RF Micro Devices Inc RFFM6907

表面安装

YES

Contact plating

gold-plated

Number of pins

31

终端数量

28

Part Life Cycle Code

Transferred

Ihs Manufacturer

RF MICRO DEVICES INC

Package Description

HLGA,

Operating Temperature-Max

70 °C

Operating Temperature-Min

-30 °C

Package Body Material

UNSPECIFIED

Package Code

HLGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, HEAT SINK/SLUG

Supply Voltage-Nom

3.6 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x31

Gross weight

1.49 g

Operating temperature

-40...163°C

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BUTT

功能数量

1

Reach合规守则

unknown

Current rating

1.5A

JESD-30代码

R-XBGA-B28

温度等级

OTHER

座位高度-最大

1.215 mm

通信IC类型

电信电路

Rated voltage

60V

个人资料

beryllium copper

长度

5.5 mm

宽度

5 mm

Plating thickness

0.254µm

Flammability rating

UL94V-0