California Micro Devices CM8870C
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CM8870C
1604-CM8870C
接口 - 电信
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DTMF Signaling Circuit, CMOS, CDIP18, CERAMIC, DIP-18
1最小包装量--
CM8870C详情
California Micro Devices CM8870C重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
表面安装
NO
终端数量
18
Rohs Code
无
Part Life Cycle Code
Obsolete
Ihs Manufacturer
CALIFORNIA MICRO DEVICES CORP
Part Package Code
DIP
Package Description
DIP, DIP18,.3
Operating Temperature-Max
70 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Equivalence Code
DIP18,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Supply Voltage-Nom
5 V
JESD-609代码
e0
端子表面处理
锡铅
HTS代码
8542.39.00.01
端子位置
DUAL
终端形式
THROUGH-HOLE
功能数量
1
端子间距
2.54 mm
Reach合规守则
unknown
引脚数量
18
JESD-30代码
R-CDIP-T18
资历状况
不合格
温度等级
COMMERCIAL
电源电流-最大值
7 mA
通信IC类型
DTMF信号电路
CM8870C拓展信息
CML Microcircuits Plc
Microsemi Storage OTN and Networking Solutions
Netlogic Microsystems
Taiwan Microelectronics Technologies Inc
RDA Microelectronics
CML Microcircuits Plc
Hualon Microelectronics Corp
Microsemi Storage OTN and Networking Solutions
Microsemi Corporation
CML Microcircuits Plc








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