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类别是'category.电信接口IC' (8324)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 功能 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 界面 | 电路数量 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 端口的数量 | 电源电流 | 最大电源电流 | 电流源 | 数据率 | 通信IC类型 | 负电源电压 | 电池供电 | 混合动力车 | 电池供电 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | LE88536PQC | Microchip Technology | 数据表 | 6537 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 48-QFN | Tray | Obsolete | 3 (168 Hours) | 3.3V~35V | 电池开关 | 4-Wire Serial | 2 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MT9044AL1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 44-QFP | 44 | -40°C~85°C | Tube | 2006 | e3 | yes | Obsolete | 3 (168 Hours) | 44 | 哑光锡 | 4.5V~5.5V | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 30 | 数字锁相环 | 1 | 90mA | 90mA | 2.048 Mbps | 电信电路 | 2.45mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| ZL50211GBG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 535-BGA | 535 | -40°C~85°C | Tray | 2004 | e1 | yes | Obsolete | 3 (168 Hours) | 535 | 锡银铜 | 1.6V~2V | BOTTOM | BALL | 1.8V | 回声消除 | 1.8V | 1 | 10mA | ISDN回音消除器 | 2.36mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
| BCM56440TB0KFSBLG | Broadcom Limited | 数据表 | 1000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | 活跃 | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PM5308-FGI | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | 1 (Unlimited) | 1.2V | SONET/SDH | JTAG, Microprocessor, Parallel, Serial | 1 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI32391-B-GM1R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | 2014 | ProSLIC® | 活跃 | 3 (168 Hours) | 3.15V~3.45V | Subscriber Line Interface Concept (SLIC) | 1 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
 | LE7942B-2DJCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | 32-PLCC (11.43x13.97) | 0°C~70°C | Tape & Reel (TR) | 2017 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 4.75V~5.25V | Subscriber Line Interface Concept (SLIC) | 5V | 2-Wire | 1 | 4.75V | 6.3mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | MT8979AE1 | Microchip Technology | 数据表 | 21 In Stock | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 通孔 | 28-DIP (0.600, 15.24mm) | 28 | -40°C~85°C | Tube | 2006 | e3 | yes | Obsolete | 1 (Unlimited) | 28 | 哑光锡 | 4.5V~5.5V | DUAL | 5V | 2.54mm | 收发器 | PCM | 1 | 8mA | 16mA | 2.048 Mbps | FRAMER | 6.35mm | 37.4mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
 | SI3019-F-KS | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 16-SOIC (0.154, 3.90mm Width) | 16 | 189.403164mg | 0°C~70°C | Tube | 1999 | Obsolete | 1 (Unlimited) | 16 | 3V~3.6V | DUAL | 鸥翼 | 3.3V | SI3019 | Direct Access Arrangement (DAA) | 不合格 | 3.3V | GCI, PCM, SPI | 1 | 8.5mA | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||
 | ZL50057GAC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 272-BBGA | 272 | -40°C~85°C | Tray | 2007 | e0 | no | Obsolete | 1 (Unlimited) | 272 | 锡铅 | 8542.39.00.01 | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | 1.27mm | 30 | ZL50057 | Switch | 不合格 | 1.83.3V | 240mA | 48 | 2.54mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | ZL50019GAC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-BGA | 256 | -40°C~85°C | Tray | e0 | no | Obsolete | 1 (Unlimited) | 256 | 锡铅 | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | 30 | ZL50019 | Switch | 不合格 | 1 | 165mA | 32 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | ZL50020GAC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-BGA | 256 | -40°C~85°C | Tray | e0 | no | Obsolete | 1 (Unlimited) | 256 | 锡铅 | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | 30 | ZL50020 | Switch | 不合格 | 1 | 120mA | 32 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | LE79489-3DJCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | 32-PLCC (11.43x13.97) | -40°C~85°C | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | 85°C | -40°C | 4.75V~5.25V | Subscriber Line Interface Concept (SLIC) | 5V | 2-Wire | 1 | 4.75V | 6.3mA | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | LE79489-2DJCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | -40°C~85°C | Tape & Reel (TR) | e3 | Obsolete | 3 (168 Hours) | 32 | 哑光锡 | 4.75V~5.25V | QUAD | J BEND | 5V | Subscriber Line Interface Concept (SLIC) | 不合格 | 5V | 2-Wire | 1 | 6.3mA | 3.556mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
| ZL50061GAG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 272-BBGA | 272 | -40°C~85°C | Tray | e0 | no | Obsolete | 3 (168 Hours) | 272 | 锡铅 | 1.71V~1.89V | BOTTOM | BALL | 220 | 1.8V | 30 | ZL50061 | Switch | 不合格 | 1 | 240mA | 32 | 2.54mm | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | ZL50022GAC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-BGA | 256 | -40°C~85°C | Tray | e0 | no | Obsolete | 1 (Unlimited) | 256 | 锡铅 | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | 30 | ZL50022 | Switch | 不合格 | 1 | 175mA | 32 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | XRT83D10IW-F | Exar Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 28 | 350mW | 85°C | -40°C | 5V | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | CPC1466DTR | IXYS Integrated Circuits Division | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16-SOIC | 665.986997mg | -40°C~85°C | Tape & Reel (TR) | 2010 | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1W | 直流信号终端 | 35V | 1 | 39V | 30V | 1.5μA | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | SI32280-A-GM | Silicon Labs | 数据表 | 10 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tray | ProSLIC® | yes | 活跃 | 3 (168 Hours) | 3.3V | 3-Wire, PCM | 2 | 数码单反 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| BCM56541XB0KFSBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 活跃 | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ZL50050GAC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 196-BGA | 196 | 196-PBGA (15x15) | -40°C~85°C | Tray | Obsolete | 1 (Unlimited) | 85°C | -40°C | 1.71V~1.89V | ZL50050 | Switch | 1 | 240mA | 32 | 240mA | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
| ZL50023GAC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-BGA | 256 | -40°C~85°C | Tray | e0 | no | Obsolete | 1 (Unlimited) | 256 | 锡铅 | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | 0.4mm | 30 | ZL50023 | Switch | 不合格 | 1 | 130mA | 32 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
 | HC5513BIM | Intersil (Renesas Electronics America) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | DIP | 1.5W | 2000 | e0 | 1 (Unlimited) | 28 | Tin/Lead (Sn/Pb) | 85°C | -40°C | QUAD | J BEND | 225 | 1 | 5V | 未说明 | S-PQCC-J28 | 不合格 | +-5V | INDUSTRIAL | 1 | 2.25mA | SLIC | -5V | CONSTANT CURRENT | 2-4 CONVERSION | -28 V | 4.57mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| ZL50021QCG1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 256-LQFP | -40°C~85°C | Tray | e3 | 活跃 | 3 (168 Hours) | 256 | 哑光锡 | 1.71V~1.89V | QUAD | 鸥翼 | 1.8V | 0.4mm | ZL50021 | S-PQFP-G256 | Switch | 1 | 1.75mA | 32 | 28mm | 28mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
| BCM11198KFBG | Broadcom Limited | 数据表 | 152 In Stock | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | 活跃 | 1 (Unlimited) | ROHS3 Compliant |
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LE88536PQC
Microchip Technology
分类:Interface - Telecom
-
MT9044AL1
Microchip Technology
分类:Interface - Telecom
-
ZL50211GBG2
Microchip Technology
分类:Interface - Telecom
-
BCM56440TB0KFSBLG
Broadcom Limited
分类:Interface - Telecom
-
PM5308-FGI
Microchip Technology
分类:Interface - Telecom
-
SI32391-B-GM1R
Silicon Labs
分类:Interface - Telecom
-
LE7942B-2DJCT
Microchip Technology
分类:Interface - Telecom
-
MT8979AE1
Microchip Technology
分类:Interface - Telecom
-
SI3019-F-KS
Silicon Labs
分类:Interface - Telecom
-
ZL50057GAC
Microchip Technology
分类:Interface - Telecom
-
ZL50019GAC
Microchip Technology
分类:Interface - Telecom
-
ZL50020GAC
Microchip Technology
分类:Interface - Telecom
-
LE79489-3DJCT
Microchip Technology
分类:Interface - Telecom
-
LE79489-2DJCT
Microchip Technology
分类:Interface - Telecom
-
ZL50061GAG
Microchip Technology
分类:Interface - Telecom
-
ZL50022GAC
Microchip Technology
分类:Interface - Telecom
-
XRT83D10IW-F
Exar Corporation
分类:Interface - Telecom
-
CPC1466DTR
IXYS Integrated Circuits Division
分类:Interface - Telecom
-
SI32280-A-GM
Silicon Labs
分类:Interface - Telecom
-
BCM56541XB0KFSBG
Broadcom Limited
分类:Interface - Telecom
-
ZL50050GAC
Microchip Technology
分类:Interface - Telecom
-
ZL50023GAC
Microchip Technology
分类:Interface - Telecom
-
HC5513BIM
Intersil (Renesas Electronics America)
分类:Interface - Telecom
-
ZL50021QCG1
Microchip Technology
分类:Interface - Telecom
-
BCM11198KFBG
Broadcom Limited
分类:Interface - Telecom