N/A

-

N/A

-

N/A

-

Microsemi Corporation

活跃

MICROSEMI CORP

5.6

,

LE79114KVCT

8542.31.00.01

compliant

DIGITAL SIGNAL PROCESSOR, OTHER

N/A

-

表面贴装

68-VFQFN Exposed Pad

68-QFN (8x8)

Skyworks Solutions Inc.

活跃

Tape & Reel (TR)

0°C ~ 70°C

ProSLIC®

3.13V ~ 3.47V

Subscriber Line Interface Concept (SLIC)

3-Wire, PCM, SPI

2

51.71mA

N/A

-

表面贴装

68-VFQFN Exposed Pad

68-QFN (8x8)

Skyworks Solutions Inc.

Tray

活跃

-40°C ~ 85°C

ProSLIC®

3.13V ~ 3.47V

Subscriber Line Interface Concept (SLIC)

3-Wire, PCM, SPI

2

51.71mA

N/A

-

表面贴装

20-VFQFN Exposed Pad

20-QFN (3x3)

Skyworks Solutions Inc.

Tray

SI3019

Obsolete

-40°C ~ 85°C

-

3V ~ 3.6V

Direct Access Arrangement (DAA)

GCI, PCM, SPI

1

8.5mA

N/A

-

表面贴装

表面贴装

256-BGA

256

256-BGA (27x27)

Analog Devices Inc./Maxim Integrated

DS21Q352

Obsolete

Compliant

Tray

-

Bulk

-

3.3V

收发器

3.3 V

4

T1

4

-

收发器

4

含铅

N/A

-

YES

32

3.135 V

85 °C

有

LE87213AFQCT

GENERAL PURPOSE

HVQCCN

SQUARE

Zarlink Semiconductor Inc

Transferred

ZARLINK SEMICONDUCTOR INC

3.465 V

5.68

HVQCCN, LCC32,.32SQ,32

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

UNSPECIFIED

LCC32,.32SQ,32

-40 °C

3.3 V

EAR99

8542.39.00.01

线路驱动器或接收器

BIPOLAR

QUAD

无铅

2

0.8 mm

unknown

S-XQCC-N32

不合格

3.3 V

INDUSTRIAL

1 mm

YES

DIFFERENTIAL

LINE DRIVER

2

0.0001 A

8 mm

8 mm

N/A

-

YES

16

LE75181BBSCT

SOP

RECTANGULAR

Zarlink Semiconductor Inc

Transferred

ZARLINK SEMICONDUCTOR INC

5.6

SOP, SOP16,.4

小概要

PLASTIC/EPOXY

SOP16,.4

-40 °C

5 V

85 °C

有

8542.39.00.01

电话回路

DUAL

鸥翼

1

1.27 mm

unknown

R-PDSO-G16

不合格

5 V

INDUSTRIAL

0.0021 mA

2.65 mm

电信电路

10.31 mm

7.5 mm

N/A

-

N/A

-

表面贴装

8-SOIC (0.154, 3.90mm Width)

8-SOIC

National Semiconductor

活跃

Bulk

0°C ~ 70°C

-

1.1 W

4.75V ~ 9V

音频解码器

-

1

12mA

N/A

-

-

-

-

Broadcom Limited

84

Broadcom Limited

Broadcom / Avago

Details

Tray

活跃

-

-

Wireless & RF Integrated Circuits

Si

-

Switch

-

-

RF System on a Chip - SoC

RF System on a Chip - SoC

N/A

-

表面贴装

16-SOIC (0.154, 3.90mm Width)

16-SOIC

Skyworks Solutions Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

SI3056

不用于新设计

0°C ~ 70°C

-

接口集成电路

3V ~ 3.6V

Direct Access Arrangement (DAA)

DSP, Serial

1

15mA

DAA - Direct Access Arrangements

电信接口集成电路

N/A

-

SIP-8

900 mVDC to 1.4 VDC

- 40 C

PCB 安装

+ 85 C

TS117

MOSFET

50 mA

3.302 mm

9.652 mm

6.35 mm

N/A

-

表面贴装

42-WFQFN Exposed Pad

42-QFN (5x7)

Skyworks Solutions Inc.

Tray

SI32177

活跃

0°C ~ 70°C

ProSLIC®

3.3V

Subscriber Line Interface Concept (SLIC), CODEC

GCI, PCM, SPI

1

-

N/A

-

SOIC-16

100 V

1 W

SMD/SMT

ITC117

Optocouplers

Phototransistor, MOSFET

晶体管输出光耦合器

N/A

-

N/A

-

SOIC-16

900 mVDC to 1.4 VDC

PCB 安装

IAB110

MOSFET

50 mA

2.108 mm

10.16 mm

7.493 mm

N/A

-

SOIC-28

+ 110 C

- 40 C

110 Ohms

SMD/SMT

5 V

-

10 Switch

线路卡接入交换机

N/A

-

SOIC-32

SMD/SMT

CPC5622

接口集成电路

电信接口集成电路

N/A

-

SMD DIP-8

900 mVDC to 1.4 VDC

- 40 C

PCB 安装

+ 85 C

TS117

MOSFET

50 mA

3.302 mm

9.652 mm

6.35 mm

N/A

-

表面贴装

196-LBGA

196-FBGA (15x15)

Infineon Technologies

Tray

CYP15G0201

最后一次购买

0°C ~ 70°C

HOTlink II™

3.135V ~ 3.465V

收发器

LVTTL

2

570mA

N/A

-

表面贴装

196-LBGA

196-FBGA (15x15)

Infineon Technologies

Tray

CYV15G0201

Obsolete

0°C ~ 70°C

HOTlink II™

3.135V ~ 3.465V

收发器

LVTTL

2

570mA

N/A

-

表面贴装

256-BGA Exposed Pad

256-L2BGA (27x27)

Infineon Technologies

Tray

CYV15G0404

Obsolete

0°C ~ 70°C

HOTlink II™

3.135V ~ 3.465V

Deserializer

LVTTL

4

900mA

N/A

-

表面贴装

49-LFBGA, CSPBGA

49-CSBGA (7x7)

Analog Devices Inc./Maxim Integrated

3.465 V

0 C

3.135 V

SMD/SMT

Tray

DS21348

活跃

+ 70 C

0°C ~ 70°C

Bulk

-

接口集成电路

3.135V ~ 3.465V

-

3.3 V

1 Channel

Serial

1

-

T1/E1/J1 Line Interface Units - LIUs

电信接口集成电路

含铅