category.内存卡和模块_category.内存卡和模块品牌厂家，型号_价格_规格

类别是'category.专用模块' (1062)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量																		JESD-609代码	无铅代码	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	功能数量	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	电源电压-最大值(Vsup)	温度等级	电源电压-最小值(Vsup)	操作模式	电源电流-最大值	组织结构	座位高度-最大	内存宽度	待机电流-最大值	记忆密度	内存IC类型	混合内存类型	长度
TMS4C2973-26DT	Texas Instruments	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	36	70 °C	PLASTIC/EPOXY	SSOP	SOP36,.47,40	RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	3.3 V	无	Obsolete	TEXAS INSTRUMENTS INC	SSOP, SOP36,.47,40	21 ns			EAR99			8542.32.00.71	DUAL	鸥翼			1 mm	not_compliant			R-PDSO-G36	不合格		COMMERCIAL			0.05 mA				0.01 A
M4-4111S-Z3	Moujen Switch	数据表	N/A	-	最小起订量: 1 最小包装量: 1
NAND98R3M2AZBB5E	Micron Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	107	-30 °C	PLASTIC/EPOXY	FBGA	BGA107,10X14,32	RECTANGULAR	GRID ARRAY, FINE PITCH	1.8 V	有	Obsolete	MICRON TECHNOLOGY INC	FBGA, BGA107,10X14,32	85 °C			EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	compliant			R-PBGA-B107	不合格		OTHER									存储器电路	FLASH+SDRAM
PF38F5070M0Y0V0	Micron Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	165	FBGA	BGA165,12X15,25	RECTANGULAR	GRID ARRAY, FINE PITCH	1.8 V	有	Obsolete	MICRON TECHNOLOGY INC	FBGA, BGA165,12X15,25	96 ns	PLASTIC/EPOXY			EAR99			8542.32.00.71	BOTTOM	BALL			0.635 mm	compliant			R-PBGA-B165	不合格									0.00016 A		存储器电路	FLASH+PSRAM
RD38F3352LLZDQ0	Micron Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88	FBGA	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, FINE PITCH	1.8 V	无	Obsolete	MICRON TECHNOLOGY INC	FBGA, BGA88,8X12,32	88 ns	PLASTIC/EPOXY			EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	unknown			R-PBGA-B88	不合格					0.035 mA						存储器电路	FLASH+PSRAM
RD38F3352LLZDQ0	Numonyx Memory Solutions	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88	FBGA	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, FINE PITCH	1.8 V	无	Transferred	NUMONYX	FBGA, BGA88,8X12,32	88 ns	PLASTIC/EPOXY			EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	unknown			R-PBGA-B88	不合格					0.035 mA						存储器电路	FLASH+PSRAM
TH50VSF0302BCXB	Toshiba America Electronic Components	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48	85 °C	-20 °C	PLASTIC/EPOXY	BGA	BGA48,6X8,40	RECTANGULAR	网格排列	无	Transferred	TOSHIBA CORP	BGA, BGA48,6X8,40	100 ns	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	BOTTOM	BALL			1 mm	unknown			R-PBGA-B48	不合格		OTHER			0.04 mA				0.00003 A		存储器电路	FLASH+SRAM
S71GL032NA0BFW0Z0	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	56	SPANSION INC	BGA	7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56	3	2097152 words	2000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	3 V	有	Obsolete	e1		EAR99	锡银铜	PSRAM IS ORGANIZED AS 1M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown	40	56	R-PBGA-B56	不合格	3.1 V	OTHER	2.7 V	ASYNCHRONOUS		2MX16	1.2 mm	16		33554432 bit	存储器电路		9 mm	7 mm
MC2210310-020-C	ATGBICS	数据表	N/A	-	最小起订量: 1 最小包装量: 1
S71JL064HA0BAW110	AMD	数据表	642 In Stock	-	最小起订量: 1 最小包装量: 1	YES	73	Transferred	ADVANCED MICRO DEVICES INC	BGA	LFBGA, BGA73,10X12,32	70 ns	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	BGA73,10X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V	有			EAR99		PSRAM IS ORGANIZED AS 1M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8	8542.32.00.71	BOTTOM	BALL	未说明	1	0.8 mm	compliant	未说明	73	R-PBGA-B73	不合格	3.3 V	OTHER	2.7 V	ASYNCHRONOUS	0.045 mA	4MX16	1.4 mm	16		67108864 bit	存储器电路	FLASH+PSRAM	11.6 mm	8 mm
S71JL064HA0BAW110	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	73	SPANSION INC	BGA	LFBGA,	3	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V	无	Obsolete	e0		EAR99	锡铅	PSEUDO STATIC RAM IS ORGANIZED AS 1M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		73	R-PBGA-B73	不合格	3.3 V	OTHER	2.7 V	ASYNCHRONOUS		4MX16	1.4 mm	16		67108864 bit	存储器电路		11.6 mm	8 mm
MC2210310-015-C	ATGBICS	数据表	N/A	-	最小起订量: 1 最小包装量: 1
S71PL129JC0BFW9U0	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	64	85 °C	-25 °C	PLASTIC/EPOXY	FBGA	BGA64,10X12,32	RECTANGULAR	GRID ARRAY, FINE PITCH	有	活跃	ADVANCED MICRO DEVICES INC	FBGA, BGA64,10X12,32	70 ns			EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	compliant			R-PBGA-B64	不合格		OTHER			0.07 mA				0.000005 A		存储器电路	FLASH+PSRAM
S71NS256PB0ZJETV2	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1		有	Transferred	SPANSION INC	,				EAR99			8542.32.00.71			260			unknown	40
NAND99W3M1BZBC5E	Numonyx Memory Solutions	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	137	FBGA, BGA137,10X15,32	85 °C	-30 °C	PLASTIC/EPOXY	FBGA	BGA137,10X15,32	RECTANGULAR	网格排列	3 V	有	Obsolete	NUMONYX	BGA		有	EAR99			8542.32.00.71	BOTTOM	BALL	未说明		0.8 mm	unknown	未说明	137	R-PBGA-B137	不合格		OTHER									存储器电路	FLASH+SDRAM
S71JL064HA0BAW01	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	73	ADVANCED MICRO DEVICES INC	LFBGA, BGA73,10X12,32	70 ns	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	BGA73,10X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V	有	Obsolete			EAR99		SRAM IS ORGANISED AS 1KX16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant			R-PBGA-B73	不合格	3.3 V	OTHER	2.7 V	ASYNCHRONOUS		4MX16	1.4 mm	16		67108864 bit	存储器电路	FLASH+SRAM	11.6 mm	8 mm
MC-222253AF9-B85X-BT3	NEC Electronics America Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	77	2000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	无	Obsolete	NEC ELECTRONICS AMERICA INC	12 X 7 MM, FBGA-77	2097152 words	e0		EAR99	锡铅	SRAM IS ORGANISED AS 256 X 16 OR 512K X 8 AND FLASH CAN ALSO BE ORGANISED AS 4M X 8	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant			R-PBGA-B77	不合格	3.6 V	OTHER	2.7 V	ASYNCHRONOUS		2MX16	1.2 mm	16		33554432 bit	存储器电路		12 mm	7 mm
MC2210310-030-C	ATGBICS	数据表	N/A	-	最小起订量: 1 最小包装量: 1
MC-242453F9-B10-BT3	Renesas Electronics Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	77	PLASTIC/EPOXY	FBGA	BGA77,8X14,32	RECTANGULAR	GRID ARRAY, FINE PITCH	Obsolete	RENESAS ELECTRONICS CORP	FBGA, BGA77,8X14,32	100 ns	70 °C	-20 °C			EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	unknown			R-PBGA-B77	不合格		COMMERCIAL			0.045 mA				0.00001 A		存储器电路	FLASH+SRAM
SST34HF324G-70-4E-L3KE	Silicon Storage Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48	2097152 words	2000000	85 °C	-20 °C	PLASTIC/EPOXY	LFBGA	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V	Obsolete	SILICON STORAGE TECHNOLOGY INC	BGA	LFBGA,			EAR99		SRAM IS ORGANISED AS 256K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown		48	R-PBGA-B48	不合格	3.3 V	OTHER	2.7 V	ASYNCHRONOUS		2MX16	1.4 mm	16		33554432 bit	存储器电路		8 mm	6 mm
SST34HF324G-70-4E-L3KE	Greenliant Systems Ltd	数据表	N/A	-	最小起订量: 1 最小包装量: 1	,			Obsolete	GREENLIANT SYSTEMS LTD			EAR99			8542.32.00.71						compliant
AM27C2048-150PC	Cypress Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	CYPRESS SEMICONDUCTOR CORP			活跃												compliant
TMS4C1060-30SD	Texas Instruments	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	20	70 °C	PLASTIC/EPOXY	ZIP	ZIP20,.1	RECTANGULAR	IN-LINE	5 V	无	Obsolete	TEXAS INSTRUMENTS INC	ZIP, ZIP20,.1	25 ns			EAR99			8542.32.00.71	ZIG-ZAG	THROUGH-HOLE	未说明		1.27 mm	not_compliant	未说明		R-PZIP-T20	不合格		COMMERCIAL			0.05 mA				0.01 A		存储器电路
SN74LS189N	Motorola Mobility LLC	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	16	PLASTIC/EPOXY	DIP	RECTANGULAR	IN-LINE	5 V	Obsolete	MOTOROLA INC	DIP	DIP,	16 words	16	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	THROUGH-HOLE		1		unknown		16	R-PDIP-T16	不合格				ASYNCHRONOUS		16X4		4		64 bit	存储器电路
RD28F3208C3T70	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	66	Obsolete	INTEL CORP	BGA	LFBGA, BGA68,8X12,32	70 ns	2097152 words	2000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	BGA68,8X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V	无			EAR99		SRAM IS ORGANIZED AS 512K X 16	8542.32.00.71	BOTTOM	BALL	240	1	0.8 mm	compliant	30	66	R-PBGA-B66	不合格	3.3 V	商业扩展	2.7 V	ASYNCHRONOUS	0.055 mA	2MX16	1.4 mm	16	0.000006 A	33554432 bit	存储器电路	FLASH+SRAM	10 mm	8 mm