AMD S71PL129JC0BFW9U0

表面安装

YES

终端数量

64

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Description

FBGA, BGA64,10X12,32

Access Time-Max

70 ns

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA64,10X12,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

ECCN 代码

EAR99

HTS代码

8542.32.00.71

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B64

资历状况

不合格

温度等级

OTHER

电源电流-最大值

0.07 mA

待机电流-最大值

0.000005 A

内存IC类型

存储器电路

混合内存类型

FLASH+PSRAM