类别是'category.电信接口IC' (8324)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 通信IC类型 | 负电源电压 | 电池供电 | PSRR-Min | 混合动力车 | 电池供电 | 马克斯噪音 | 晶振频率 | 传真率 | 长度 | 宽度 | |||||||||||||||
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![]() | ZL70123MNG7 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 29 | RECTANGULAR | 网格排列 | 3.3 V | Transferred | MICROSEMI CORP | LGA, | 55 °C | UNSPECIFIED | LGA | 8542.39.00.01 | BOTTOM | BUTT | 1 | compliant | R-XBGA-B29 | COMMERCIAL | 2.95 mm | 射频和基带电路 | 18 mm | 12 mm | |||||||||||||||||||||||||||
![]() | OQ2541HPB-S | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AM7943-1JC | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | QFJ | QCCJ, LDCC32,.5X.6 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | 5 V | 无 | Transferred | ADVANCED MICRO DEVICES INC | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | 不合格 | COMMERCIAL | 8.5 mA | 3.556 mm | SLIC | -5 V | CONSTANT CURRENT | 30 dB | 2-4 CONVERSION | -19 TO -56.5 V | 10 dBrnC | 13.97 mm | 11.43 mm | ||||||||||||
![]() | TISP61CAP3P | JW Miller | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | IN-LINE | Transferred | POWER INNOVATIONS LTD | DIP | DIP, | PLASTIC/EPOXY | DIP | RECTANGULAR | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 8 | R-PDIP-T8 | 不合格 | 5.08 mm | 浪涌保护电路 | 7.62 mm | |||||||||||||||||||||||||||
![]() | RFFC5071SQ | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | QFN | HVQCCN, | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | 有 | Transferred | RF MICRO DEVICES INC | 有 | 5A991.G | 8517.70.00.00 | QUAD | 无铅 | 未说明 | 1 | 0.5 mm | compliant | 未说明 | 32 | S-XQCC-N32 | 不合格 | INDUSTRIAL | 0.95 mm | 电信电路 | 5 mm | 5 mm | |||||||||||||||||
![]() | RFG1M20090 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 2 | 85 °C | -25 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | FLANGE MOUNT | 有 | Transferred | RF MICRO DEVICES INC | DFM | , | 有 | 8542.39.00.01 | DUAL | FLAT | 未说明 | 1 | compliant | 未说明 | 2 | R-CDFM-F2 | 不合格 | OTHER | 电信电路 | ||||||||||||||||||||||||
![]() | FX-500-LAC-GNJ-A3-E7 | Vectron International | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 6 | 1 | 70 °C | PLASTIC/EPOXY | SOJ | RECTANGULAR | 小概要 | 3.3 V | 有 | Transferred | VECTRON INTERNATIONAL | PACKAGE-6 | e4 | 有 | 镍金 | 8542.39.00.01 | DUAL | J BEND | 260 | 1 | 2.54 mm | compliant | 30 | R-PDSO-J6 | COMMERCIAL | 4.69 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 13.97 mm | 8.89 mm | |||||||||||||||||||
![]() | HM9113A | Hualon Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 接触制造商 | HUALON MICROELECTRONICS CORP | , | unknown | |||||||||||||||||||||||||||||||||||||||||||||
![]() | RCV56ACF/SP | Rockwell Automation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | QET-5100M-0-LGA78B-TR-03-0 | Qualcomm | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 接触制造商 | QUALCOMM | unknown | 电信电路 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT82V3355TF | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 3.3 V | QFP | INTEGRATED DEVICE TECHNOLOGY INC | Obsolete | 无 | LFQFP, | 3 | e0 | 无 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.5 mm | compliant | 64 | S-PQFP-G64 | 不合格 | INDUSTRIAL | 1.4 mm | 电信电路 | 10 mm | 10 mm | |||||||||||||||||
![]() | SY8702AABC | Silergy Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SA1620BE | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | QFP, QFP48,.35SQ,20 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP48,.35SQ,20 | SQUARE | FLATPACK | 3 V | 无 | Transferred | 飞利浦半导体 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G48 | 不合格 | INDUSTRIAL | |||||||||||||||||||||||||
![]() | BCM3022KPF | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RFX96V12 | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | QFP | QFP, LDCC68,1.0SQ | 70 °C | PLASTIC/EPOXY | QFP | LDCC68,1.0SQ | RECTANGULAR | FLATPACK | 5 V | 无 | Transferred | 康讯系统 | e0 | 无 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 不合格 | COMMERCIAL | 119 mA | 9 Mbps | 2.3 mm | MODEM-DATA/FAX/VOICE | 9.6 kbps | 20 mm | 14 mm | |||||||||||||||
![]() | TXC-03108AIBG | Tri-Star Electronics International | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MH88634T-2 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 21 | Transferred | MICROSEMI CORP | 70 °C | PLASTIC/EPOXY | SIP21H,.6 | 5 V | 无 | 8542.39.00.01 | SINGLE | 2.54 mm | unknown | 不合格 | COMMERCIAL | 13 mA | -5 V | ||||||||||||||||||||||||||||||||
![]() | MH88634T-2 | Zarlink Semiconductor Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 21 | 5 V | 无 | Obsolete | ZARLINK SEMICONDUCTOR INC | , SIP21H,.6 | 70 °C | PLASTIC/EPOXY | SIP21H,.6 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | SINGLE | 2.54 mm | unknown | 不合格 | COMMERCIAL | 0.013 mA | -5 V | |||||||||||||||||||||||||||||
![]() | PEB3035NV1.1 | Siemens | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | RECTANGULAR | CHIP CARRIER | 5 V | Transferred | 西门子 A G | QLCC | , | 85 °C | PLASTIC/EPOXY | 8542.39.00.01 | QUAD | J BEND | 1 | unknown | 28 | R-PQCC-J28 | 不合格 | OTHER | 电信电路 | ||||||||||||||||||||||||||||
![]() | PBL38541/1N | Ericsson | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 18 | RECTANGULAR | DIP | PLASTIC/EPOXY | -40 °C | 70 °C | 1 | DIP, | DIP | 爱立信电源模块 | Obsolete | 无 | 2.2 V | IN-LINE | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 18 | R-PDIP-T18 | 不合格 | OTHER | 5.33 mm | 电话语音电路 | 22.48 mm | 7.62 mm | ||||||||||||||||||||
![]() | HT9312B | Holtek Semiconductor Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 22 | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP22(UNSPEC) | RECTANGULAR | IN-LINE | 无 | Obsolete | HOLTEK SEMICONDUCTOR INC | DIP, DIP22(UNSPEC) | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | unknown | R-PDIP-T22 | 不合格 | COMMERCIAL | 2 mA | 3.58 MHz | |||||||||||||||||||||||||
![]() | SIW1711FIF | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | Obsolete | RF MICRO DEVICES INC | DFN | HVQCCN, | MLF | 1 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.8 V | 无 | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | unknown | 32 | S-XQCC-N32 | 不合格 | INDUSTRIAL | 0.9 mm | 电信电路 | 5 mm | 5 mm | |||||||||||||||||||
![]() | NE5750N | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | RECTANGULAR | IN-LINE | 5 V | Obsolete | NXP SEMICONDUCTORS | DIP, | 70 °C | PLASTIC/EPOXY | DIP | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | unknown | R-PDIP-T24 | 不合格 | COMMERCIAL | 电信电路 | |||||||||||||||||||||||||||||
![]() | NE5750N | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | 70 °C | PLASTIC/EPOXY | DIP | DIP24,.3 | RECTANGULAR | IN-LINE | 5 V | 无 | Transferred | 飞利浦半导体 | DIP, DIP24,.3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | 不合格 | COMMERCIAL | 12 mA | |||||||||||||||||||||||||
![]() | AD614BS | Stanley Engineered Fastening | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 |
ZL70123MNG7
Microsemi Corporation
分类:Interface - Telecom
OQ2541HPB-S
Philips Semiconductors
分类:Interface - Telecom
AM7943-1JC
AMD
分类:Interface - Telecom
TISP61CAP3P
JW Miller
分类:Interface - Telecom
RFFC5071SQ
RF Micro Devices Inc
分类:Interface - Telecom
RFG1M20090
RF Micro Devices Inc
分类:Interface - Telecom
FX-500-LAC-GNJ-A3-E7
Vectron International
分类:Interface - Telecom
HM9113A
Hualon Microelectronics Corp
分类:Interface - Telecom
RCV56ACF/SP
Rockwell Automation
分类:Interface - Telecom
QET-5100M-0-LGA78B-TR-03-0
Qualcomm
分类:Interface - Telecom
IDT82V3355TF
Integrated Device Technology Inc
分类:Interface - Telecom
SY8702AABC
Silergy Corporation
分类:Interface - Telecom
SA1620BE
Philips Semiconductors
分类:Interface - Telecom
BCM3022KPF
Broadcom Limited
分类:Interface - Telecom
RFX96V12
Conexant Systems Inc
分类:Interface - Telecom
TXC-03108AIBG
Tri-Star Electronics International
分类:Interface - Telecom
MH88634T-2
Microsemi Corporation
分类:Interface - Telecom
MH88634T-2
Zarlink Semiconductor Inc
分类:Interface - Telecom
PEB3035NV1.1
Siemens
分类:Interface - Telecom
PBL38541/1N
Ericsson
分类:Interface - Telecom
HT9312B
Holtek Semiconductor Inc
分类:Interface - Telecom
SIW1711FIF
RF Micro Devices Inc
分类:Interface - Telecom
NE5750N
NXP Semiconductors
分类:Interface - Telecom
NE5750N
Philips Semiconductors
分类:Interface - Telecom
AD614BS
Stanley Engineered Fastening
分类:Interface - Telecom
