N/A

-

Through Hole, Right Angle

--

--

--

--

--

--

--

Bulk

--

Obsolete

--

Solder

28

0.049 (1.25mm)

--

--

--

--

--

Contacts, Top

--

--

--

--

--

0.30mm

--

N/A

-

表面贴装

456-LFBGA

456-LFBGA (15x15)

Renesas Electronics America Inc

--

Tray

活跃

-40°C ~ 85°C (TA)

*

活跃

--

200MHz, 1.2GHz

ARM® Cortex®-A55, ARM® Cortex®-M33

1.8V, 3.3V

10/100/1000Mbps (2)

2 Core, 64-Bit

无

DDR3L, DDR4

USB 2.0 (2)

CANbus, eMMC/SD/SDIO, I²C, SPI, UART

ARM® Mali-G31

-

MIPI/CSI, MIPI/DSI

-

N/A

-

Intel

Non-Compliant

有

1

964082

Intel

Tray

Microprocessors - MPU

Microprocessors - MPU

Microprocessors - MPU

N/A

-

N/A

-

N/A

-

Details

有

1

999F0A

Intel

Intel

Tray

Embedded Processors & Controllers

1440

PCIe

64 Bit

CPU - Central Processing Units

CPU - Central Processing Units

N/A

-

表面贴装

4-SMD, No Lead

289-LFBGA (14x14)

Suntsu Electronics, Inc.

Bulk

活跃

32 kB

500 MHz

+ 105 C

- 40 C

SMD/SMT

32 kB

0°C ~ 70°C

SXT224

0.098 L x 0.079 W (2.50mm x 2.00mm)

兆赫晶体

50 MHz

±20ppm

50 Ohms

19pF

500MHz

Fundamental

ARM® Cortex®-A5

±20ppm

32 bit

1.2V, 1.35V, 1.5V, 1.8V, 3.3V

10/100Mbps (1)

1 Core, 32-Bit

有

DDR2, DDR3, DDR3L, LPDDR, LPDDR2, LPDDR3

USB (3)+ HSIC (3)

EBI/EMI, I²C, I²S, MMC/SD/SDIO, QSPI, SMC, SPI, UART, USART

Multimedia; NEON™ MPE

1 Core

AES, ARM TZ, Boot Security, Cryptography, Secure JTAG, Secure Memory, Secure RTC, SHA, TDES, TRNG

LCD, Touchscreen

-

0.026 (0.65mm)

-

N/A

-

N/A

-

表面贴装

480-LBGA Exposed Pad

480-TBGA (37.5x37.5)

飞思卡尔半导体

Bulk

MPC82

活跃

-40°C ~ 105°C (TA)

MPC82xx

266MHz

PowerPC G2

3.3V

10/100Mbps (3)

1 Core, 32-Bit

无

DRAM, SDRAM

-

I²C, SCC, SMC, SPI, UART, USART

Communications; RISC CPM

-

-

-

N/A

-

飞思卡尔半导体

Bulk

活跃

*

3 In Stock

-

表面贴装

740-LBGA

740-TBGA (37.5x37.5)

飞思卡尔半导体

Bulk

活跃

-40°C ~ 105°C (TA)

MPC83xx

400MHz

PowerPC e300

1.8V, 2.5V, 3.3V

10/100/1000Mbps (1)

1 Core, 32-Bit

无

DDR, DDR2

USB 1.x (1)

DUART, HDLC, I²C, PCI, SPI, UART

Communications; QUICC Engine, Security; SEC

Cryptography, Random Number Generator

-

-

N/A

-

表面贴装

Axial

Axial

飞思卡尔半导体

Tray

Obsolete

-65°C ~ 175°C

Tape & Reel (TR)

Military, MIL-PRF-55182/07, RNC50

0.070 Dia x 0.150 L (1.78mm x 3.81mm)

±1%

活跃

2

±25ppm/°C

715 Ohms

Metal Film

0.1W, 1/10W

S (0.001%)

267MHz

PowerPC e300c3

1.8V, 2.5V, 3.3V

10/100/1000Mbps (2)

1 Core, 32-Bit

无

DDR, DDR2

USB 2.0 + PHY (1)

DUART, HSSI, I²C, PCI, SPI

-

-

-

-

Military, Moisture Resistant, Weldable

--

N/A

-

表面贴装

Axial

Axial

飞思卡尔半导体

Tray

Obsolete

-65°C ~ 175°C

Tape & Reel (TR)

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.5%

活跃

2

±25ppm/°C

43.2 kOhms

Metal Film

0.125W, 1/8W

S (0.001%)

1.333GHz

PowerPC e500

1.8V, 2.5V, 3.3V

10/100/1000Mbps (4)

1 Core, 32-Bit

无

DDR, DDR2, SDRAM

-

DUART, I²C, PCI, RapidIO

Signal Processing; SPE

-

-

-

Military, Moisture Resistant, Weldable

--

N/A

-

FCLGA-1151

DDR4-2666

8 GT/s

80 W

有

3.4 GHz

E-2226GE

Revision 3.0

1 Configuration

12 MB

1

SMD/SMT

2 Channel

咖啡湖

999LMM

Intel

Intel

1x16, 2x8, 1x8 + 2x4

Xeon

3 Display

Embedded

Details

E-2226GE

Embedded Processors & Controllers

1151

PCIe

128 GB

英特尔转强

64 Bit

CPU - Central Processing Units

6 Core

Embedded Processors

CPU - Central Processing Units

N/A

-

有

AEC-Q100

This product may require additional documentation to export from the United States.

60

935382429557

NXP

恩智浦半导体

Details

-40 to 105 °C

Tray

LS1043A

Microprocessors - MPU

9, 32 V

LPUART/PCIe/Serial I

64 Bit

Microprocessors - MPU

Microprocessors - MPU

N/A

-

表面贴装

196-LFBGA

196-LFBGA (12x12)

Renesas Electronics America Inc

Tray

活跃

-40°C ~ 110°C (TJ)

RZ/N1S

125MHz, 500MHz

ARM® Cortex®-A7, ARM® Cortex®-M4

1.5V, 1.8V, 2.5V, 3.3V

10/100/1000Mbps

2 Core, 32-Bit

无

DDR2, DDR3

USB 2.0 (2)

CANbus, eMMC/SD/SDIO, I²C, SPI, UART

-

LCD

-

N/A

-

N/A

-

N/A

-

1.2, 1.35 V

1440

PCIe

64 Bit

N/A

-

表面贴装

Axial

Axial

NXP USA Inc.

Bulk

活跃

450

935438202557

NXP

恩智浦半导体

Details

-65°C ~ 175°C

Bulk

Military, MIL-R-10509/8, RN50

0.065 Dia x 0.150 L (1.65mm x 3.81mm)

±1%

活跃

2

±50ppm/°C

71.5 kOhms

Metal Film

0.05W, 1/20W

Microcontrollers - MCU

--

1GHz

ARM® Cortex®-A53

ARM Microcontrollers - MCU

1V, 1.8V, 3.3V

GbE

2 Core, 32/64-Bit

无

DDR3, DDR3L, LPDDR2

-

I²C, SPI, PCI, UART

ARM® Cortex®-M4

AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG

APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU

-

Flame Retardant Coating, Military, Moisture Resistant, Safety

ARM Microcontrollers - MCU

--

46 In Stock

-

表面贴装

Axial

Axial

飞思卡尔半导体

Bulk

活跃

-65°C ~ 175°C

Bulk

Military, MIL-R-10509/7, RN55

0.090 Dia x 0.240 L (2.29mm x 6.10mm)

±1%

活跃

2

±25ppm/°C

205 kOhms

Metal Film

0.125W, 1/8W

--

1.2GHz

PowerPC e500v2

-

10/100/1000Mbps (3)

1 Core, 32-Bit

无

DDR2, DDR3

USB 2.0 + PHY (2)

DUART, I²C, MMC/SD, SPI

-

-

-

-

Flame Retardant Coating, Military, Moisture Resistant, Safety

--

N/A

-

表面贴装

Axial

Axial

飞思卡尔半导体

Tray

Obsolete

-65°C ~ 175°C

Bulk

Military, MIL-R-10509/1, RN60

0.145 Dia x 0.344 L (3.68mm x 8.74mm)

±1%

活跃

2

±50ppm/°C

64.9 Ohms

Metal Film

0.25W, 1/4W

--

1.0GHz

PowerPC e500

1.8V, 2.5V, 3.3V

10/100/1000Mbps (2)

1 Core, 32-Bit

无

DDR, DDR2, SDRAM

-

DUART, I²C, PCI

Signal Processing; SPE

-

-

-

Flame Retardant Coating, Military, Moisture Resistant, Safety

--

N/A

-

YES

416

416

IDT79RC32K438-200BBI

BGA

SQUARE

Integrated Device Technology Inc

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

5.92

BGA

Compliant

网格排列

PLASTIC/EPOXY

BGA416,26X26,40

-40 °C

85 °C

无

e0

Tin/Lead (Sn/Pb)

Microprocessors

BOTTOM

BALL

1 mm

unknown

416

S-PBGA-B416

不合格

1.2,2.5,3.3 V

INDUSTRIAL

200 MHz

MICROPROCESSOR, RISC

32

N/A

-

90

935407415557

NXP

恩智浦半导体

Tray

i.MX 8DualXPlus

Microprocessors - MPU

Microprocessors - MPU

Microprocessors - MPU

N/A

-