类别是'category.电信接口IC' (8324)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 电源电流-最大值 | 座位高度-最大 | 筛选水平 | 通信IC类型 | 收发器数量 | 负电源电压 | 电池供电 | PSRR-Min | 混合动力车 | 电池供电 | 马克斯噪音 | 长度 | 宽度 | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | MC14409L | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | 85 °C | -40 °C | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 无 | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | DIP, DIP16,.3 | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T16 | 不合格 | INDUSTRIAL | |||||||||||||||||||||||||
![]() | T83-A150X | TDK Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 3 | 特殊形状 | 活跃 | TDK CORP | , | 90 °C | -40 °C | UNSPECIFIED | ROUND | 8542.39.00.01 | UNSPECIFIED | WIRE | 1 | unknown | O-XXSS-W3 | INDUSTRIAL | GAS DISCHARGE TUBE SUPPRESSOR | |||||||||||||||||||||||||||||
![]() | SC8206A4 | Hangzhou Silan Microelectronics CO LTD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 18 | DIP, DIP18,.3 | 70 °C | -10 °C | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | 5 V | 有 | 接触制造商 | HANGZHOU SILAN MICROELECTRONICS CO LTD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | R-PDIP-T18 | 不合格 | COMMERCIAL | 电信电路 | ||||||||||||||||||||||||
![]() | TJA1028TK/3V3/20 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | HVSON, | 150 °C | -40 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.12,25 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 12 V | 活跃 | NXP SEMICONDUCTORS | SON | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.65 mm | unknown | 8 | S-PDSO-N8 | 1 mm | AEC-Q100 | LIN TRANSCEIVER | 1 | 3 mm | 3 mm | |||||||||||||||||||
![]() | RF6539 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | RF MICRO DEVICES INC | QFN | QCCN, | 3 | 70 °C | -30 °C | UNSPECIFIED | QCCN | RECTANGULAR | CHIP CARRIER | 3.6 V | 有 | Transferred | 有 | 5A991.G | 8542.39.00.01 | QUAD | 无铅 | 1 | compliant | 28 | R-XQCC-N28 | 不合格 | OTHER | 1.215 mm | 电信电路 | 5.5 mm | 5 mm | |||||||||||||||||
![]() | SIW3500DIF1 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 94 | DIE | VFBGA, | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.8 V | 有 | Obsolete | RF MICRO DEVICES INC | e2 | 锡银 | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 94 | S-PBGA-B94 | 不合格 | INDUSTRIAL | 0.415 mm | 电信电路 | 3.7 mm | 3.7 mm | ||||||||||||||||||
![]() | SC14428F4M80VDN | Sitel Semiconductor BV | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | ITCZDEE9P-OL2-146-AB | ITT Interconnect Solutions | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | S2021A | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 225 | PGA | BGA, HPGA224,18X18 | 70 °C | CERAMIC, METAL-SEALED COFIRED | BGA | HPGA224,18X18 | SQUARE | 网格排列 | 5 V | 无 | Obsolete | APPLIED MICRO CIRCUITS CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 | 2.54 mm | unknown | 225 | S-CBGA-B225 | 不合格 | COMMERCIAL | 429 mA | 10.4648 mm | 电信电路 | -5.2 V | 47.244 mm | 47.244 mm | |||||||||||||||
![]() | SC41344DW | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | 小概要 | 无 | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | SOP, SOP16,.4 | e0 | Tin/Lead (Sn/Pb) | DUAL | 鸥翼 | 1.27 mm | unknown | R-PDSO-G16 | 不合格 | 2.8/10 V | INDUSTRIAL | 电信电路 | |||||||||||||||||||||||
![]() | TLV32037I | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | TCP-3047H-DT | onsemi | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 12 | 567KE | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 有 | Obsolete | ON SEMICONDUCTOR | VFBGA, | 有 | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | R-PBGA-B12 | OTHER | 0.611 mm | 电信电路 | 1.179 mm | 0.722 mm | ||||||||||||||||||||||
![]() | MM1513 | Mitsumi Electric Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 6 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | 接触制造商 | MITSUMI ELECTRIC CO LTD | SOT | LSSOP, | PLASTIC/EPOXY | LSSOP | RECTANGULAR | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 0.95 mm | unknown | 6 | R-PDSO-G6 | 不合格 | 1.4 mm | 电信电路 | 2.9 mm | 1.6 mm | ||||||||||||||||||||||||
![]() | BCM43794B0IFFBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | TXC-03108AIBG | Transwitch Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | BGA256,20X20,50 | BGA | PLASTIC/EPOXY | -40 °C | 85 °C | BGA, BGA256,20X20,50 | BGA | TRANSWITCH CORP | Obsolete | 3.3 V | 网格排列 | SQUARE | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | unknown | 256 | S-PBGA-B256 | 不合格 | INDUSTRIAL | 140 mA | 2.32 mm | FRAMER | 27 mm | 27 mm | ||||||||||||||||||
![]() | PM-8005-0-72WLPSP-TR-02-0 | Qualcomm | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | TH72035KLD | Melexis Microelectronic Integrated Systems | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 10 | SON, SOLCC10,.12,20 | 125 °C | -40 °C | PLASTIC/EPOXY | SON | SOLCC10,.12,20 | RECTANGULAR | 小概要 | 3 V | 有 | Obsolete | MELEXIS N V | e3 | Matte Tin (Sn) | 8542.39.00.01 | DUAL | 无铅 | 0.5 mm | compliant | R-PDSO-N10 | 不合格 | AUTOMOTIVE | 17.3 mA | ||||||||||||||||||||||
![]() | PBL3726/6 | Ericsson | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | UM6551 | United Microelectronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Transferred | UNITED MICROELECTRONICS CORP (USA) | , | unknown | |||||||||||||||||||||||||||||||||||||||||||
![]() | AM7947PC | AMD | 数据表 | 277 In Stock | - | 最小起订量: 1 最小包装量: 1 | NO | 28 | DIP | DIP, DIP28,.6 | 70 °C | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | ADVANCED MICRO DEVICES INC | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 28 | R-PDIP-T28 | 不合格 | COMMERCIAL | 8.5 mA | 5.715 mm | SLIC | -5 V | CONSTANT CURRENT | 28 dB | 2-4 CONVERSION | -38.9 TO -58 V | 14 dBrnC | 37.084 mm | 15.24 mm | ||||||||||
![]() | LXT380BE | Inphi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 160 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 3.3 V | Transferred | INPHI CORP | BGA, | 85 °C | -40 °C | 8542.39.00.01 | BOTTOM | BALL | 1 | 1 mm | compliant | S-PBGA-B160 | 不合格 | INDUSTRIAL | 1.8 mm | pcm收发器 | 15 mm | 15 mm | ||||||||||||||||||||||
![]() | LXT380BE | Cortina Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 160 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 3.3 V | CORTINA SYSTEMS INC | Transferred | BGA | BGA, | 85 °C | -40 °C | 8542.39.00.01 | BOTTOM | BALL | 1 | 1 mm | compliant | 160 | S-PBGA-B160 | 不合格 | INDUSTRIAL | 1.8 mm | pcm收发器 | 15 mm | 15 mm | ||||||||||||||||||||
![]() | T5551-PAE | Atmel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 2 | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | MODULE,12LEAD,1.2 | RECTANGULAR | 微电子组件 | 无 | Obsolete | ATMEL CORP | , MODULE,12LEAD,1.2 | 无 | 8542.39.00.01 | DUAL | UNSPECIFIED | 1 | compliant | R-PDMA-X2 | 不合格 | INDUSTRIAL | 电信电路 | ||||||||||||||||||||||||
![]() | T5551-PAE | Temic Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | -40 °C | Transferred | TEMIC SEMICONDUCTORS | 85 °C | 1 | unknown | 不合格 | INDUSTRIAL | 电信电路 | ||||||||||||||||||||||||||||||||||||||
![]() | TEA1083A | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | DIP, DIP16,.3 | 70 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 3.6 V | 无 | Transferred | 飞利浦半导体 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | OTHER | 4 mA |
MC14409L
Freescale Semiconductor
分类:Interface - Telecom
T83-A150X
TDK Corporation
分类:Interface - Telecom
SC8206A4
Hangzhou Silan Microelectronics CO LTD
分类:Interface - Telecom
TJA1028TK/3V3/20
NXP Semiconductors
分类:Interface - Telecom
RF6539
RF Micro Devices Inc
分类:Interface - Telecom
SIW3500DIF1
RF Micro Devices Inc
分类:Interface - Telecom
SC14428F4M80VDN
Sitel Semiconductor BV
分类:Interface - Telecom
ITCZDEE9P-OL2-146-AB
ITT Interconnect Solutions
分类:Interface - Telecom
S2021A
Applied Micro Circuits Corporation
分类:Interface - Telecom
SC41344DW
Freescale Semiconductor
分类:Interface - Telecom
TLV32037I
Texas Instruments
分类:Interface - Telecom
TCP-3047H-DT
onsemi
分类:Interface - Telecom
MM1513
Mitsumi Electric Co Ltd
分类:Interface - Telecom
BCM43794B0IFFBG
Broadcom Limited
分类:Interface - Telecom
TXC-03108AIBG
Transwitch Corporation
分类:Interface - Telecom
PM-8005-0-72WLPSP-TR-02-0
Qualcomm
分类:Interface - Telecom
TH72035KLD
Melexis Microelectronic Integrated Systems
分类:Interface - Telecom
PBL3726/6
Ericsson
分类:Interface - Telecom
UM6551
United Microelectronics Corporation
分类:Interface - Telecom
AM7947PC
AMD
分类:Interface - Telecom
LXT380BE
Inphi Corporation
分类:Interface - Telecom
LXT380BE
Cortina Systems Inc
分类:Interface - Telecom
T5551-PAE
Atmel Corporation
分类:Interface - Telecom
T5551-PAE
Temic Semiconductors
分类:Interface - Telecom
TEA1083A
Philips Semiconductors
分类:Interface - Telecom
