类别是'category.电信接口IC' (8324)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 操作模式 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 通信IC类型 | 过滤器 | 压缩法 | 负电源电压 | 传真率 | 长度 | 宽度 | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | TA31076F (TP1) | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | CM8870C | California Micro Devices | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 18 | DIP | DIP, DIP18,.3 | 70 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | CALIFORNIA MICRO DEVICES CORP | e0 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 18 | R-CDIP-T18 | 不合格 | COMMERCIAL | 7 mA | DTMF信号电路 | |||||||||||||||||||
![]() | R6653-20 | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | 5 V | Obsolete | 康讯系统 | QFP | QFP, | 70 °C | HALF DUPLEX; FULL DUPLEX | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.65 mm | unknown | 100 | R-PQFP-G100 | 不合格 | COMMERCIAL | 2 Mbps | 3.4 mm | MODEM-SUPPORT CIRCUIT | 20 mm | 14 mm | |||||||||||||||||||
![]() | RF6555 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | RF MICRO DEVICES INC | QCCN, | UNSPECIFIED | QCCN | SQUARE | CHIP CARRIER | Transferred | 8542.39.00.01 | QUAD | 无铅 | 1 | unknown | S-XQCC-N20 | 电信电路 | |||||||||||||||||||||||||||||||
![]() | R8071AG | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 68 | 5 V | CERAMIC | 70 °C | PGA, PGA68,11X11 | 康讯系统 | Transferred | 无 | PGA | PGA68,11X11 | SQUARE | 网格排列 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | compliant | S-XPGA-P68 | 不合格 | COMMERCIAL | ||||||||||||||||||||||||
![]() | PX1012AI-EL1/G | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 81 | NXP SEMICONDUCTORS | BGA | LFBGA, | SOT-643-1 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.2 V | 有 | Obsolete | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 81 | S-PBGA-B81 | 不合格 | INDUSTRIAL | 1.6 mm | 电路接口 | 9 mm | 9 mm | ||||||||||||||||
![]() | TH72015 | Melexis Microelectronic Integrated Systems | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 10 | 125 °C | -40 °C | UNSPECIFIED | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | Obsolete | MELEXIS N V | QFN | HVSON, | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.5 mm | compliant | 10 | S-XDSO-N10 | 不合格 | AUTOMOTIVE | 1 mm | 电信电路 | 3 mm | 3 mm | ||||||||||||||||||||
![]() | ATA8403C-6AQY | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | LEAD FREE, TSSOP-8 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3 V | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 0.65 mm | compliant | S-PDSO-G8 | 不合格 | INDUSTRIAL | 0.011 mA | 1.05 mm | 电信电路 | 3 mm | 3 mm | |||||||||||||||||||
![]() | MXL86282C-ABE-R | MaxLinear Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | SY8805DFC | Silergy Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | WM9712LSEFT/V | Cirrus Logic | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 3.3 V | Obsolete | CIRRUS LOGIC INC | TFQFP, | 85 °C | -25 °C | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.5 mm | compliant | S-PQFP-G48 | OTHER | SYNCHRONOUS | 1.2 mm | PCM 编解码器 | YES | 7 mm | 7 mm | |||||||||||||||||||||
![]() | AWT6321RM28P9 | ANADIGICS Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 14 | ANADIGICS INC | BCC | HQCCN, | 3 | 85 °C | -20 °C | UNSPECIFIED | HQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | 3.4 V | 有 | Transferred | 8542.39.00.01 | BOTTOM | 无铅 | 1 | 0.73 mm | unknown | 14 | R-XBCC-N14 | 不合格 | OTHER | 1.1 mm | 射频和基带电路 | 5 mm | 3 mm | ||||||||||||||||||
![]() | AWT6321RM28P9 | Coherent Thermal Solutions | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 14 | 3 X 5 MM, 1 MM HEIGHT, ROHS COMPLIANT, SMT-14 | 3 | 85 °C | -20 °C | UNSPECIFIED | HQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | 3.4 V | 有 | Transferred | II-VI INC | 8542.39.00.01 | BOTTOM | 无铅 | 1 | 0.73 mm | unknown | R-XBCC-N14 | 不合格 | OTHER | 1.1 mm | 射频和基带电路 | 5 mm | 3 mm | ||||||||||||||||||||
![]() | L7582HAE | Alcatel-Lucent | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC34115DW | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | 小概要 | 无 | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | SOP, SOP16,.4 | 70 °C | e0 | Tin/Lead (Sn/Pb) | DUAL | 鸥翼 | 1.27 mm | unknown | R-PDSO-G16 | 不合格 | 5,15 V | COMMERCIAL | 12 mA | ||||||||||||||||||||||||
![]() | ADSP-21MOD970-110 | Analog Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 304 | PLASTIC, BGA-304 | PLASTIC/EPOXY | BGA | BGA304,23X23,50 | SQUARE | 网格排列 | 3.3 V | 无 | Obsolete | ANALOG DEVICES INC | BGA | e0 | EAR99 | 锡铅 | 8542.31.00.01 | BOTTOM | BALL | 1 | 1.27 mm | unknown | 304 | S-PBGA-B304 | 不合格 | 56 Mbps | 2.54 mm | MODEM | 8 kbps | 31 mm | 31 mm | ||||||||||||||||
![]() | EP2C5 | Altera Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | 无 | Transferred | ALTERA CORP | 220 | compliant | |||||||||||||||||||||||||||||||||||||||||
![]() | EP2C5 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | INTEL CORP | , | compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | PBL3726/8 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 无 | Obsolete | STMICROELECTRONICS | 70 °C | -40 °C | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-PDIP-T16 | 不合格 | OTHER | 100 mA | ||||||||||||||||||||||||
![]() | SE2598L | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 活跃 | SKYWORKS SOLUTIONS INC | QFN | HVQCCN, | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | unknown | 16 | S-XQCC-N16 | INDUSTRIAL | 0.9 mm | 电信电路 | 3 mm | 3 mm | |||||||||||||||||||||
![]() | CMX639P6 | CML Microcircuits Plc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 22 | CML MICROCIRCUITS LTD | DIP | DIP-22 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP22,.4 | RECTANGULAR | IN-LINE | 3 V | 无 | Obsolete | e0 | 无 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | 22 | R-PDIP-T22 | 不合格 | INDUSTRIAL | SYNCHRONOUS | 0.00275 mA | 5.08 mm | CVSD CODEC | YES | CVSD | 27.685 mm | 10.16 mm | |||||||||||
![]() | PT8A991AP | Pericom Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | DIP | DIP24(UNSPEC) | RECTANGULAR | IN-LINE | 4 V | Transferred | PERICOM SEMICONDUCTOR CORP | DIP, DIP24(UNSPEC) | 70 °C | PLASTIC/EPOXY | EAR99 | 8542.39.00.01 | DUAL | THROUGH-HOLE | unknown | R-PDIP-T24 | 不合格 | COMMERCIAL | 电信电路 | ||||||||||||||||||||||||||
![]() | TP3040N | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | NATIONAL SEMICONDUCTOR CORP | DIP, | 70 °C | e0 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | COMMERCIAL | 6.4 mA | 5.08 mm | 电信电路 | -5 V | 21.755 mm | 7.62 mm | ||||||||||||||||||
![]() | VIKS816B | Delta Electronics Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | DELTA ELECTRONICS INC | compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | SI2457 | Silicon Laboratories Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Transferred | SILICON LABORATORIES INC | , | unknown |
TA31076F (TP1)
Toshiba America Electronic Components
分类:Interface - Telecom
CM8870C
California Micro Devices
分类:Interface - Telecom
R6653-20
Conexant Systems Inc
分类:Interface - Telecom
RF6555
RF Micro Devices Inc
分类:Interface - Telecom
R8071AG
Conexant Systems Inc
分类:Interface - Telecom
PX1012AI-EL1/G
NXP Semiconductors
分类:Interface - Telecom
TH72015
Melexis Microelectronic Integrated Systems
分类:Interface - Telecom
ATA8403C-6AQY
Microchip Technology Inc
分类:Interface - Telecom
MXL86282C-ABE-R
MaxLinear Inc
分类:Interface - Telecom
SY8805DFC
Silergy Corporation
分类:Interface - Telecom
WM9712LSEFT/V
Cirrus Logic
分类:Interface - Telecom
AWT6321RM28P9
ANADIGICS Inc
分类:Interface - Telecom
AWT6321RM28P9
Coherent Thermal Solutions
分类:Interface - Telecom
L7582HAE
Alcatel-Lucent
分类:Interface - Telecom
MC34115DW
Freescale Semiconductor
分类:Interface - Telecom
ADSP-21MOD970-110
Analog Devices Inc
分类:Interface - Telecom
EP2C5
Altera Corporation
分类:Interface - Telecom
EP2C5
Intel Corporation
分类:Interface - Telecom
PBL3726/8
STMicroelectronics
分类:Interface - Telecom
SE2598L
Skyworks Solutions Inc
分类:Interface - Telecom
CMX639P6
CML Microcircuits Plc
分类:Interface - Telecom
PT8A991AP
Pericom Semiconductor Corporation
分类:Interface - Telecom
TP3040N
Texas Instruments
分类:Interface - Telecom
VIKS816B
Delta Electronics Inc
分类:Interface - Telecom
SI2457
Silicon Laboratories Inc
分类:Interface - Telecom
