分类:Interface - Telecom
PN5321A3HN/C106
NXP Semiconductors
分类:Interface - Telecom
RFFM6907
RF Micro Devices Inc
分类:Interface - Telecom
TFF11092HN
NXP Semiconductors
分类:Interface - Telecom
XR1020-QH-TR1
MACOM
分类:Interface - Telecom
SE5010L
Skyworks Solutions Inc
分类:Interface - Telecom
HA16811AMP
Renesas Electronics Corporation
分类:Interface - Telecom
BCM5770
Broadcom Limited
分类:Interface - Telecom
SIM28M
SIMCom
分类:Interface - Telecom
TDA18275AHN/C1
NXP Semiconductors
分类:Interface - Telecom
RF5365TR7
RF Micro Devices Inc
分类:Interface - Telecom
PBL38620/1
Ericsson
分类:Interface - Telecom
TISPPBL1SE
Power Innovations International, Inc.
分类:Interface - Telecom
MJ1440
Dynex Semiconductor
分类:Interface - Telecom
RS9113-NB0-D1W-X78
Silicon Laboratories Inc
分类:Interface - Telecom
SI3210-X-FMR
Silicon Laboratories Inc
分类:Interface - Telecom
